Conferences related to Materials processing

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2021 IEEE Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting

The joint meeting is intended to provide an international forum for the exchange of information on state of the art research in the area of antennas and propagation, electromagnetic engineering and radio science


2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2020 IEEE 21st International Conference on Vacuum Electronics (IVEC)

Technical presentations will range from the fundamental physics of electron emission and modulated electron beams to the design and operation of devices at UHF to THz frequencies, theory and computational tool development, active and passive components, systems, and supporting technologies.System developers will find that IVEC provides a unique snapshot of the current state-of-the-art in vacuum electron devices. These devices continue to provide unmatched power and performance for advanced electromagnetic systems, particularly in the challenging frequency regimes of millimeter-wave and THz electronics.Plenary talks will provide insights into the history, the broad spectrum of fundamental physics, the scientific issues, and the technological applications driving the current directions in vacuum electronics research.


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


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Periodicals related to Materials processing

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Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Audio, Speech, and Language Processing, IEEE Transactions on

Speech analysis, synthesis, coding speech recognition, speaker recognition, language modeling, speech production and perception, speech enhancement. In audio, transducers, room acoustics, active sound control, human audition, analysis/synthesis/coding of music, and consumer audio. (8) (IEEE Guide for Authors) The scope for the proposed transactions includes SPEECH PROCESSING - Transmission and storage of Speech signals; speech coding; speech enhancement and noise reduction; ...


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


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Most published Xplore authors for Materials processing

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Xplore Articles related to Materials processing

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Materials processing applications of moderate energy, pulsed electron beams

International Conference on Plasma Science (papers in summary form only received), 1995

Summary form only given, as follows. Intense, pulsed electron and ion beams with very high peak power have been available for over two decades, but these devices have generally not been suitable for industrial applications such as materials processing. Such applications generally require repetitively-pulsed beam sources with high average power. A number of potential applications have been identified for pulsed ...


Tspectral Diagnosis of Dielectric Barrier Discharge at Atmospheric Pressure

IEEE Conference Record - Abstracts. 2005 IEEE International Conference on Plasma Science, 2005

Summary form only given. The dielectric barrier discharge (DBD) is characterized by the presence of at least one insulating layer in contact with the discharge between two planar or cylindrical electrodes connected to an AC power supply. The main advantage of this type of electrical discharge is that non-equilibrium plasma conditions in atmospheric-pressure gases can be maintained in an economic ...


2.45 GHz microwave atmospheric plasma for UK Foresight Vehicle

IEEE Conference Record - Abstracts. 2002 IEEE International Conference on Plasma Science (Cat. No.02CH37340), 2002

Summary form only given, as follows. Atmospheric microwave plasma technology, which was previously developed by The University of Liverpool for material processing, has been used as part of the future missions for the UK Foresight Vehicle Link programme for reducing harmful exhaust emissions from petrol, LPG and diesel engines. The Microcat system works at 2.45 GHz, so a low-cost, mass-produced ...


Characterization and Modeling of Miniature Microwave Discharges Used for Materials Processing

2007 IEEE 34th International Conference on Plasma Science (ICOPS), 2007

Summary form only given. This paper measures the plasma density and plasma gas temperature experimentally using Langmuir probe and optical emission spectroscopy techniques. The operating pressures range from 1 Torr to 100's Torr. The microwave powers utilized range from a few Watts to 100 Watts. The plasma discharge in the tube discharge region is modeled using both a global model ...


Numerical simulation of sputtering via the feature profile simulator

2010 Abstracts IEEE International Conference on Plasma Science, 2010

Summary form only given. Numerical simulation of etching/deposition profiles is an important factor for semiconductor industry, as it allows analysis and prediction of the outcome of materials processing on a micron and sub-micron scale. A feature profile simulator has to be able to treat various chemical/physical processes taking place at or near the surfaces, which definitely include sputtering. Physical/chemical sputtering ...


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Educational Resources on Materials processing

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IEEE.tv Videos

Spatial-Spectral Materials for High Performance Optical Processing - IEEE Rebooting Computing 2017
IRDS: Beyond CMOS & Emerging Research Materials - Shamik Das at INC 2019
Amalga: Alternative to MEMS Technology for Miniature RF Components
EMBC 2011-Keynote-From Nature and Back Again ... Giving New Life to Materials for Energy, Electronics, Medicine and the Environment - Angela Belcher, PhD
IMS 2012 Microapps - Bonding Materials used in Multilayer Microwave PCB Applications
Advances in MgB2 - ASC-2014 Plenary series - 7 of 13 - Wednesday 2014/8/13
Superconductors for the Future from the Perspective of the Past
Introduction to Chip Multiprocessor Architecture
Hamid R Tizhoosh - Fuzzy Image Processing
Unconventional Superconductivity: From History to Mystery
Wanda Reder: Educational Materials for Expert and Non-Expert — IEEE Power and Energy Society’s “Plain Talk” — Studio Tech Talks: Sections Congress 2017
IEEE Signal Processing Society Awards - ICASSP 2020
Nanotechnology, we are already there: APEC 2013 KeyTalk with Dr. Terry Lowe
Multi-Function VCO Chip for Materials Sensing and More - Jens Reinstaedt - RFIC Showcase 2018
Lunar Industrialization: The First Step to the Solar System
ICASSP 2011 Trends in Machine Learning for Signal Processing
ICASSP 2010 - New Signal Processing Application Areas
Alan S. Willsky - IEEE Jack S. Kilby Signal Processing Medal, 2019 IEEE Honors Ceremony
ICASSP 2011 Trends in Design and Implementation of Signal Processing Systems
Unique Fixtures for Characterizing Electromagnetic Properties of Materials at THz Frequencies: MicroApps 2015 - Keysight Technologies

