Conferences related to Microsensors

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2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


2020 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.


2020 IEEE International Instrumentation and Measurement Technology Conference (I2MTC)

The Conference focuses on all aspects of instrumentation and measurement science andtechnology research development and applications. The list of program topics includes but isnot limited to: Measurement Science & Education, Measurement Systems, Measurement DataAcquisition, Measurements of Physical Quantities, and Measurement Applications.


2020 IEEE International Symposium on Circuits and Systems (ISCAS)

The International Symposium on Circuits and Systems (ISCAS) is the flagship conference of the IEEE Circuits and Systems (CAS) Society and the world’s premier networking and exchange forum for researchers in the highly active fields of theory, design and implementation of circuits and systems. ISCAS2020 focuses on the deployment of CASS knowledge towards Society Grand Challenges and highlights the strong foundation in methodology and the integration of multidisciplinary approaches which are the distinctive features of CAS contributions. The worldwide CAS community is exploiting such CASS knowledge to change the way in which devices and circuits are understood, optimized, and leveraged in a variety of systems and applications.


2020 IEEE/MTT-S International Microwave Symposium (IMS)

The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2036 IEEE/MTT-S International Microwave Symposium - IMS 2036

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2031 IEEE/MTT-S International Microwave Symposium - IMS 2031

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2029 IEEE/MTT-S International Microwave Symposium - IMS 2029

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2026 IEEE/MTT-S International Microwave Symposium - IMS 2026

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2025 IEEE/MTT-S International Microwave Symposium - IMS 2025

    The IEEE International Microwave Symposium (IMS) is the world s foremost conferencecovering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies;encompassing everything from basic technologies to components to systems including thelatest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulationand more. The IMS includes technical and interactive sessions, exhibits, student competitions,panels, workshops, tutorials, and networking events.

  • 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2023 IEEE/MTT-S International Microwave Symposium - IMS 2023

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2022 IEEE/MTT-S International Microwave Symposium - IMS 2022

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2021 IEEE/MTT-S International Microwave Symposium - IMS 2021

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.

  • 2019 IEEE/MTT-S International Microwave Symposium - IMS 2019

    Comprehensive symposium on microwave theory and techniques including active and passive circuit components, theory and microwave systems.

  • 2018 IEEE/MTT-S International Microwave Symposium - IMS 2018

    Microwave theory and techniques, RF/microwave/millimeter-wave/terahertz circuit design and fabrication technology, radio/wireless communication.

  • 2017 IEEE/MTT-S International Microwave Symposium - IMS 2017

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.

  • 2016 IEEE/MTT-S International Microwave Symposium - IMS 2016

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2015 IEEE/MTT-S International Microwave Symposium - MTT 2015

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics. The IMS includes technical sessions, both oral and interactive, worksh

  • 2014 IEEE/MTT-S International Microwave Symposium - MTT 2014

    IMS2014 will cover developments in microwave technology from nano devices to system applications. Technical paper sessions, interactive forums, plenary and panel sessions, workshops, short courses, industrial exhibits, and a wide array of other technical activities will be offered.

  • 2013 IEEE/MTT-S International Microwave Symposium - MTT 2013

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter -wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2012 IEEE/MTT-S International Microwave Symposium - MTT 2012

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2011 IEEE/MTT-S International Microwave Symposium - MTT 2011

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2010 IEEE/MTT-S International Microwave Symposium - MTT 2010

    Reports of research and development at the state-of-the-art of the theory and techniques related to the technology and applications of devices, components, circuits, modules and systems in the RF, microwave, millimeter-wave, submillimeter-wave and Terahertz ranges of the electromagnetic spectrum.

  • 2009 IEEE/MTT-S International Microwave Symposium - MTT 2009

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2008 IEEE/MTT-S International Microwave Symposium - MTT 2008

  • 2007 IEEE/MTT-S International Microwave Symposium - MTT 2007

  • 2006 IEEE/MTT-S International Microwave Symposium - MTT 2006

  • 2005 IEEE/MTT-S International Microwave Symposium - MTT 2005

  • 2004 IEEE/MTT-S International Microwave Symposium - MTT 2004

  • 2003 IEEE/MTT-S International Microwave Symposium - MTT 2003

  • 2002 IEEE/MTT-S International Microwave Symposium - MTT 2002

  • 2001 IEEE/MTT-S International Microwave Symposium - MTT 2001

  • 2000 IEEE/MTT-S International Microwave Symposium - MTT 2000

  • 1999 IEEE/MTT-S International Microwave Symposium - MTT '99

  • 1998 IEEE/MTT-S International Microwave Symposium - MTT '98

  • 1997 IEEE/MTT-S International Microwave Symposium - MTT '97

  • 1996 IEEE/MTT-S International Microwave Symposium - MTT '96


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Periodicals related to Microsensors

