Conferences related to Micromachining

Back to Top

2023 Annual International Conference of the IEEE Engineering in Medicine & Biology Conference (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted full papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions,will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.


2021 IEEE International Conference on Mechatronics (ICM)

CM focuses on recent developments and future prospects related to the synergetic integration of mechanics, electronics, and information processing.


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE Radio and Wireless Symposium (RWS)

RWW2020 will be an international conference covering all aspects of radio and wireless. RWW2020's multidisciplinary events will bring together innovations that are happening across the broad wireless spectrum. RWS2020, this conference application, acts as the main conference for the entire RWW of events that includes the following conferences: PAWR2020, SiRF2020, WiSNet2020, and TWiOS2020 (IEEE Topical Conference on RF/microwave Power Amplifiers, IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, IEEE Topical Conference on Wireless Sensors and Sensor Networks, and IEEE Topical Workshop on the Internet of Space IoS, respectively). In addition to traditional podium presentations and poster sessions, tracks for IEEE Distinguished Lectures, Sunday half-day workshops, Monday panels, and a demo session are planned. A RWW2020 plenary talk are a parallel IoT Summit are planned. A student competition is also planned.

  • 2019 IEEE Radio and Wireless Symposium (RWS)

    This is a conference with a focus on wireless components, applications, and systems that impact both our current and future life style. The conference's main niche is to bring together technologists, circuit designers, system designers, and entrepreneurs at a single event. It was and is the place where these worlds meet, where new processes and systems can be benchmarked against the needs of circuit designers at the bleeding edge of RF systems, where today's design compromises can trigger tomorrow's advanced technologies. Where dreams can become a reality. RWS is the cornerstone conference for Radio Wireless Week.

  • 2018 IEEE Radio and Wireless Symposium (RWS)

    This is a set of five conferences with a focus on wireless components, applications, and systems that effect both now and our future life style. These conferences main niche is to bring together technologists, circuit designers, system designers, and entrepreneurs at a single event. It was and is the place where these worlds meet, where new processes and systems can be benchmarked against the needs of circuit designers at the bleeding edge of RF systems, where today’s design compromises can trigger tomorrow’s advanced technologies. Where dreams can become a reality.

  • 2017 IEEE Radio and Wireless Symposium (RWS)

    This is a set of five conferences with a focus on wireless components, applications, and systems that effect both now and our future life style. These conferences main niche is to bring together technologists, circuit designers, system designers, and entrepreneurs at a single event. It was and is the place where these worlds meet, where new processes and systems can be benchmarked against the needs of circuit designers at the bleeding edge of RF systems, where today’s design compromises can trigger tomorrow’s advanced technologies. Where dreams can become a reality.

  • 2016 IEEE Radio and Wireless Symposium (RWS)

    This is a set of five conferences with a focus on wireless components, applications, and systems that effect both now and our future life style. These conferences main niche is to bring together technologists, circuit designers, system designers, and entrepreneurs at a single event. It was and is the place where these worlds meet, where new processes and systems can be bench-marked against the needs of circuit designers at the bleeding edge of RF systems, where today

  • 2015 IEEE Radio and Wireless Symposium (RWS)

    This is a set of five conferences with a focus on wireless components, applications, and systems that effect both now and our future life style. These conferences main niche is to bring together technologists, circuit designers, system designers, and entrepreneurs at a single event. It was and is the place where these worlds meet, where new processes and systems can be benchmarked against the needs of circuit designers at the bleeding edge of RF systems, where today

  • 2014 IEEE Radio and Wireless Symposium (RWS)

    RWS focuses on the intersection between radio systems and wireless technology, which creates a unique forum for engineers to discuss hardware design and system performance of the state -of-the-art wireless systems. Includes an expanded program on the latest information on wireless communications and networking, and associated enabling technologies as new services and applications emerge.

  • 2013 IEEE Radio and Wireless Symposium (RWS)

    RWS focuses on the intersection between radio systems and wireless technology, which creates a unique forum for engineers to discuss hardware design and system performance of the state-of-the-art wireless systems. Includes an expanded program on the latest information on wireless communications and networking, and associated enabling technologies as new services and applications emerge.

  • 2012 IEEE Radio and Wireless Symposium (RWS)

    RWS focuses on the intersection between radio systems and wireless technology, which creates a unique forum for engineers to discuss hardware design and system performance of the state-of-the-art wireless systems. Includes an expanded program on the latest information on wireless communications and networking, and associated enabling technologies as new services and applications emerge.

  • 2011 IEEE Radio and Wireless Symposium (RWS)

    All aspects of components and systems related to radio and wireless networks.

  • 2010 IEEE Radio and Wireless Symposium (RWS)

    RWS focuses on the intersection between radio systems and wireless technology, which creates a unique forum for engineers to discuss various aspects of wireless communication systems and the state-of-the-art in both fields by exploring the connections between hardware design and system performance.

