Conferences related to Materials reliability

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2021 IEEE Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE Applied Power Electronics Conference and Exposition (APEC)

APEC focuses on the practical and applied aspects of the power electronics business. Not just a power designer’s conference, APEC has something of interest for anyone involved in power electronics including:- Equipment OEMs that use power supplies and converters in their equipment- Designers of power supplies, dc-dc converters, motor drives, uninterruptable power supplies, inverters and any other power electronic circuits, equipments and systems- Manufacturers and suppliers of components and assemblies used in power electronics- Manufacturing, quality and test engineers involved with power electronics equipment- Marketing, sales and anyone involved in the business of power electronic- Compliance engineers testing and qualifying power electronics equipment or equipment that uses power electronics


2020 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.


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Periodicals related to Materials reliability

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Computer Architecture Letters

Rigorously peer-reviewed forum for publishing early, high-impact results in the areas of uni- and multiprocessors computer systems, computer architecture workload characterization, performance evaluation and simulation techniques, and power-aware computing


Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.


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Most published Xplore authors for Materials reliability

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Xplore Articles related to Materials reliability

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A 35ns 128K fusible bipolar PROM

1986 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1986

A bipolar PROM using 2μm slot-isolation technology will be reported. Circuits include a column-current multiplexer and temperature-compensated sensing. The die size is 306×224 mil2.


Correction in the january/february issue of ieee potentials, there was an error in the solution to problem 2 of the gamesman

IEEE Potentials, 2007

None


Reliability for "future" devices

2008 IEEE International Integrated Reliability Workshop Final Report, 2008

This article consists of a collection of slides from the author's conference presentation. Some of the specific areas/topics discussed include: Scaling (Density & Materials); Si Devices (Planar Devices: Classical, Fully depleted), (Non planar Devices: Non-Si Devices: Ge & III/V, and 1D devices); and a Summary.


Fiber optics structural mechanics

1995 Proceedings. 45th Electronic Components and Technology Conference, 1995

In fiber-optics engineering, the areas of materials and manufacturing, including materials development, processing, and long-term reliability, are well established, and the body of published work in these areas is enormous. The situation is different in fiber-optics mechanics. This can be defined as the application of methods of Engineering Mechanics and Structural Analysis to stress-strain evaluations and physical design of fiber-optics ...


Mechanics of interface with applications in electronic packaging

IEEE Transactions on Device and Materials Reliability, 2003

The purpose of this paper is to present a brief review of the mechanics of interface fracture, with a focus on applications in electronic packaging. From a structural mechanics perspective, electronic devices can be thought of as composite structures fabricated from highly dissimilar materials. Often, the interfaces between these materials are where failure is most likely to occur when the ...


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Educational Resources on Materials reliability

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IEEE.tv Videos

Transphorm: GaN Champions
Arizona Reliability Society - May 1 2015
IEEE PES Awards 2020: IEEE PES Roy Billinton Power System Reliability Award
APEC 2015: KeyTalks - How to Optimize Performance and Reliability of GaN Power Devices
Heuristics for Design for Reliability in Electrical and Electronic Products
Spatial-Spectral Materials for High Performance Optical Processing - IEEE Rebooting Computing 2017
EMBC 2011-Keynote-From Nature and Back Again ... Giving New Life to Materials for Energy, Electronics, Medicine and the Environment - Angela Belcher, PhD
IMS 2012 Microapps - Bonding Materials used in Multilayer Microwave PCB Applications
The Long Term Reliability of Gallium Nitride
APEC 2015: KeyTalks - US DOE perspective on Microgrids
Consistent, Reliable and Peak-Performing PCB Assemblies: MicroApps 2015 - Zentech Manufacturing, Inc.
Inventor C++ Bjarne Stroustrup (high resolution)
Unconventional Superconductivity: From History to Mystery
Wanda Reder: Educational Materials for Expert and Non-Expert — IEEE Power and Energy Society’s “Plain Talk” — Studio Tech Talks: Sections Congress 2017
IEEE Green Energy Summit 2015, Panel 2: How reliable is reliable enough?
Nanotechnology, we are already there: APEC 2013 KeyTalk with Dr. Terry Lowe
Multi-Function VCO Chip for Materials Sensing and More - Jens Reinstaedt - RFIC Showcase 2018
PES Scholarship Initiative Plus - Patricia Hoffman Presentation
Magnetic Materials and Magnetic Devices - Josep Fontcuberta: IEEE Magnetics Distinguished Lecture 2016
Unique Fixtures for Characterizing Electromagnetic Properties of Materials at THz Frequencies: MicroApps 2015 - Keysight Technologies

IEEE-USA E-Books

  • A 35ns 128K fusible bipolar PROM

    A bipolar PROM using 2μm slot-isolation technology will be reported. Circuits include a column-current multiplexer and temperature-compensated sensing. The die size is 306×224 mil2.

  • Correction in the january/february issue of ieee potentials, there was an error in the solution to problem 2 of the gamesman

    None

  • Reliability for "future" devices

    This article consists of a collection of slides from the author's conference presentation. Some of the specific areas/topics discussed include: Scaling (Density & Materials); Si Devices (Planar Devices: Classical, Fully depleted), (Non planar Devices: Non-Si Devices: Ge & III/V, and 1D devices); and a Summary.