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Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


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Xplore Articles related to Microsensors

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Applications '90: industrial electronics

IEEE Spectrum, 1990

Advances in industrial electronics during 1989 are described. These include: the use of X-ray scanning-beam laminography to check solder joints on printed- circuit boards; pressure microsensors based on changing resonance frequency by applied force; emergence of the service industry as a market for robots; a computerized facility that allows rapid acquisitions of manufactured parts; and increased use of modular integrated ...


Integrated temperature microsensors for characterization and optimization of thermosonic ball bonding process

IEEE Transactions on Components and Packaging Technologies, 2000

A novel ball bond process optimization method based on the thermal response of an integrated aluminum microsensor is reported. The in situ temperature during ball bonding is measured and analyzed. The ultrasonic period shows distinct stages corresponding to scrubbing of the ball on the pad, intermetallic bond growth, and ball deformation by ultrasonic softening. A peak of the signal indicates ...


Electroplated soft magnetic materials for microsensors and microactuators

Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97), 1997

A number of micromachined magnetic sensors and actuators require materials with desirable magnetic properties as well as thicknesses in the range of several microns. Materials with appropriate magnetic properties have been reported for magnetic storage applications, but often in thickness ranges insufficient for other sensors and actuators. We report the development of an electroplating bath for the deposition of a ...


CAD challenges for microsensors, microactuators, and microsystems

Proceedings of the IEEE, 1998

In parallel with the development of new technologies, new device configurations, and new applications for microsensors, microactuators, and microsystems, also referred to as microelectromechanical devices and systems (MEMS), there has arisen a growing need for computer-aided engineering and design systems. There is a wide range of design problems: process simulation, solid-body geometric renderings from photomasks and process descriptions, energetically correct ...


Processing noisy analog signals from microsensor arrays and VLSI imagers using stochastic binary computations

IEEE CCECE2002. Canadian Conference on Electrical and Computer Engineering. Conference Proceedings (Cat. No.02CH37373), 2002

This paper describes the use of Bernoulli-distributed binary random variables to implement signal processing from integrated arrays of parallel microsensors and VLSI imagers. Parallel digital signal processing of these signals is achieved in hardware by a combination of CMOS threshold detection of noisy raw signals, and the use of stochastic arithmetic (see Gaines, B.R., "Advances in Information Systems Science", Plenum ...


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Educational Resources on Microsensors

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IEEE.tv Videos

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IEEE-USA E-Books

  • Applications '90: industrial electronics

    Advances in industrial electronics during 1989 are described. These include: the use of X-ray scanning-beam laminography to check solder joints on printed- circuit boards; pressure microsensors based on changing resonance frequency by applied force; emergence of the service industry as a market for robots; a computerized facility that allows rapid acquisitions of manufactured parts; and increased use of modular integrated power functions in power electronics systems.<<ETX>>

  • Integrated temperature microsensors for characterization and optimization of thermosonic ball bonding process

    A novel ball bond process optimization method based on the thermal response of an integrated aluminum microsensor is reported. The in situ temperature during ball bonding is measured and analyzed. The ultrasonic period shows distinct stages corresponding to scrubbing of the ball on the pad, intermetallic bond growth, and ball deformation by ultrasonic softening. A peak of the signal indicates the end of interconnection growth. This can be used for bond time optimization. When optimizing bonding force, the sensor signal correlates with ball shear strength. Using this method, bonding force process windows can be determined by on-line measurements. A test measurement shows that at a chip temperature of 34/spl deg/C, the bonding force optimized by the microsensor method is 260 mN whereas it is 252 mN when using conventional shear testing for optimization. In summary, the method produces a wealth of new insights in transient thermal phenomena of the ball bonding process and promises to simplify the evaluation of process windows.

  • Electroplated soft magnetic materials for microsensors and microactuators

    A number of micromachined magnetic sensors and actuators require materials with desirable magnetic properties as well as thicknesses in the range of several microns. Materials with appropriate magnetic properties have been reported for magnetic storage applications, but often in thickness ranges insufficient for other sensors and actuators. We report the development of an electroplating bath for the deposition of a high permeability, low coercivity material, a NiFeMo alloy. Using this bath, the NiFeMo alloy may be electrodeposited up to 5 microns in thickness. In addition we report the use of a NiCo soft magnetic alloy, and the use of NiCo and NiFe layered films for improved magnetic performance.