  • 2009 IEEE Radio and Wireless Symposium (RWS)

    This symposium highlights the state of the art of hardware and systems of radio and wireless

  • 2008 IEEE Radio and Wireless Symposium (RWS)

  • 2007 IEEE Radio and Wireless Symposium (RWS)

  • 2006 IEEE Radio and Wireless Symposium (RWS)

  • 2004 IEEE Radio and Wireless Conference - (RAWCON 2004)

  • 2003 IEEE Radio and Wireless Conference - (RAWCON 2003)

  • 2002 IEEE Radio and Wireless Conference - (RAWCON 2002)

  • 2001 IEEE Radio and Wireless Conference - (RAWCON 2001)

  • 2000 IEEE Radio and Wireless Conference - (RAWCON 2000)

  • 1999 IEEE Radio and Wireless Conference - (RAWCON '99)

  • 1998 IEEE Radio and Wireless Conference - (RAWCON '98)


2020 IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM)

The scope of the 2020 IEEE/ASME AIM includes the following topics: Actuators, Automotive Systems, Bioengineering, Data Storage Systems, Electronic Packaging, Fault Diagnosis, Human-Machine Interfaces, Industry Applications, Information Technology, Intelligent Systems, Machine Vision, Manufacturing, Micro-Electro-Mechanical Systems, Micro/Nano Technology, Modeling and Design, System Identification and Adaptive Control, Motion Control, Vibration and Noise Control, Neural and Fuzzy Control, Opto-Electronic Systems, Optomechatronics, Prototyping, Real-Time and Hardware-in-the-Loop Simulation, Robotics, Sensors, System Integration, Transportation Systems, Smart Materials and Structures, Energy Harvesting and other frontier fields.


More Conferences

Periodicals related to Micromachining

Back to Top

Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Automation Science and Engineering, IEEE Transactions on

The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Circuits and Systems Magazine, IEEE


More Periodicals


Xplore Articles related to Micromachining

Back to Top

2002 23rd International Conference on Microelectronics. Proceedings (Cat. No.02TH8595)

2002 23rd International Conference on Microelectronics. Proceedings (Cat. No.02TH8595), 2002

The following topics are dealt with: power devices and ICs; microsystem technologies; passive devices; optoelectronic and microwave devices; semiconductor physics and characterisation.


IEE Microengineering Technologies and How to Exploit Them (Ref. 1997/076)

IEE Colloquium on Microengineering Technologies and How to Exploit Them (Digest No: 1997/076), 1997

None


Study of Evaporation Phenomena in Micro Channels

2006 1st IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2006

Two-phase convective flow in micro channels has numerous promising applications such as electronic cooling. This study investigates evaporation phenomena and capillary-driven heat in a rectangular micro channels structure with hydraulic diameters of 100 ~ 250nm and length of 75mm. The micro channels made of (110)-orientated silicon is fabricated by bulk micromachining. The temperature distributions in micro channels chip structure, as ...


Wet etched complex three dimensional MEMS structures

2009 International Symposium on Micro-NanoMechatronics and Human Science, 2009

The present research reports the fabrication techniques for the formation of complex three dimensional structures. The process is developed using very economic wet anisotropic etching in pure and surfactant Triton X-100 [C<sub>14</sub>H<sub>22</sub>O(C<sub>2</sub>H<sub>4</sub>O)<sub>n</sub>, n= 9-10] added 25 wt% tetramethyl ammonium hydroxide (TMAH) solutions. The structures are fabricated in single and nitride-based silicon on insulator (SOI) Si{100} wafers. In single wafer, both ...


Three-dimensional silicon-micromachined microbiopsy tool and in-vivo experiment

The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05., 2005

A three-dimensional array of single-crystalline silicon microspikes with protruded barbs is developed for microscale biopsy. The developed microbiopsy tool is designed to replace the conventional endoscopic biopsy tool and to reduce patient discomfort and risk during the endoscopic operation. For fabrication we extend the SBM (Sacrificial Bulk Micromachining) process and apply the SBM process to both sides of the wafer. ...


More Xplore Articles

Educational Resources on Micromachining

Back to Top

IEEE.tv Videos

No IEEE.tv Videos are currently tagged "Micromachining"

IEEE-USA E-Books

  • 2002 23rd International Conference on Microelectronics. Proceedings (Cat. No.02TH8595)

    The following topics are dealt with: power devices and ICs; microsystem technologies; passive devices; optoelectronic and microwave devices; semiconductor physics and characterisation.

  • IEE Microengineering Technologies and How to Exploit Them (Ref. 1997/076)

    None

  • Study of Evaporation Phenomena in Micro Channels

    Two-phase convective flow in micro channels has numerous promising applications such as electronic cooling. This study investigates evaporation phenomena and capillary-driven heat in a rectangular micro channels structure with hydraulic diameters of 100 ~ 250nm and length of 75mm. The micro channels made of (110)-orientated silicon is fabricated by bulk micromachining. The temperature distributions in micro channels chip structure, as well as the induced evaporation mass flow rate of water, were measured under different heat flux and inclination angle. Thermal resistances were calculated to evaluate the chip cooling performance. The experimental results show that with an increase of the imposed heat flux, the evaporation mass flow rate increases and thermal resistance decreases. The effect of channel sizes and inclination angle on the heat transfer characteristics are also examined

