Conferences related to Metal product industries

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2021 IEEE Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE IAS Petroleum and Chemical Industry Committee (PCIC)

The PCIC provides an international forum for the exchange of electrical applications technology related to the petroleum and chemical industry. The PCIC annual conference is rotated across North American locations of industry strength to attract national and international participation. User, manufacturer, consultant, and contractor participation is encouraged to strengthen the conference technical base. Success of the PCIC is built upon high quality papers, individual recognition, valued standards activities, mentoring, tutorials, networking and conference sites that appeal to all.


2020 IEEE Industry Applications Society Annual Meeting

The Annual Meeting is a gathering of experts who work and conduct research in the industrial applications of electrical systems.


2020 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM)

All topics related to engineering and technology management, including applicable analytical methods and economical/social/human issues to be considered in making engineering decisions.


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Periodicals related to Metal product industries

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Automation Science and Engineering, IEEE Transactions on

The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...


Control Systems Technology, IEEE Transactions on

Serves as a compendium for papers on the technological advances in control engineering and as an archival publication which will bridge the gap between theory and practice. Papers will highlight the latest knowledge, exploratory developments, and practical applications in all aspects of the technology needed to implement control systems from analysis and design through simulation and hardware.


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Most published Xplore authors for Metal product industries

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Xplore Articles related to Metal product industries

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Development of High Gradient Magnetic Separation System for a Highly Viscous Fluid

IEEE Transactions on Applied Superconductivity, 2010

It is necessary to remove the metallic wear debris originating from pipe of manufacturing line in industrial plant processing highly viscous fluid such as foods or industrial products. In this study, we developed a high gradient magnetic separation (HGMS) system which consists of superconducting magnet and magnetic filters to remove the metallic wear debris. The particle trajectory simulation and the ...


Notice of Retraction<br>The Conservation and Utilization of Industrial Heritage in the Process of Urban Development - Industrial Landscape Design Paper Subtitle

2009 International Conference on Management and Service Science, 2009

The conservation and utilization of industrial heritage has drawn common concern of different countries all over the world. Although some industrial heritage has totally lost the original production function and no longer produces economic profit, yet as it contains rich human landscapes and peculiar connotations of places in the city, it still contains peculiar values. In the exploration and practice ...


High Tc SQUID System for Detection of Small Metallic Contaminant in Industrial Products

IEEE Transactions on Applied Superconductivity, 2009

A three channel High-Tc SQUID system for detection of magnetic contaminants in industrial products was developed. Finding ultra-small metallic contaminants is a big issue for manufacturers producing commercial products such as lithium ion batteries. When the contamination does occur, the manufacturer of the product suffers a great loss to recall the tainted products. The outer dimension of metallic particles less ...


Ball bumping and coining operations for TAB and Flip Chip

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces, 1997

The process of using a ball bonder to form bumps on a chip, for subsequent TAB or Flip Chip attachment to a substrate, has now reached the production stage. A number of companies are using the process for full scale production. Other companies are using the process for rapid prototyping and limited quantity production. It requires no masks, uses existing ...


Modification of the steel 45G17UZ grained structure at the fatigue testing under conditions of electrical stimulation

Proceedings of the 8th International Scientific and Practical Conference of Students, Post-graduates and Young Scientists Modern Technique and Technologies, 2002. MTT 2002., 2002

Investigates the evolution of the steel 45G17UZ grained structure with high- cycle fatigue tests. under conditions of the gap electropulse action. Analysis of the phase composition and defect structure was carried out by the methods of the etched section metallography.


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Educational Resources on Metal product industries

