Conferences related to Manufacturing processes

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2021 IEEE Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting

The joint meeting is intended to provide an international forum for the exchange of information on state of the art research in the area of antennas and propagation, electromagnetic engineering and radio science


2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2020 IEEE 16th International Workshop on Advanced Motion Control (AMC)

AMC2020 is the 16th in a series of biennial international workshops on Advanced Motion Control which aims to bring together researchers from both academia and industry and to promote omnipresent motion control technologies and applications.


2020 IEEE 18th International Conference on Industrial Informatics (INDIN)

INDIN focuses on recent developments, deployments, technology trends, and research results in Industrial Informatics-related fields from both industry and academia


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Periodicals related to Manufacturing processes

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Automation Science and Engineering, IEEE Transactions on

The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...


Communications, IEEE Transactions on

Telephone, telegraphy, facsimile, and point-to-point television, by electromagnetic propagation, including radio; wire; aerial, underground, coaxial, and submarine cables; waveguides, communication satellites, and lasers; in marine, aeronautical, space and fixed station services; repeaters, radio relaying, signal storage, and regeneration; telecommunication error detection and correction; multiplexing and carrier techniques; communication switching systems; data communications; and communication theory. In addition to the above, ...


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Most published Xplore authors for Manufacturing processes

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Xplore Articles related to Manufacturing processes

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Analog Optoelectronic Module Development TRIP

IEEE/LEOS 1995 Digest of the LEOS Summer Topical Meetings. Flat Panel Display Technology, 1995

None


Invited: Modern MOS semiconductor processing methods

1974 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1974

A recently completed 3" MOS-LSI wafer processing facility will be described, including ion implantation, automatic wafer handling, automatic mask allignment and design automation aids. Emphasis will be on techniques useful in LSI design and processing.


A 35ns 128K fusible bipolar PROM

1986 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1986

A bipolar PROM using 2μm slot-isolation technology will be reported. Circuits include a column-current multiplexer and temperature-compensated sensing. The die size is 306×224 mil2.


Billion-Transistor Architectures

Computer, 1997

None


IEEE/IEC Draft Standard for Large Scale Manufacturing of Nanoelectronics

IEC 62659 Ed.1, October 2011, 2013

This standard provides a framework for introducing nanomaterials such as graphene into large scale, high volume manufacturing in established semiconductor factories (fabs). Since semiconductor fabs must incorporate practices that maintain high yields, there are very strict requirements for how manufacturing is performed. Nanomaterials represent a potential contaminant in semiconductor fabs, and must be introduced in a structured and methodical way.


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Educational Resources on Manufacturing processes

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IEEE.tv Videos

Dr. Bernd Kosch on Industrie 4.0 and manufacturing - WF-IoT 2015
MicroApps: Implications of Emerging Technologies on Power Amplifer Manufacturing Test Speed (Agilent Technologies)
Jim Davis on Deploying IoT in Manufacturing and Supply Chains - WF-IoT 2015
IMS 2011 Microapps - Volume Manufacturing Trends for Automotive Radar Devices
Care Innovations: Toxics In Electronics (com legendas em portugues)
U.S. Department of Energy Advanced Manufacturing Overview - Dev Shenoy: 2016 International Conference on Rebooting Computing
Stephen Mellor: Challenges of Deploying IoT in Manufacturing - WF-IoT 2015
Niobium Manufacturing for Superconductivity - ASC-2014 Plenary series - 5 of 13 - Tuesday 2014/8/12
IRDS: Yield Enhancement - Slava Libman at INC 2019
Integrated Photonics Manufacturing Initiative - Michael Liehr Plenary from the 2016 IEEE Photonics Conference
Soft, Printable, and Small: An Overview of Manufacturing Methods for Novel Robots at Harvard
Heterogeneous Photonic Packaging - John Osenbach - IPC 2018
Smart Manufacturing: Embracing the Digital Revolution - Jane Barr at IEEE WIE Forum USA East 2017
Sergio Gusmeroli: CPS and IoT in Manufacturing - WF-IoT 2015
All You Wanted to Know About Chinese Manufacturing But Were Afraid to Ask
Consistent, Reliable and Peak-Performing PCB Assemblies: MicroApps 2015 - Zentech Manufacturing, Inc.
EDOC 2010 - Dragan Gasevic Keynote
Panel Discussion: IoT in Manufacturing - WF-IoT 2015
2013 IEEE Robert N. Noyce Medal
Inspiring Brilliance: The Impact on Engineering of Maxwell's articles on Structural Mechanics

IEEE-USA E-Books

  • Analog Optoelectronic Module Development TRIP

    None

  • Invited: Modern MOS semiconductor processing methods

    A recently completed 3" MOS-LSI wafer processing facility will be described, including ion implantation, automatic wafer handling, automatic mask allignment and design automation aids. Emphasis will be on techniques useful in LSI design and processing.

  • A 35ns 128K fusible bipolar PROM

    A bipolar PROM using 2μm slot-isolation technology will be reported. Circuits include a column-current multiplexer and temperature-compensated sensing. The die size is 306×224 mil2.

  • Billion-Transistor Architectures

    None

  • IEEE/IEC Draft Standard for Large Scale Manufacturing of Nanoelectronics

    This standard provides a framework for introducing nanomaterials such as graphene into large scale, high volume manufacturing in established semiconductor factories (fabs). Since semiconductor fabs must incorporate practices that maintain high yields, there are very strict requirements for how manufacturing is performed. Nanomaterials represent a potential contaminant in semiconductor fabs, and must be introduced in a structured and methodical way.

  • Fiber Optic Installation

    Whether your installation is for short distance campus environments, long distance underground, aerial placement or a specialized installation such as submarine, air blown fiber, or pressurized cable, the use of fiber optic cable requires proper techniques for a successful installation. Today's installers and designers must address building codes and standards, environmental issues, proper design, routing, and equipment for installations involving fiber optic cable. Topologies, applications and reliability concerns must be addressed. This video covers these issues and many more involving the proper placement of optical communication systems for LANs, WANs and MANs.

  • LSI in telephone subscribers and peripheral equipments

    Although a telephone laboratory gave birth to the transistor, solid-state technology has yet to have its full anticipated impact on the telephone system. This phenomenon is partly explained by the tremendous investment in electromechanical equipment and its operating environment. Technical factors with integrated circuit capabilities increasing, and cost declining, and organization changes in the industry, are now entering a solid-state revolution which the panel will explore.

  • A single-chip sequential logic element

    A field-programmable logic sequencer, containing, on one chip, all of the circuitry required to implement an 11MHz synchronous sequential-state machine, will be covered. Nichrome fuse link technology has been used to afford direct entry of state transitions.

  • Simox 1992: Materials and Technology

    None

  • Plastisol coating armour wire for submarine cable

    It is concluded that plastisol coating armouring improves elongation and revolution performances because of their large size of steel wire. In addition as the specific gravity of the cable is increased, removability of the cable on the sea bottom will be improved. The possibilities of "spew" and "kink" of the cable under practical operations will also be improved.



Standards related to Manufacturing processes

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No standards are currently tagged "Manufacturing processes"