  • Wet etched complex three dimensional MEMS structures

    The present research reports the fabrication techniques for the formation of complex three dimensional structures. The process is developed using very economic wet anisotropic etching in pure and surfactant Triton X-100 [C<sub>14</sub>H<sub>22</sub>O(C<sub>2</sub>H<sub>4</sub>O)<sub>n</sub>, n= 9-10] added 25 wt% tetramethyl ammonium hydroxide (TMAH) solutions. The structures are fabricated in single and nitride-based silicon on insulator (SOI) Si{100} wafers. In single wafer, both fixed and suspended structures are manufactured, while in SOI wafers only freestanding structures are realized. The present research is aimed to enhance the range of 3D structures fabricated using wet etching.

  • Three-dimensional silicon-micromachined microbiopsy tool and in-vivo experiment

    A three-dimensional array of single-crystalline silicon microspikes with protruded barbs is developed for microscale biopsy. The developed microbiopsy tool is designed to replace the conventional endoscopic biopsy tool and to reduce patient discomfort and risk during the endoscopic operation. For fabrication we extend the SBM (Sacrificial Bulk Micromachining) process and apply the SBM process to both sides of the wafer. Shanks of the fabricated 3D microspikes are 1.5 mm long, 150 /spl mu/m thick and 150 /spl mu/m wide. The developed microbiopsy tools are evaluated in-vivo experiment by extracting tissues from live anesthetized rabbits and examining the tissue with the hematoxylin and eosin (H&E) staining protocol. In addition, the clinical test of extracting gastric adenocarcinoma tissue samples is also performed. The 3D microspikes successfully extracted tissue samples from the small intestines of the anesthetized rabbits and gastric adenocarcinoma tissue. The evaluation reveals that the biopsy with the 3D microspike can be applied to the medical examination.

  • Process compensated micromechanical resonators

    Manufacturability and yield are the major challenges prior to adoption of micromechanical resonators as frequency references. In this paper, a design for manufacturability (DFM) technique to achieve absolute frequency accuracy is presented. Non-idealities of a deep reactive ion etching process are examined and determined to be random. The variations in resonator geometry are assumed to be locally systematic and are represented as a process bias. The effect of process bias on resonator center frequency is modeled and the procedure for optimizing for zero sensitivity is explained. Process bias on a 10 MHz optimized design was replicated with electron-beam lithography and supporting data demonstrating DFM is reported.

  • Structure Design and Fabrication of an Area-changed Bulk Micromachined Capacitive Accelerometer

    In this paper, a lateral capacitive MEMS accelerometer for low-g applications was designed and fabricated. The accelerometer is chosen to be based on an area-changed detection scheme. Area-changed accelerometers can provide alternatives in designing high sensitivity and low mechanical noise floor sensors as it is capable of providing a large proof mass. Based on the calculation of sensitivity and basic resonance frequency, three kinds of accelerometers were designed and optimized. Bulk silicon is chosen as the proof mass material and a three-mask micromachining technology was adopted to fabricate the active structures of the accelerometer. Deep RIE and wafer bonding techniques are utilized as it offers solutions in fabricating the thick proof mass and high aspect ratio sensing element structures with small sensing gaps to achieve high sensitivity and low noise performance.

  • Post-Processing Micromachined Pull-In Accelerometer

    This paper reports the first pull-in time accelerometer made by post- processing surface micromachining technology. As the pull-in time is a semi digital signal, the output of the device can be measured with a fully digital circuit. The sensitivity and nonlinearity are comparable with the differential capacitive sensing devices. Aluminium was used for the mechanical layer, while phosphosilicate glass was used as the sacrificial material. Measurements show the change in pull-in time of 5μs from 0 to 1G.

  • Coplanar waveguides on dielectric membranes micromachined on a GaAs substrate

    GaAs micromachining technology was used for fabricating coplanar transmission lines on Si/sub 3/N/sub 4/ and polyimide membranes deposited on GaAs substrates. On-wafer measurements of scattering parameters up to 75 GHz for several line configurations show a constant phase velocity of 2.9 10/sup 8/ m/s and a predominance of metallic losses with a square root frequency dependence.

  • Electrostatic microactuators with integrated gear linkages for mechanical power transmission

    In this paper a surface micromachining process is presented which has been used to fabricate electrostatic microactuators that are interconnected with each other and linked to other movable microstructures by integrated gear linkages. The gear linkages consist of rotational and linear gear structures and the electrostatic microactuators include curved electrode actuators, comb drive actuators and axial gap wobble motors. The micromechanical structures are constructed from polysilicon. Silicon dioxide has been used as a sacrificial layer and silicon nitride was used for electrical insulation. A cyclohexane freeze drying technique is used to prevent problems with stiction. The actuators, loaded with various mechanisms, have been driven successfully by electrostatic actuation. The work is a first step towards mechanical power transmission in micromechanical systems.



Standards related to Micromachining

Back to Top

No standards are currently tagged "Micromachining"


Jobs related to Micromachining

Back to Top