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IEEE.tv Videos

Niobium Manufacturing for Superconductivity - ASC-2014 Plenary series - 5 of 13 - Tuesday 2014/8/12
NYC Soldering Championship
Millimeter-Wave Bandpass Filter Using High-Q Conical Inductors and MOM Capacitors: RFIC Interactive Forum
IMS 2011 Microapps - New Rotary Joint Product Lines for SATCOM Applications
Driven Product Development for Wireless Power Transfer
IEEE Future Networks Initiative - Academia and Industry Shaping and Evolving the Future
Standards Insights for Executives: Impact of Standards on Product Design
APEC 2011-Energy Efficiency and Renewable Energy Adoptions
Smart Manufacturing: Embracing the Digital Revolution - Jane Barr at IEEE WIE Forum USA East 2017
Kaizad Mistry of Intel accepts the IEEE Corporate Innovation Award - Honors Ceremony 2016
IMS 2011 Microapps - Pulsed S-Parameter Measurements Using PXI Instruments
Conformity Assessment: The Perspective of Product Designers - Gordon Gillerman, Director, Standards Coordination Office, NIST
2015 IEEE Honors: IEEE Jun-ichi Nishizawa Medal - Dimitri A. Antoniadis
Vertical Industries & 5G Implementation - Fouad El Mernissi - 5G World Forum Dresden, 2019
M. George Craford accepts the IEEE Edison Medal - Honors Ceremony 2017
IEEE Computer Society Pioneer Award winner "Cleve Moler"
Whurley Keynote - IEEE Rising Stars 2020
Verizon's Marni Walden presents opportunity in Product & New Business Innovation - 2016 Women in Engineering Conference
Rogers at APEC 2016
Q&A: John Smee & Mikael Hook - B5GS 2019

IEEE-USA E-Books

  • Development of High Gradient Magnetic Separation System for a Highly Viscous Fluid

    It is necessary to remove the metallic wear debris originating from pipe of manufacturing line in industrial plant processing highly viscous fluid such as foods or industrial products. In this study, we developed a high gradient magnetic separation (HGMS) system which consists of superconducting magnet and magnetic filters to remove the metallic wear debris. The particle trajectory simulation and the magnetic separation experiment were conducted with polyvinyl alcohol (PVA) as a model material of which viscosity coefficient was 1 Pa · s. As a result, maximum separation efficiency over 80% was achieved by optimization of experimental conditions such as mesh number, flow velocity and the number of filters.

  • Notice of Retraction<br>The Conservation and Utilization of Industrial Heritage in the Process of Urban Development - Industrial Landscape Design Paper Subtitle

    The conservation and utilization of industrial heritage has drawn common concern of different countries all over the world. Although some industrial heritage has totally lost the original production function and no longer produces economic profit, yet as it contains rich human landscapes and peculiar connotations of places in the city, it still contains peculiar values. In the exploration and practice of industrial heritage conservation in different countries, the construction of "industrial cultural landscape" has proven to be the most notable, for it not only brings environment renovation to an industrial heritage site and satisfies the needs for ecological restoration, cultural inheritance and transmission, and economic development, but also promotes the sustainable development of the city and restores its vitality. At present, the conservation of industrial heritage in China should show respect for the cultural tendency of post-modern industrial age and the direction of historical development, bring the future development within the contexts of the past and the climate of the present, and finally find out new ideas for the conservation and renovation of industrial heritage which fit the national conditions of China.

  • High Tc SQUID System for Detection of Small Metallic Contaminant in Industrial Products

    A three channel High-Tc SQUID system for detection of magnetic contaminants in industrial products was developed. Finding ultra-small metallic contaminants is a big issue for manufacturers producing commercial products such as lithium ion batteries. When the contamination does occur, the manufacturer of the product suffers a great loss to recall the tainted products. The outer dimension of metallic particles less than 100 micron can not be detected by X-ray imaging, which is commonly used as the inspection method. Therefore, a highly sensitive detection system for small contaminants is required. We developed a detection system based on a three channel high-Tc SQUID microscope with a high performance magnetic shield. Three SQUIDs were installed in one microscope-type cryostat with a 3" sapphire vacuum window which separates the SQUID and atmosphere. This design enables the SQUID to approach an object to be measured as close as 1 mm. The minimal detectable size of the particle is also highly dependent on the magnetic field noise of the SQUID. Therefore, we employed double transformer coupling, which lowers the noise. One transformer was placed at 77 K and the other was at room temperature (RT). As a result, the magnetic field noise of the SQUID was reduced by 36%. Finally we could successfully measure small iron particles as small as 30 micron. This detection level was difficult to achieve when using a conventional X-ray detection method.

  • Ball bumping and coining operations for TAB and Flip Chip

    The process of using a ball bonder to form bumps on a chip, for subsequent TAB or Flip Chip attachment to a substrate, has now reached the production stage. A number of companies are using the process for full scale production. Other companies are using the process for rapid prototyping and limited quantity production. It requires no masks, uses existing equipment, and in many cases provides the most cost effective method for depositing bumps on chips. Two process variations are prevalent. 1. Bumping and coining, is a process where a normal ball bond with a short ductile fracture tip protruding from the top of the ball is bonded to the device, then coined flat by a second stage operation. 2. The stud bumping process produces a short loop and the crescent bond is placed on the shoulder of the ball.