  • CAD challenges for microsensors, microactuators, and microsystems

    In parallel with the development of new technologies, new device configurations, and new applications for microsensors, microactuators, and microsystems, also referred to as microelectromechanical devices and systems (MEMS), there has arisen a growing need for computer-aided engineering and design systems. There is a wide range of design problems: process simulation, solid-body geometric renderings from photomasks and process descriptions, energetically correct simulations of behavior across multiple coupled energy domains, extraction of lumped low-order models of device behavior, optimization of geometry and process sequence, and design of full systems that include MEMS devices. Because of the computational demands of the modeling required to support full computer-aided design (CAD), there is a premium on fast and memory-efficient algorithms that help the designer, both by automating, where possible, complex sets of related tasks and by providing rapid computational prototyping at critical points in the design cycle. This paper presents an overview of the present state of the art in CAD for MEMS, with particular emphasis on the role of macromodels and test structures as part of the design environment.

  • Processing noisy analog signals from microsensor arrays and VLSI imagers using stochastic binary computations

    This paper describes the use of Bernoulli-distributed binary random variables to implement signal processing from integrated arrays of parallel microsensors and VLSI imagers. Parallel digital signal processing of these signals is achieved in hardware by a combination of CMOS threshold detection of noisy raw signals, and the use of stochastic arithmetic (see Gaines, B.R., "Advances in Information Systems Science", Plenum Press, vol.2, chap.2, p.37-172, 1969; Brown, B.D. and Card, H.C., IEEE Trans. Computers, vol.50, p.891-905, 2001). Hardware efficiencies include reduced power dissipation and improved error tolerance, as compared to binary radix implementations, together with the ability to trade precision against computation time using fixed hardware, reminiscent of biological computations.

  • Whispering-Gallery Microsensors and Microlasers

    The high-Q whispering-gallery modes of fused-silica microresonators have enabled the development of intracavity-absorption chemical sensors and ultralow-threshold quantum-dot lasers. The sensors can have effective absorption pathlengths of meters, and the lasers have pump thresholds of a few hundred nanowatts. Some examples of both applications will be presented.

  • Surface-micromachined piezoelectric pressure sensors

    Surface-micromachined piezoelectric pressure sensors fabricated on deformable polysilicon membranes are described. The process is completely compatible with CMOS technology because it uses conventional fabrication techniques, materials, and chemicals. Integrating microsensors and circuitry on a single chip reduces power consumption and allows localization of information processing operations to be carried out over a small area. Previously reported pressure/acoustic microsensors have been fabricated using bulk-machining techniques and/or hybrid sealing techniques. Bulk machining severely limits device density and weakens the mechanical integrity of the wafer. Front-to- backside alignment unnecessarily complicates the process while silicon etchants such as KOH and EDP (or EPW) can potentially lower the yield of working circuits on the wafer. Hybrid bonding and sealing techniques often require prolonged high-temperature processing steps after the formation of circuits.<<ETX>>

  • Perspectives on MEMS, past and future: the tortuous pathway from bright ideas to real products

    There has been no shortage of bright ideas in the area of microsensors, microactuators, and microelectromechanical devices of all sorts. However, the track record on converting those ideas into commercially successful products has seemed uneven to some, both inside and outside the field. It has taken as much as 15 to 20 years (or more) between early research prototypes and full commercialization for such devices as silicon pressure sensors, accelerometers, ion sensors, and optical displays, somewhat less for some of the passive components such as microfluidic cells for biological application. This paper looks back to the gathering at the Materials Research Society in Boston in 1981 out of which the sequence of Transducers conferences was born, illustrates how far the field has progressed since, and then examines some of the real hurdles that must be overcome during the process of creating products from ideas.

  • Energy-efficient communication for ad-hoc wireless sensor networks

    The energy dissipated by communication is a key concern in the development of networks of hundreds to thousands of distributed wireless microsensors. To evaluate the dissipation of communication energy in this unique application domain, energy models based on actual microsensor hardware are incorporated into a simulation tool designed expressly for high-density, energy-conscious wireless networks. Assessing and leveraging the energy implications of microsensor hardware and applications is crucial to achieving energy-efficient microsensor network communication.

  • Pressure Microsensors Using P-type Diamond Films

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