IEEE-USA E-Books

  • Materials processing applications of moderate energy, pulsed electron beams

    Summary form only given, as follows. Intense, pulsed electron and ion beams with very high peak power have been available for over two decades, but these devices have generally not been suitable for industrial applications such as materials processing. Such applications generally require repetitively-pulsed beam sources with high average power. A number of potential applications have been identified for pulsed electron and ion beams, but the primary emphasis has been on high energy (/spl ges/1 MeV) and short pulse lengths (/spl les/0.1 /spl mu/sec). This report examines potential applications for pulsed electron beams with lower energies but much longer pulse lengths (/spl ges/1 /spl mu/sec). The applications include thin film deposition, bonding of dissimilar materials, production of fine-grained materials such as nanocrystalline ceramics, and surface modification. Preliminary experimental results illustrating a novel multi-layer bonding process are presented.

  • Tspectral Diagnosis of Dielectric Barrier Discharge at Atmospheric Pressure

    Summary form only given. The dielectric barrier discharge (DBD) is characterized by the presence of at least one insulating layer in contact with the discharge between two planar or cylindrical electrodes connected to an AC power supply. The main advantage of this type of electrical discharge is that non-equilibrium plasma conditions in atmospheric-pressure gases can be maintained in an economic and reliable way. This has led to a number of important applications including industrial ozone generation, plasma-chemical vapor deposition, pollution control, excitation of CO<sub>2</sub> lasers, excimer lamps, and most recently, large-area flat plasma-display panels, in which extensive work in material processing has been done successfully. In this paper, the spectral lines of plasma emission at atmospheric pressure were recorded by using a grating spectrograph and all signals will be sent to the computer directly and immediately for data processing and analysis during the experiment. The purpose of the study is to control the process of materials' surface modification promptly. The experimental results indicate that a critical discharge gap is an important parameter to improve the quality of materials processing, and spectral diagnosis has been proved a workable method by choosing a suitable discharge gap. The result is of great importance to DBD at atmospheric pressure and its application to materials processing

  • 2.45 GHz microwave atmospheric plasma for UK Foresight Vehicle

    Summary form only given, as follows. Atmospheric microwave plasma technology, which was previously developed by The University of Liverpool for material processing, has been used as part of the future missions for the UK Foresight Vehicle Link programme for reducing harmful exhaust emissions from petrol, LPG and diesel engines. The Microcat system works at 2.45 GHz, so a low-cost, mass-produced version could be developed using domestic microwave oven components. Unlike conventional catalysts, which have to reach a temperature of 350-400/spl deg/C to operate correctly, Microcat will begin working as soon as power is applied. The Microcat system is also tolerant of fuel contamination and does not restrict the flow of the exhaust gas.

  • Characterization and Modeling of Miniature Microwave Discharges Used for Materials Processing

    Summary form only given. This paper measures the plasma density and plasma gas temperature experimentally using Langmuir probe and optical emission spectroscopy techniques. The operating pressures range from 1 Torr to 100's Torr. The microwave powers utilized range from a few Watts to 100 Watts. The plasma discharge in the tube discharge region is modeled using both a global model and a surface wave discharge model. The flow of the plasma discharge/beam from the source, through the aperture and down to the substrate surface is also modeled. The modeling results will be compared to experimental data showing the size and shape of the region processed by the plasma discharge/beam.

  • Numerical simulation of sputtering via the feature profile simulator

    Summary form only given. Numerical simulation of etching/deposition profiles is an important factor for semiconductor industry, as it allows analysis and prediction of the outcome of materials processing on a micron and sub-micron scale. A feature profile simulator has to be able to treat various chemical/physical processes taking place at or near the surfaces, which definitely include sputtering. Physical/chemical sputtering is a complex process, depending not only on the species and materials involved (incident ions and target materials) but also, for example, on energies of striking ions and their angles of incidence. There is significant experimental database as well as numerous theoretical and empirical considerations for sputtering of elemental targets. However, most of that was specifically applicable to high ion energies, usually significantly higher than the typical ion energy during the plasma materials processing. Numerical simulation tools such for example, as the Monte Carlo codes, MARLOWE and TRIM, were developed, but again, for the higher energy ions. In this report, we present analysis and simulation of sputtering for most of the elemental targets and various incident ions, carried out with the feature profile code FPS-3D. The FPS-3D code allows general distribution of particle fluxes on energy and angle. However, for the present studies, the flux of ions was set as a beam at particular energy and angle. That allowed us to compare simulation results more directly with available experimental data and literature. The FPS-3D simulator uses input, chemistry, and flux files to specify all the simulation parameters, and does not require recompilation for different species, energies or angles. We are thankful to HFS for providing us with the RANGE code, capable of calculating penetration depth of ions and their sputter yields, and with the advanced graphics package utilized in the FPS-3D code for viewing of evolving profiles during the simulation runs.

