Conferences related to MOS capacitors

Back to Top

2020 IEEE International Solid- State Circuits Conference - (ISSCC)

ISSCC is the foremost global forum for solid-state circuits and systems-on-a-chip. The Conference offers 5 days of technical papers and educational events related to integrated circuits, including analog, digital, data converters, memory, RF, communications, imagers, medical and MEMS ICs.


2019 10th International Conference on Power Electronics and ECCE Asia (ICPE 2019 - ECCE Asia)

1. Power Electronic Devices (Si and Wide band-gap) and Applications, 2. Power electronic packaging and integration, 3. Modeling, Simulation and EMI, 4. Lighting Technologies and Applications, 5. Wireless Power Transfer, 6. Uncontrolled Rectifiers and AC/DC Converters, 7. AC/AC Converters, 8. DC/AC Inverters, 9. DC/DC Converters, 10. Multilevel Power Converters, 11. Electric Machines, Actuators and Sensors, 12. Motor Control and Drives, 13. Sensorless and Sensor-Reduction Control, 14. Renewable Energy and Distributed Generation Systems, 15. Smart/Micro Grid, 16. DC Distribution 17. Power Quality (or Power Electronics for Utility Interface), 18. Energy Storage and Management Systems, 19. Power Electronics for Transportation Electrification, 20. Reliability, diagnosis, prognosis and protection, 21. High Voltage DC Transmission, 22. Other Selected Topics in Power Electronics

  • 2015 IEEE 9th International Conference on Power Electronics and ECCE Asia (ICPE-ECCE Asia)

    Power electronics, renewable energy, electric vehicle, smart grid

  • 2014 International Power Electronics Conference (IPEC-Hiroshima 2014 ECCE-ASIA)

    The seventh International Power Electronics Conference, IPEC-Hiroshima 2014 -ECCE Asia-, will be held from May 18 to May 21, 2014 in Hiroshima, Japan. The conference venue will be the International Conference Center Hiroshima, which is located in Hiroshima Peace Memorial Park. Power electronics has been providing numerous new technologies in the fields of electric energy conversion and motor drive systems for more than 40 years. In recent years, global energy and environmental issues are becoming more serious and power electronics is expected to play a key role in solving such problems. The IPEC-Hiroshima 2014 -ECCE Asia- will provide a unique opportunity for researchers, engineers, and academics from all over the world to present and exchange the latest information on power electronics, motor drives, and related subjects.

  • 2011 IEEE 8th International Conference on Power Electronics & ECCE Asia (ICPE 2011- ECCE Asia)

    01. Power Semiconductor Devices and Packaging 02. Modeling, Simulation, EMI and Reliability 03. Electric Machines, Actuators and Sensors 04. Motor Control and Drives 05. Sensorless Control 06. Renewable Green Energy (Wind, Solar, Tidal Power Generation) 07. Micro Grid and Distributed Generation 08. Electric Propulsion System (EV, Train, Electric Ship) 09. Electric and Hybrid Vehicles 10. Power Supplies and EV Chargers 11. Power Electronics and Drives for Home Appliance 12. Power Elect

  • 2007 7th International Conference on Power Electronics (ICPE)

    - Power Semiconductor Devices - DC-DC Converters - Inverters and Inverter Control Techniques - Motor Drives - Rectifiers and AC-AC Converters - Renewable Energy - Power Quality and Utility Applications - Automotive Applications and Traction Drives - Energy Storage - Control Techniques Applied to Power Electronics - Modeling, Analysis, and Simulation - Consumer Applications - Other Power Applications


2019 32nd International Conference on VLSI Design and 2019 18th International Conference on Embedded Systems (VLSID)

This conference is a forum for researchers and designers to present and discuss variousaspects of VLSI design, EDA, embedded systems, and enabling technologies. The program willconsist of regular paper sessions, special sessions, embedded tutorials, panel discussions,design contest, industrial exhibits and tutorials. This is the premier conference/exhibition in thisarea in India, attracting designers, EDA professionals, and EDA tool users. The programcommittee for the conference has a significant representation from the EDA researchcommunity and a large fraction of the papers published in this conference are EDA-related