  • Modification of the steel 45G17UZ grained structure at the fatigue testing under conditions of electrical stimulation

    Investigates the evolution of the steel 45G17UZ grained structure with high- cycle fatigue tests. under conditions of the gap electropulse action. Analysis of the phase composition and defect structure was carried out by the methods of the etched section metallography.

  • A Process for the Production of Zn Powder by Alkaline Treatment of Brass Smelting Ash at Industrial Scale

    In this paper, an industrial-scale alkaline process for the production of Zn powder using brass smelting ash as raw material was presented. It was suggested that the brass smelting ash be leached with 230 g/L NaOH solution at 80degC for 90 min at a phase ratio of 15. The maximum extraction of Zn and Pb can be reached at 96-99% and 90-95%, respectively. After Pb was separated selectively and quantitatively by sodium sulfides precipitation, the solution was subjected to electrolysis for the production of zinc powder with a current density of 800-1000 A/m<sup>2</sup> at 40-50degC, using stainless steel electrodes as anode and titanium alloy as cathode. The specific energy for the Zn electrolysis was around 2.7-3.1 kWh/kg Zn. Additional operations including Zn powder filtration, washing, desiccation, sieving and milling etc. were required, and the production of Zn powder with a purity over 96% can be obtained finally. Compared with the classical acidic-air pulverization production process of Zn powder, about 10-15% energy can be saved by the alkaline process.

  • Kinetics of Pulsed Metal and Metal Halide Vapor Lasers and its Influence on Pulse Repetition Rate and Average Power

    None

  • Ball bumping and coining operations for TAB and flip chip

    The process of using a ball bonder to form bumps on a chip, for subsequent TAB or Flip Chip attachment to a substrate, has now reached the production stage. A number of companies are using the process for full scale production. Other companies are using the process for rapid prototyping and limited quantity production. The advantages of the ball bumping process are that it requires no expensive masks or wet processing. It also uses existing equipment, experienced personnel, and it has the flexibility and ease of manufacturing associated with wire bonding. The yields and reliability of wire bonding are well established, and the ball bumping process is the same as the ball bonding portion of the wire bond process. Similar yields are expected. In many cases ball bumping provides the most cost effective method for depositing bumps on chips. Two process variations are prevalent. 1. Bumping and coining, is a process where a normal ball bond with a short ductile fracture tip protruding from the top of the ball is bonded to the device. Optionally, the bumps are then coined flat by a second stage operation. 2. The stud bumping process produces a short loop with the crescent bond placed on the shoulder of the ball.

  • Analysis of multicrystalline solar cells from solar grade silicon feedstock

    The paper focuses on the analysis of solar cells from the newly developed solar grade silicon (SoG-Si) feedstock from a metallurgical process route. The emphasis of our experiments was to define an industrial solar cell process to achieve efficiencies higher than /spl eta/=16% on multicrystalline wafers containing a significant amount of the SoG-Si. The material was prepared as multicrystalline ingots by directional solidification and wafered by conventional wire saw technique. We demonstrate efficiencies higher than 16% on several wafers of 156 cm/sup 2/ size with an industrial process sequence from batches containing 25% and 65% Elkem SoG-Si feedstock. The new feedstock under investigation will enable the mass PV production and opens the route for cost reductions in the PV-industry.

  • Application research on case-based reasoning combined with adaptation model for dynamic scheduling of steel production

    The case-based reasoning system combined with adaptation model (CBRSCWAM) is proposed to optimize dynamic scheduling problem for the iron & steel production. The model function, model establishing and model resolving are presented in detail. To resolve easily, the nonlinear adaptation model is converted into linear adaptation model, then, the two-stage algorithm is utilized to improve resolving efficiency. On the first stage, genetic algorithm (GA) that introduces heuristic to generate population is adopted to deal with the problem to reduce dimension. On the second stage, simplex method is used to resolve the simplified model. The simulation result obtains tests that the CBRSCWAM is much fitful to resolve complex problem such as iron & steel dynamic scheduling than single model approach or conventional CBR approach. With the perfect of the prototype system, it is put into application, and much profit may appear.



Standards related to Metal product industries

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Jobs related to Metal product industries

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