Conferences related to Environmental Stress

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2021 IEEE Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


2020 59th IEEE Conference on Decision and Control (CDC)

The CDC is the premier conference dedicated to the advancement of the theory and practice of systems and control. The CDC annually brings together an international community of researchers and practitioners in the field of automatic control to discuss new research results, perspectives on future developments, and innovative applications relevant to decision making, automatic control, and related areas.


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE Energy Conversion Congress and Exposition (ECCE)

IEEE-ECCE 2020 brings together practicing engineers, researchers, entrepreneurs and other professionals for interactive and multi-disciplinary discussions on the latest advances in energy conversion technologies. The Conference provides a unique platform for promoting your organization.

  • 2019 IEEE Energy Conversion Congress and Exposition (ECCE)

    IEEE-ECCE 2019 brings together practicing engineers, researchers, entrepreneurs and other professionals for interactive and multi-disciplinary discussions on the latest advances in energy conversion technologies. The Conference provides a unique platform for promoting your organization.

  • 2018 IEEE Energy Conversion Congress and Exposition (ECCE)

    The scope of ECCE 2018 includes all technical aspects of research, design, manufacture, application and marketing of devices, components, circuits and systems related to energyconversion, industrial power and power electronics.

  • 2017 IEEE Energy Conversion Congress and Exposition (ECCE)

    ECCE is the premier global conference covering topics in energy conversion from electric machines, power electronics, drives, devices and applications both existing and emergent

  • 2016 IEEE Energy Conversion Congress and Exposition (ECCE)

    The Energy Conversion Congress and Exposition (ECCE) is focused on research and industrial advancements related to our sustainable energy future. ECCE began as a collaborative effort between two societies within the IEEE: The Power Electronics Society (PELS) and the Industrial Power Conversion Systems Department (IPCSD) of the Industry Application Society (IAS) and has grown to the premier conference to discuss next generation technologies.

  • 2015 IEEE Energy Conversion Congress and Exposition

    The scope of ECCE 2015 includes all technical aspects of research, design, manufacture, application and marketing of devices, components, circuits and systems related to energy conversion, industrial power and power electronics.

  • 2014 IEEE Energy Conversion Congress and Exposition (ECCE)

    Those companies who have an interest in selling to: research engineers, application engineers, strategists, policy makers, and innovators, anyone with an interest in energy conversion systems and components.

  • 2013 IEEE Energy Conversion Congress and Exposition (ECCE)

    The scope of the congress interests include all technical aspects of the design, manufacture, application and marketing of devices, components, circuits and systems related to energy conversion, industrial power conversion and power electronics.

  • 2012 IEEE Energy Conversion Congress and Exposition (ECCE)

    The IEEE Energy Conversion Congress and Exposition (ECCE) will be held in Raleigh, the capital of North Carolina. This will provide a forum for the exchange of information among practicing professionals in the energy conversion business. This conference will bring together users and researchers and will provide technical insight as well.

  • 2011 IEEE Energy Conversion Congress and Exposition (ECCE)

    IEEE 3rd Energy Conversion Congress and Exposition follows the inagural event held in San Jose, CA in 2009 and 2nd meeting held in Atlanta, GA in 2010 as the premier conference dedicated to all aspects of energy processing in industrial, commercial, transportation and aerospace applications. ECCE2011 has a strong empahasis on renewable energy sources and power conditioning, grid interactions, power quality, storage and reliability.

  • 2010 IEEE Energy Conversion Congress and Exposition (ECCE)

    This conference covers all areas of electrical and electromechanical energy conversion. This includes power electrics, power semiconductors, electric machines and drives, components, subsystems, and applications of energy conversion systems.

  • 2009 IEEE Energy Conversion Congress and Exposition (ECCE)

    The scope of the conference include all technical aspects of the design, manufacture, application and marketing of devices, circuits, and systems related to electrical energy conversion technology


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Periodicals related to Environmental Stress

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Communications Magazine, IEEE

IEEE Communications Magazine was the number three most-cited journal in telecommunications and the number eighteen cited journal in electrical and electronics engineering in 2004, according to the annual Journal Citation Report (2004 edition) published by the Institute for Scientific Information. Read more at http://www.ieee.org/products/citations.html. This magazine covers all areas of communications such as lightwave telecommunications, high-speed data communications, personal communications ...


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Most published Xplore authors for Environmental Stress

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Xplore Articles related to Environmental Stress

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Accelerative effect analysis of quantitative environmental stress screening

2016 11th International Conference on Reliability, Maintainability and Safety (ICRMS), 2016

Environmental stress screening is an effective method to eliminate the potential defects of electronic products. In order to improve the efficiency and effectiveness of environmental stress screening, the acceleration effect was derived and analyzed based on the quantitative environmental stress screening mathematical principles of GJB/Z34. Then the high-temperature aging, temperature cycling, and random vibration acceleration effect evaluation model was proposed, ...