2019 IEEE 9th International Nanoelectronics Conferences (INEC)

Topics of Interests (but not limited to)• Application of nanoelectronic• Low-dimensional materials• Microfluidics/Nanofluidics• Nanomagnetic materials• Carbon materials• Nanomaterials• Nanophotonics• MEMS/NEMS• Nanoelectronic• Nanomedicine• Nano Robotics• Spintronic devices• Sensor and actuators• Quality and Reliability of Nanotechnology


2019 IEEE Energy Conversion Congress and Exposition (ECCE)

IEEE-ECCE 2019 brings together practicing engineers, researchers, entrepreneurs and other professionals for interactive and multi-disciplinary discussions on the latest advances in energy conversion technologies. The Conference provides a unique platform for promoting your organization.

  • 2018 IEEE Energy Conversion Congress and Exposition (ECCE)

    The scope of ECCE 2018 includes all technical aspects of research, design, manufacture, application and marketing of devices, components, circuits and systems related to energyconversion, industrial power and power electronics.

  • 2017 IEEE Energy Conversion Congress and Exposition (ECCE)

    ECCE is the premier global conference covering topics in energy conversion from electric machines, power electronics, drives, devices and applications both existing and emergent

  • 2016 IEEE Energy Conversion Congress and Exposition (ECCE)

    The Energy Conversion Congress and Exposition (ECCE) is focused on research and industrial advancements related to our sustainable energy future. ECCE began as a collaborative effort between two societies within the IEEE: The Power Electronics Society (PELS) and the Industrial Power Conversion Systems Department (IPCSD) of the Industry Application Society (IAS) and has grown to the premier conference to discuss next generation technologies.

  • 2015 IEEE Energy Conversion Congress and Exposition

    The scope of ECCE 2015 includes all technical aspects of research, design, manufacture, application and marketing of devices, components, circuits and systems related to energy conversion, industrial power and power electronics.

  • 2014 IEEE Energy Conversion Congress and Exposition (ECCE)

    Those companies who have an interest in selling to: research engineers, application engineers, strategists, policy makers, and innovators, anyone with an interest in energy conversion systems and components.

  • 2013 IEEE Energy Conversion Congress and Exposition (ECCE)

    The scope of the congress interests include all technical aspects of the design, manufacture, application and marketing of devices, components, circuits and systems related to energy conversion, industrial power conversion and power electronics.

  • 2012 IEEE Energy Conversion Congress and Exposition (ECCE)

    The IEEE Energy Conversion Congress and Exposition (ECCE) will be held in Raleigh, the capital of North Carolina. This will provide a forum for the exchange of information among practicing professionals in the energy conversion business. This conference will bring together users and researchers and will provide technical insight as well.

  • 2011 IEEE Energy Conversion Congress and Exposition (ECCE)

    IEEE 3rd Energy Conversion Congress and Exposition follows the inagural event held in San Jose, CA in 2009 and 2nd meeting held in Atlanta, GA in 2010 as the premier conference dedicated to all aspects of energy processing in industrial, commercial, transportation and aerospace applications. ECCE2011 has a strong empahasis on renewable energy sources and power conditioning, grid interactions, power quality, storage and reliability.

  • 2010 IEEE Energy Conversion Congress and Exposition (ECCE)

    This conference covers all areas of electrical and electromechanical energy conversion. This includes power electrics, power semiconductors, electric machines and drives, components, subsystems, and applications of energy conversion systems.

