Conferences related to Mixed analog digital integrated circuits

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2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2020 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.


2020 IEEE International Solid- State Circuits Conference - (ISSCC)

ISSCC is the foremost global forum for solid-state circuits and systems-on-a-chip. The Conference offers 5 days of technical papers and educational events related to integrated circuits, including analog, digital, data converters, memory, RF, communications, imagers, medical and MEMS ICs.


2020 IEEE International Symposium on Circuits and Systems (ISCAS)

The International Symposium on Circuits and Systems (ISCAS) is the flagship conference of the IEEE Circuits and Systems (CAS) Society and the world’s premier networking and exchange forum for researchers in the highly active fields of theory, design and implementation of circuits and systems. ISCAS2020 focuses on the deployment of CASS knowledge towards Society Grand Challenges and highlights the strong foundation in methodology and the integration of multidisciplinary approaches which are the distinctive features of CAS contributions. The worldwide CAS community is exploiting such CASS knowledge to change the way in which devices and circuits are understood, optimized, and leveraged in a variety of systems and applications.


2020 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC)

All areas of ionizing radiation detection - detectors, signal processing, analysis of results, PET development, PET results, medical imaging using ionizing radiation


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Periodicals related to Mixed analog digital integrated circuits

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Circuits and Systems I: Regular Papers, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Communications Magazine, IEEE

IEEE Communications Magazine was the number three most-cited journal in telecommunications and the number eighteen cited journal in electrical and electronics engineering in 2004, according to the annual Journal Citation Report (2004 edition) published by the Institute for Scientific Information. Read more at http://www.ieee.org/products/citations.html. This magazine covers all areas of communications such as lightwave telecommunications, high-speed data communications, personal communications ...


Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.


Consumer Electronics, IEEE Transactions on

The design and manufacture of consumer electronics products, components, and related activities, particularly those used for entertainment, leisure, and educational purposes


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Most published Xplore authors for Mixed analog digital integrated circuits

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Xplore Articles related to Mixed analog digital integrated circuits

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IEE Colloquium on 'Linear Analogue Circuits and Systems' (Digest No.158)

IEE Colloquium on Linear Analogue Circuits and Systems, 1992

None


IEE Colloquium on 'SPICE: Surviving Problems in Circuit Evaluation' (Digest No.1993/154)

IEE Colloquium on SPICE: Surviving Problems in Circuit Evaluation, 1993

None


Substrate noise measurement by using noise-selective voltage comparators in analog and digital mixed-signal integrated circuits

IEEE Transactions on Instrumentation and Measurement, 1999

In mixed-signal integrated circuits (IC's), substrate noise produced by high- speed digital circuits passes to the on-chip analog circuits through the substrate and seriously degrades their performance. We have developed a method for measuring the substrate noise by using noise-selective chopper-type voltage comparators as noise detectors. This method can detect the wide-band substrate noise so we can analyze and further ...


Current sensor IC provides 9 bit+sign result without external sense resister

Proceedings of the IEEE 1998 Custom Integrated Circuits Conference (Cat. No.98CH36143), 1998

This paper describes a mixed signal integrated circuit for current measurement. Fabricated on a 1 /spl mu/m CMOS process, the IC employs a delta sigma analog to digital converter to generate a pulse-width modulated (PWM) output proportional to current. A metal loop stamped into the lead frame acts as a current sense resistor, providing a 5 mV full scale signal ...


Design-for-Test of Mixed-Signal Integrated Circuits

2006 49th IEEE International Midwest Symposium on Circuits and Systems, 2006

What to test and what does test need for a complex mixed-signal ASIC are the two main issues this tutorial will try to focus. It will account for several factors: Stimuli generation. An efficient test procedure would use a single signal especially a signal that is easily supplied to a selected input or generated on-chip. Sufficient access. It is preferable ...