Environmental Stress Screening for electronic equipment by random vibration: a critical approach to reliability estimation and planning

2007 IEEE Instrumentation & Measurement Technology Conference IMTC 2007, 2007

Individuated a deficiency of manufacturing practice and standards in environmental stress screening, ESS, we proposed a process of screening with random vibrations in which the time of test is optimized according to the components and the layout board, trying also to minimize the cost of the same test. The screening test is implemented and the results are discussed in this ...


Reliability assessment under real world environmental stress

2017 Second International Conference on Reliability Systems Engineering (ICRSE), 2017

The traditional reliability assessment method only considers the product under the condition of constant environmental stress. However, the products are often actually exposed to the real world environmental stress. Aiming to solve this problem, the real world environmental stress of the typical geographical location is introduced, and the five-parameter polynomial fitting method is used to deal with its historical climate ...


Economic cost modeling of environmental-stress-screening and burn-in

IEEE Transactions on Reliability, 1997

The electronics industry is highly competitive. The introduction of new advanced integrated circuits continues. The manufacturer must develop a product with adequate life cycle, high quality and low failure rate in the specified time period. Environmental stress screening (ESS) is widely used in the electronics industry to assist in eliminating early or patent failures. The bathtub curve is a common ...


Qualification of surface mount technologies for random vibration in environmental stress screens

Annual Reliability and Maintainability Symposium, 1997

High density surface mount technologies such as ball grid array and column grid array are less robust with respect to random vibration stress than leaded surface mount devices. Intermittent failures can occur under vibration stress that are not detectable when the stress is removed. The devices are more vulnerable to vibration stresses at high temperature (80/spl deg/C) than at low ...


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Educational Resources on Environmental Stress

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IEEE-USA E-Books

  • Accelerative effect analysis of quantitative environmental stress screening

    Environmental stress screening is an effective method to eliminate the potential defects of electronic products. In order to improve the efficiency and effectiveness of environmental stress screening, the acceleration effect was derived and analyzed based on the quantitative environmental stress screening mathematical principles of GJB/Z34. Then the high-temperature aging, temperature cycling, and random vibration acceleration effect evaluation model was proposed, and the test times under conventional stress and accelerated stress were obtained respectively. Finally, the stress acceleration factor was calculated according to the test time between conventional stress and accelerated stress and an example given which proved that the screening was effective.

  • Environmental Stress Screening for electronic equipment by random vibration: a critical approach to reliability estimation and planning

    Individuated a deficiency of manufacturing practice and standards in environmental stress screening, ESS, we proposed a process of screening with random vibrations in which the time of test is optimized according to the components and the layout board, trying also to minimize the cost of the same test. The screening test is implemented and the results are discussed in this paper.

  • Reliability assessment under real world environmental stress

    The traditional reliability assessment method only considers the product under the condition of constant environmental stress. However, the products are often actually exposed to the real world environmental stress. Aiming to solve this problem, the real world environmental stress of the typical geographical location is introduced, and the five-parameter polynomial fitting method is used to deal with its historical climate data and get the variation tendency of temperature and humidity. Based on the Nelson cumulative damage model and generalized Eyring model, the product reliability assessment method under real world environmental stress is studied. Compared with the traditional reliability assessment method under constant environmental stress, the reliability assessment method under real world environmental stress is more accurate.

  • Economic cost modeling of environmental-stress-screening and burn-in

    The electronics industry is highly competitive. The introduction of new advanced integrated circuits continues. The manufacturer must develop a product with adequate life cycle, high quality and low failure rate in the specified time period. Environmental stress screening (ESS) is widely used in the electronics industry to assist in eliminating early or patent failures. The bathtub curve is a common model for the failure rate of a population. The classic bathtub curve has three parts: infant mortality; useful life; and wearout. However, some electronic products have latent defects which are not detected by conventional inspection or functional testing, and occur during the product useful life. Most electronic systems have finite useful life. As a result, technology obsolescence is of concern and should be considered, This paper uses a new interpretation and development of the bathtub curve that integrates: (1) latent failures; and (2) the concept of obsolescence, by constructing an integrated cost model used to determine both optimal burn-in and ESS times in the same environment.

  • Qualification of surface mount technologies for random vibration in environmental stress screens

    High density surface mount technologies such as ball grid array and column grid array are less robust with respect to random vibration stress than leaded surface mount devices. Intermittent failures can occur under vibration stress that are not detectable when the stress is removed. The devices are more vulnerable to vibration stresses at high temperature (80/spl deg/C) than at low (-30/spl deg/C). Guidelines for optimized vibration levels in environmental stress screens can be determined from damage data obtained using Miner's rule.

  • Electronic-module environmental-stress-screening data-evaluation technique

    This report has provided a reliability engineering analysis technique to support optimization decisions for a production environmental stress screening (ESS) program and demonstrated its use. The important groundrules used in this analysis are: (1) a disciplined approach to the ESS process is required for the results of this analysis to be effective; and (2) the failures per thermal cycle should be distributed equally throughout the cycle in order to represent a realistic scenario. The benefits associated with the analysis technique include: (1) the parameter, "failures per thermal cycle", has a simple accounting method and is easy to accurately collect; and (2) the tools are PC based and facilitate timely reaction to management requests. The observations made during the generation of this report are: (1) all ESS failures must be analyzed for root cause and effective corrective action; (2) the input data to the analysis technique must be completely understood so that the results of the optimization decision process are prudent; and (3) feedback from field performance is a vital element in the optimization process.