  • Collisional ion energy distribution (IED) model for single frequency capacitive discharges

    Summary form only given. The distributions of particles on substrate surfaces are very important for materials processing, and it is valuable to develop fast computation models to predict and control them. A model is developed to determine the ion energy distribution (IED) from the tool measurements in a single-frequency driven capacitive discharge in a collisional sheath regime. The sheath width and sheath voltage are estimated from the external control parameters by an analytical model (M.A. Lieberman and A.J. Lichtenberg, 2005). The results are verified very well by 1D particle-in-cell (PIC) simulations. The ion mean free path is considered to be a known function of energy, and the sheath voltage and sheath width are independent of time and position in preliminary work. It is found that with various dependences of the ion mean free path on energy, the IEDs exhibit markedly different profiles. To verify our collisional sheath model with PIC simulations and experiments, it is necessary to consider rf-driven collisional sheath dynamics.

  • Generation of hyperthermal neutral beam for the material processing

    Summary form only given, as follows. Hyperthermal neutrals with energy levels between 2 eV and 100 eV can be utilized for a diagnostic tool for the boundary region of fusion plasmas, for the space environment on Earth orbiting spacecraft, and for a surface modification and material's processing. DEGAS 2, Monte-Carlo neutral transport code, follows the trajectory of each neutral in the pancake-style ICP source, in which the reflective neutrals are generated. The code, the plasma density at the reflector, and power coupling optimize the height of the ICP source to maximize the neutral flux out of the ICP source. Using DEGAS 2 code we can calculate the flux and energy distribution of the hyperthermal beam at interesting positions. The measurement of particle energy distribution using NPA (neutral particle analyzer) will be discussed. Also, Langmuir probe measurement in the slim plasma source and the removal of a PR (photo resistor) on silicon wafer as the evidence of extracting hyperthermal neutral beam out of the plasma source will be presented.

  • Application of gyrotrons in research and industrial technologies

    Summary form only given. The creation of gyrotrons (sources of high-power electromagnetic radiation in the millimeter wavelength range) reveals new possibilities for development of efficient tools for scientific experiments and promising technologies for industrial material processing. This presentation reviews the physical basics of gyrotron applications including plasma heating and current drive in magnetic fusion setups, the creation of sources of dense plasma and beams of multi-charge ions, the deposition of polycrystalline diamond films by the CVD method, and the annealing of semiconductor structures.

  • Optimal design of inductively coupled plasma torch using parametric study and design sensitivity analysis

    Summary form only given, as follows. A parametric study and a design sensitivity analysis have been carried out to find the optimal design conditions and thermal plasma configurations of an Inductively Coupled Plasma (ICP) torch. Firstly, the parametric study is conducted with the following criteria on thermal plasma properties; i) sufficiently high temperature ( > 8000 K), ii) a large volume of hot temperature, and iii) no recirculating flow near the torch inlet. Next, the sensitivity of plasma temperature distributions is derived from the results of parametric study by estimating the optimal ranges of parameters and giving the initial guessing values for the sensitivity analysis. The derived sensitivity of plasma temperature distributions is analyzed using the gradient method for the thermal plasma configurations to produce the broader hot region and more uniform temperature distributions. Finally, these two results are compared, and the optimum design values for ICP torches of 15 kW usable for material processing are presented.

  • Beam propagation options for intense electron beams in welding and materials processing applications

    Summary form only given. A typical high-intensity electron-beam device for welding and materials processing applications might produce beams with energies of several MeV, currents of 0.1-10 kA, radii as small as 1 mm, pulse lengths of tens of nsec, and pulse repetition rates up to several kHz. This dramatic increase in beam energy and peak power offers several new capabilities, including the potential for self-pinched propagation in ambient air over distances of a few tens of cm. This capability would eliminate the need for vacuum pumping and magnetic focusing required for most present-day electron beam welders. The choice of beam parameters in the high-power regime is found to be constrained mainly by gas scattering and the resistive hose instability. For applications such as welding which would require very tight beams, the emittance tailoring techniques often used to control the instability in present experiments are not expected to be effective in this regime, and the stable propagation range is expected to be only a few betatron wavelengths. Nevertheless, a wide range of acceptable parameters is available, especially when use is made of a narrow conducting pipe to guide the beam to the workpiece.



Standards related to Materials processing

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No standards are currently tagged "Materials processing"