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Educational Resources on Mixed analog digital integrated circuits

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IEEE-USA E-Books

  • IEE Colloquium on 'Linear Analogue Circuits and Systems' (Digest No.158)

    None

  • IEE Colloquium on 'SPICE: Surviving Problems in Circuit Evaluation' (Digest No.1993/154)

    None

  • Substrate noise measurement by using noise-selective voltage comparators in analog and digital mixed-signal integrated circuits

    In mixed-signal integrated circuits (IC's), substrate noise produced by high- speed digital circuits passes to the on-chip analog circuits through the substrate and seriously degrades their performance. We have developed a method for measuring the substrate noise by using noise-selective chopper-type voltage comparators as noise detectors. This method can detect the wide-band substrate noise so we can analyze and further reduce its effect. A switched capacitance is selectively loaded on the output of the inverter amplifier of the comparator during the comparison period in order to reduce the noise detected at the transition from compare to auto-zero. In contrast, the noise at the transition from auto-zero to compare can be selectively detected. Waveforms of high-frequency substrate noise were reconstructed by using this on-chip-noise detector incorporating the noise-selective comparators implemented using a 0.5-/spl mu/m CMOS bulk process.

  • Current sensor IC provides 9 bit+sign result without external sense resister

    This paper describes a mixed signal integrated circuit for current measurement. Fabricated on a 1 /spl mu/m CMOS process, the IC employs a delta sigma analog to digital converter to generate a pulse-width modulated (PWM) output proportional to current. A metal loop stamped into the lead frame acts as a current sense resistor, providing a 5 mV full scale signal at 1 amp sense current. The IC measures the sense voltage, corrects for the temperature coefficient in the metal loop, and creates a 9 bit accurate PWM output. This circuit consumes less than 120 /spl mu/A in operating mode and less than 3 /spl mu/A in sleep mode.

  • Design-for-Test of Mixed-Signal Integrated Circuits

    What to test and what does test need for a complex mixed-signal ASIC are the two main issues this tutorial will try to focus. It will account for several factors: Stimuli generation. An efficient test procedure would use a single signal especially a signal that is easily supplied to a selected input or generated on-chip. Sufficient access. It is preferable to have access to several internal nodes that the tester can read either sequentially or in parallel. Such access permits selection of convenient test points. Single test output. The output should contain all the information required to interpret test signals. Having the information digitally encoded would also reduce tester requirements. Simple measurement set. This set must contain sufficient information about the circuit under test's operational status. System-level decomposition. An efficient test procedure will employ a system-level strategy for decomposing the ASIC into meaningful parts. This decomposition permits testing of each part using a common procedure. These issues are worth attention for specific circuit classes, since there is no universal method valid for any kind of analog and/or mixed-signal function. These factors and their application for solving testing problems in general or for specific circuits will be presented and discussed. In particular, during the presentations making part of this tutorial, more attention will be paid to integrated filters (Switched-Capacitor and continuous-time), integrated A/D and D/A converters, and PLLs.

  • Design-for-Test of Mixed-Signal Integrated Circuits

    What to test and what does test need for a complex mixed-signal ASIC are the two main issues this tutorial will try to focus. It will account for several factors: Stimuli generation. An efficient test procedure would use a single signal especially a signal that is easily supplied to a selected input or generated on-chip. Sufficient access. It is preferable to have access to several internal nodes that the tester can read either sequentially or in parallel. Such access permits selection of convenient test points. Single test output. The output should contain all the information required to interpret test signals. Having the information digitally encoded would also reduce tester requirements. Simple measurement set. This set must contain sufficient information about the circuit under test's operational status. System-level decomposition. An efficient test procedure will employ a system-level strategy for decomposing the ASIC into meaningful parts. This decomposition permits testing of each part using a common procedure. These issues are worth attention for specific circuit classes, since there is no universal method valid for any kind of analog and/or mixed-signal function. These factors and their application for solving testing problems in general or for specific circuits will be presented and discussed. In particular, during the presentations making part of this tutorial, more attention will be paid to integrated filters (Switched-Capacitor and continuous-time), integrated A/D and D/A converters, and PLLs.

  • IEE Colloquium on Mixed-Signal AHDL/VHDL Modelling and Synthesis (Ref. No.1997/331)

    None

  • IEE Colloquium on 'Mixed Mode Modelling and Simulation' (Digest No.1994/205)

    None

  • IEE Colloquium on 'Mixed Signal VLSI Test' (Digest No.1993/240)

    None

  • IEE Colloquium on 'Circuits and Systems' (Digest No.1993/045)

    None



Standards related to Mixed analog digital integrated circuits

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Jobs related to Mixed analog digital integrated circuits

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