  • Environmental Stress Testing with Boundary-Scan

    Environmental Stress Testing (EST) enhances product quality and reliability by detecting latent or marginal defects in a product. For EST to be effective, testing of a product must achieve a high fault coverage so that as many EST- induced defects can be detected. By utilizing Boundary-Scan (IEEE Std 1149.1-1990), EST can achieve a high fault coverage and at the same time, minimize test cost. The paper describes a complete infrastructure, both software and hardware, for using Boundary-Scan (B-S) in EST. In addition, the paper shows a simplified control mechanism to select individual circuit packs for Boundary-Scan testing. This control mechanism minimizes the number of wires required to drive the control interface and thus, the number of wires in the cable that connects a tester to the backplane of a system under test and across which Boundary-Scan tests are executed. Finally, the paper presents and discusses some study results for evaluating the effectiveness of monitored EST.

  • Environmental stress screening for a massively parallel vision computer

    AISI began experiencing a severe field reliability problem with their computers. There was a single point source of failure in the systems in which they were incorporated. An issue with programmable array logic (PAL) had driven the customer return rate to approximately 45% and caused severe production problems for the ultimate users of the computers. The legacy screening process used by AISI was ineffective at screening out the problems. The limited amount of failure analysis performed was inconclusive at identifying root cause of the failures. A screen was developed based on generic information on technology failure mechanism and circumstantial evidence gathered by AISI. The resultant screening used both temperature and voltage stress. Combined with part level screening and change of suppliers the customer return rate was reduced to 1%. Further improvements for part level screening were developed using Iddq as a parametric screen. The board-level screening program required a capital investment of only $50,000. Part screening increased the price of the parts by an additional 10%.

  • Critical review of U.S. Military environmental stress screening (ESS) handbook

    Environmental stress screening (ESS) is a process to eliminate defects caused by materials and manufacturing variations in electronic products by a 100% screening, with the goal to eventually improve manufacturing processes that cause the defects. MIL-HDBK 344A- Environmental Stress Screening (ESS) of Electronic Equipment describes a quantitative approach for planning, monitoring, and controlling an ESS process. This handbook was last updated in 1993 but is still widely used today within and beyond the military and aerospace industries. While the processes and overall philosophy of ESS are well presented in the handbook, the mathematical foundations and the data it uses have become obsolete over the years. These concerns are explained with a thorough analysis of the initial defect estimation and screening strength estimation steps described in the handbook. With the rapid evolution in electronics technology, the handbook's estimation methods are meaningless if not counterproductive for the planning of an ESS program for today's electronics systems. Based on the critical concerns presented in this article, we urge the U.S. Department of Defense to cancel and stop use of MIL-HDBK 344A.

  • ESS profiles with step stress level

    Environmental Stress Screening (ESS) is usually referred to the process of exposing a product to environmental stresses for detecting and eliminating latent defects made in manufacturing process. The common ESS profiles are using thermal cycling, random vibration or their combinations as the screening stresses. Various guidelines and standards have been available for determining an ESS profile. Nevertheless, there are cases that the standard ESS profiles may not be efficient enough to detect the latent defects in some manufacturing process. This paper reports the results of one industrial project on the ESS profile design for circuits. In the project, a comparative study was carried out for the evaluation of the ESS strength under the ESS profiles with incremental step stresses (ISS). The ISS profile under the study is firstly to implement a step thermal cycling and then perform the test with two screening stimuli concurrently: ordinary thermal cycling and random vibration of step increasing intensity levels. For the purpose of the comparative study, the ESS test samples were consisted of two groups A and B that were made at two different levels of manufacturing: soldering by skilled and unskilled workers, respectively. The comparative study shows that the ISS profiles are effective for exposing the latent defects in sample group A and B. Based on the project results, an ESS profile is recommended in this paper.



Standards related to Environmental Stress

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IEEE Guide for Test Methods and Procedures to Evaluate the Electrical Performance of Insulators in Freezing Conditions

The guide specifies procedures for testing equipment when external insulation of the test object is subjected to combinations of contamination, ice, snow, or cold fog. The methods are applicable only to tests on equipment with a rated voltage above 1 kV.The guide specifies procedures for testing equipment when external insulation of the test object is subjected to combinations of contamination, ...


IEEE Standard for Environmental Assessment of Personal Computer Products, including Laptop Personal Computers, Desktop Personal Computers, and Personal Computer Monitors

This Standard defines environmental performance standards for personal computer products, including desktop computers, notebook computers, and computer monitors that are marketed to institutions, and includes key concepts and implementation procedures relating to reduction or elimination of environmentally sensitive materials, materials selection, design for end of life, life cycle extension, energy conservation, end of life management, corporate performance and packaging.



Jobs related to Environmental Stress

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