Conferences related to Metallization

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2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting

The joint meeting is intended to provide an international forum for the exchange of information on state of the art research in the area of antennas and propagation, electromagnetic engineering and radio science

2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies

2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.

2020 IEEE International Conference on Plasma Science (ICOPS)

IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.

2020 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.

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Periodicals related to Metallization

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.

Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.

Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.

Computers, IEEE Transactions on

Design and analysis of algorithms, computer systems, and digital networks; methods for specifying, measuring, and modeling the performance of computers and computer systems; design of computer components, such as arithmetic units, data storage devices, and interface devices; design of reliable and testable digital devices and systems; computer networks and distributed computer systems; new computer organizations and architectures; applications of VLSI ...

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Most published Xplore authors for Metallization

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Xplore Articles related to Metallization

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Transformer and paper capacitor reports available from the Library of Congress

IRE Transactions on Component Parts, 1958


Copper Interconnection with Tungsten Cladding for UlSI

1991 Symposium on VLSI Technology, 1991


High-density static bipolar memory

1973 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1973

A static bipolar memory approach with a 3.1-mil<sup>2</sup>cell in standard technology affording a 4k-bit chip with 50-ns access time at 0.1 &#956;W/bit standby power will be described.

Cmos/sos Ri-1750ab Processor

1992 IEEE International SOI Conference, 1992


A CMOS electrically reprogrammable ASIC with multi-level random logic capabilities

1986 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1986

A 24-pin electrically-reprogrammable ASIC, implemented in CMOS EEPROM technology with two-layer polysilicon and two-layer metal, providing user logic complexity of 600-800 gate equivalents, will be described. Speeds of 15ns per internal logic level have been obtained with 50mW consumption.

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Educational Resources on Metallization

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Standards related to Metallization

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