  • Fiber optics structural mechanics

    In fiber-optics engineering, the areas of materials and manufacturing, including materials development, processing, and long-term reliability, are well established, and the body of published work in these areas is enormous. The situation is different in fiber-optics mechanics. This can be defined as the application of methods of Engineering Mechanics and Structural Analysis to stress-strain evaluations and physical design of fiber-optics systems. Although the ability to design a viable and reliable fiber-optics structure is of obvious practical importance, the amount of publications in this field is relatively small. In this review, which is based primarily on the author's research, the following problems of the mechanical behavior of bare and coated optical fibers, experiencing thermally induced and/or mechanical loading, are addressed: low temperature microbending; mechanical approach to the evaluation of low temperature threshold of added transmission losses; bending of coated fibers, including those in termination fixtures: mechanical aspects of different types of proof-testing; and the effects of the nonlinear stress- strain relationship in silica materials on elastic stability, free vibrations, and bending of optical fibers and lightwave couplers. It is concluded that application of methods of Structural Mechanics enables one to better understand the mechanical behavior of fiber optics systems and to design a structure of high mechanical and optical performance.

  • Mechanics of interface with applications in electronic packaging

    The purpose of this paper is to present a brief review of the mechanics of interface fracture, with a focus on applications in electronic packaging. From a structural mechanics perspective, electronic devices can be thought of as composite structures fabricated from highly dissimilar materials. Often, the interfaces between these materials are where failure is most likely to occur when the device is subjected to thermomechanical loading. The mechanics of interface fracture is a specialized subtopic within the discipline of fracture mechanics and the nonspecialist may be unaware of some of the subtle differences encountered in applying interface fracture concepts. The mechanics associated with interface fracture introduces certain mathematical concepts that may seem to be unnecessarily complicated, but are essential for its proper application. It is important that the electronic packaging reliability engineer be aware of these concepts, understanding the most important implications. This review will focus on the mechanics and computational aspects of interface fracture in electronic structures, with a particular emphasis on some details that the nonexpert could only obtain after an extensive review of the available literature. Numerical results are presented for the important problem of corner cracking between silicon and epoxy materials subjected to thermomechanical loading. These new results provide insight into the three-dimensional nature of interfacial crack propagation at bimaterial corners.

  • Material Fatigue and Reliability of MEMS Accelerometers

    MEMS (microelectromechanical system) reliability has been a very important issue, especially for safety-critical applications. Due to the diversity and multiple energy domains involved, MEMS devices are vulnerable to various failure mechanisms. MEMS reliability under different failure mechanisms should be analyzed separately. Since most of MEMS devices contain movable parts, material fatigue and aging under long-term repeated cycling load may lead to potential device failure, which in turn degrades the device reliability. In this paper, the reliability of poly-silicon MEMS comb accelerometers under material fatigue failure mechanism is analyzed. Based on ANSYS stress simulation, the mean-time-to-failure (MTTF) lifetimes and failure rates for both BISR (built-in self-repairable) and non-BISR poly-silicon MEMS comb accelerometers are derived. Simulation results show that the fatigue lifetime of MEMS accelerometers made by poly-silicon material can be good enough for general purpose applications. However, for some "weak" devices with certain structure defects, the material fatigue and aging may become potential threats. Compared to non-BISR design, BISR MEMS accelerometer demonstrates effective reliability improvement due to redundancy repair. MEMS reliability under material fatigue for other MEMS materials will be further studied in the future.

  • Why focus on building-in reliability

    None

  • Scaling-induced reductions in CMOS reliability margins and the escalating need for increased design-in reliability efforts

    Scaling, for enhanced performance and cost reduction reasons, has pushed existing CMOS materials much closer to their intrinsic reliability limits. Future robust designs will require a strong team effort whereby the design engineer must clearly understand the process variability and its impact on reliability. This strong team effort, between design and process, will become critically important as the industry is seeking to replace the very materials that has made the industry so successful: Si substrates, SiO/sub 2/ gate- dielectric, Al-based metallization and SiO/sub 2/ interconnect-dielectrics.

  • Reliability perspective of high-k gate dielectrics - what is different from SiO/sub 2/?

    This paper discusses fundamental aspects of high-k material properties for advanced CMOS, focusing on the reliability in comparison with SiO/sub 2/. It is stressed that even the most ideally processed high-k material might (inevitably) have inherent defects or defect origins. This presents a striking contrast to SiO/sub 2/, conventionally and continuously used for Si microelectronics. High-k technology is not an easy business, and tremendous efforts are required in a very wide range from fundamental research to technology push.

  • Integration and Interconnect Reliability of Warm A1 Process with CVD-A1 seed layer deposited using a novel precursor of TMAAB (trimethylarninealane borane)

    Al-plug process using chemical vapor deposited (CVD) Al seed layer prepared with trimethylaminealane borane (TMAAB) as a precursor lias been developed for sub-60 mn design-rule dynamic random access memory (DRAM). In terms of the precursor stability and the particle generation performance, the TMAAB is better as compared to methylpyrrolidine alane (MPA) due to the depression of (AIH<sub>3</sub>)<sub>x</sub> polymer formation which generates particle. Integration challenges of Al-plug process related to via-filling were successfully overcome and the device speed was improved compared to W-plug process. The yield and interconnect reliability comparable to W-pfug have been achieved in multi-level-metallization.



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