  • 2009 IEEE Energy Conversion Congress and Exposition (ECCE)

    The scope of the conference include all technical aspects of the design, manufacture, application and marketing of devices, circuits, and systems related to electrical energy conversion technology


More Conferences

Periodicals related to MOS capacitors

Back to Top

Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Circuits and Systems I: Regular Papers, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Communications, IEEE Transactions on

Telephone, telegraphy, facsimile, and point-to-point television, by electromagnetic propagation, including radio; wire; aerial, underground, coaxial, and submarine cables; waveguides, communication satellites, and lasers; in marine, aeronautical, space and fixed station services; repeaters, radio relaying, signal storage, and regeneration; telecommunication error detection and correction; multiplexing and carrier techniques; communication switching systems; data communications; and communication theory. In addition to the above, ...


Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.


More Periodicals

Most published Xplore authors for MOS capacitors

Back to Top

Xplore Articles related to MOS capacitors

Back to Top

A 64Kb MOS dynamic RAM

1979 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1979

A memory cell using a three-layer polysilicon process will be reported. Described, too, will be a dummy cell and sense amplifier configuration.


Single-chip cursive character generator

1975 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1975

A circuit design embodying a complete 48-stroke character generator on a single MOS integrated circuit, will be described. Circuit accepts 7-bit ASC11 code and outputs x, y and z analog signals to generate any one of 32 standard ASC11 characters in approximately 5μs with a bandwidth of 5 MHz.


A new, insulated-gate transistor

1966 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1966

None


A 32K static RAM utilizing a three-transistor cell

1981 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1981

This paper will discuss the use of a 3-transistor memory cell, with two cross- coupled transistors, an access transistor and a MOS capacitor, that affords static operation and low standby power operation.


A three transistor MOS memory cell with internal refresh

1972 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1972

A 1024-bit N-channel read/write memory has been fabricated using a memory call composed of three minimum geometry transistors. Each cell includes refresh circuitry within its 6.7 mil<sup>2</sup>area.


More Xplore Articles

Educational Resources on MOS capacitors

Back to Top

IEEE-USA E-Books

  • A 64Kb MOS dynamic RAM

    A memory cell using a three-layer polysilicon process will be reported. Described, too, will be a dummy cell and sense amplifier configuration.

  • Single-chip cursive character generator

    A circuit design embodying a complete 48-stroke character generator on a single MOS integrated circuit, will be described. Circuit accepts 7-bit ASC11 code and outputs x, y and z analog signals to generate any one of 32 standard ASC11 characters in approximately 5μs with a bandwidth of 5 MHz.

  • A new, insulated-gate transistor

    None

  • A 32K static RAM utilizing a three-transistor cell

    This paper will discuss the use of a 3-transistor memory cell, with two cross- coupled transistors, an access transistor and a MOS capacitor, that affords static operation and low standby power operation.

  • A three transistor MOS memory cell with internal refresh

    A 1024-bit N-channel read/write memory has been fabricated using a memory call composed of three minimum geometry transistors. Each cell includes refresh circuitry within its 6.7 mil<sup>2</sup>area.

  • DBIMOS: the mix in one approach

    The DBIMOS technology is a major step forward towards system integration. The 100 V DBIMOS, 40 V bipolar and 18 V CMOS transistors allow the smart interface market to be served. This market demands high performance analog functions, advanced signal processing, logic circuitry and high voltage and high current drivers to be combined on a cell-based ASIC. The target market, the technology, cell library and a typical application are presented.<<ETX>>

  • Vertical charge-coupled devices

    None

  • Charge injection imaging

    None

  • A dual monolithic power operational amplifier

    A new fully-protected dual power amplifier has been developed for audio and servo systems. Special circuitry has been added to solve turn-on problems, with symmetry used to minimize thermal feedback and thermal cross-coupling.

  • A 32K ROM using differential ramp techniques

    This paper will cover a 32K ROM using standard P-channel, low-voltage, high- yielding processing. It utilizes a differential ramp technique coupled with ground switching to achieve a relatively small chip size, low power consumption of 14 &#956;W bit (450 mW) and operation from dc to 1.6 MHz.



Standards related to MOS capacitors

Back to Top

No standards are currently tagged "MOS capacitors"


Jobs related to MOS capacitors

Back to Top