Conferences related to Joining materials

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2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE International Conference on Plasma Science (ICOPS)

IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.


2020 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM)

All topics related to engineering and technology management, including applicable analytical methods and economical/social/human issues to be considered in making engineering decisions.


2020 IEEE International Magnetic Conference (INTERMAG)

INTERMAG is the premier conference on all aspects of applied magnetism and provides a range of oral and poster presentations, invited talks and symposia, a tutorial session, and exhibits reviewing the latest developments in magnetism.



Periodicals related to Joining materials

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Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Audio, Speech, and Language Processing, IEEE Transactions on

Speech analysis, synthesis, coding speech recognition, speaker recognition, language modeling, speech production and perception, speech enhancement. In audio, transducers, room acoustics, active sound control, human audition, analysis/synthesis/coding of music, and consumer audio. (8) (IEEE Guide for Authors) The scope for the proposed transactions includes SPEECH PROCESSING - Transmission and storage of Speech signals; speech coding; speech enhancement and noise reduction; ...


Automation Science and Engineering, IEEE Transactions on

The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...



Most published Xplore authors for Joining materials

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Xplore Articles related to Joining materials

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Development of Flexible Joint for 500kV A1-Sheathed

IEEE Power Engineering Review, 1992

None


Nonlinear electrical modeling for the resistance spot welding process

Proceedings of the 1999 American Control Conference (Cat. No. 99CH36251), 1999

This paper deals with the nonlinear modeling of the electrical subsystem associated with the resistance spot welding (RSW) process. This will be used in the design of model-based nonlinear control strategies to achieve welds of good quality. Switched-state, thyristor driven, linear and nonlinear transformer models have been developed that characterize the electrical dynamics. A detailed parameter estimation algorithm has also ...


Joint services automatic test program - revisited

International Automatic Testing Conference AUTOTESTCON '78., 1978

Early in 1978, the Joint Logistic Commanders established a Panel on Automatic Testing. The Panel developed a Study Plan, which defines 20 tasks to be accomplished in Automatic resting by thie SeYvjr_C-_;, Subpanels covering Manage ment, Acquisition Support, and Testing Technology are operating and have defined over 100 subtasks to be performed. Progress will be monitored by a Management Information ...


Wavefront analysis - theory and practice

Conference on Lasers and Electro-Optics, 2003. CLEO '03., 2003

Concepts, measurement, and reconstruction techniques for the wavefront of optical beams are considered. The significance of the wavefront is discussed in terms of correctability, beam-propagation, and quality, for increasing levels of complexity, reaching from the geometric optical approximation to the scalar theory of partial coherent beams. Experimental results are presented for the Hartmann-Shack sensor.


Case study on the validation of SAC305 and SnCu-based solders in SMT, wave and hand-soldering at the contract assembler level

2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces, 2007

At the contractor level once a product is required to be soldered with lead- free solders all the processes must be assessed as to insure the same quality a customer has been accustomed to with a Sn63Pb37 process is achieved. The reflow, wave soldering and hand assembly processes must all be optimized carefully to insure good joint formation as per ...



Educational Resources on Joining materials

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IEEE.tv Videos

IEEE PELS Webinar Series-Galvanic Isolation for Power Supply Applications
EMBC 2011-Keynote-From Nature and Back Again ... Giving New Life to Materials for Energy, Electronics, Medicine and the Environment - Angela Belcher, PhD
IMS 2012 Microapps - Bonding Materials used in Multilayer Microwave PCB Applications
Spatial-Spectral Materials for High Performance Optical Processing - IEEE Rebooting Computing 2017
Vlatka Paunovic: Why I am an Engineer
Panel: Ethics in AI - Impacts of (Anti?) Social Robotics - VIC Summit 2019
IEEE Collabratec: Joining a Community
Unconventional Superconductivity: From History to Mystery
Wanda Reder: Educational Materials for Expert and Non-Expert — IEEE Power and Energy Society’s “Plain Talk” — Studio Tech Talks: Sections Congress 2017
Multi-Function VCO Chip for Materials Sensing and More - Jens Reinstaedt - RFIC Showcase 2018
Robotics History: Narratives and Networks Oral Histories: Petar Kokotovic
Unique Fixtures for Characterizing Electromagnetic Properties of Materials at THz Frequencies: MicroApps 2015 - Keysight Technologies
Care Innovations: Green Engineering (com legendas em portugues)
Nanotechnology, we are already there: APEC 2013 KeyTalk with Dr. Terry Lowe
2013 IEEE Corporate Innovation Award
MicroApps: Fast, Accurate and Nondestructive Solutions of Materials Test up to 1.1 THz (Agilent Technologies)
Magnetic Materials and Magnetic Devices - Josep Fontcuberta: IEEE Magnetics Distinguished Lecture 2016
Welcoming Remarks - Internet Inclusion: Global Connect Stakeholders Advancing Solutions, Washington DC, 2016
Developing Automated Analysis Tools for Space/Time Sidechannel Detection - IEEE SecDev 2016
Welcome Introduction - Jim Jefferies - WIE ILC 2018

IEEE-USA E-Books

  • Development of Flexible Joint for 500kV A1-Sheathed

    None

  • Nonlinear electrical modeling for the resistance spot welding process

    This paper deals with the nonlinear modeling of the electrical subsystem associated with the resistance spot welding (RSW) process. This will be used in the design of model-based nonlinear control strategies to achieve welds of good quality. Switched-state, thyristor driven, linear and nonlinear transformer models have been developed that characterize the electrical dynamics. A detailed parameter estimation algorithm has also been implemented to identify the circuit parameters and the models have been validated against experimental results.

  • Joint services automatic test program - revisited

    Early in 1978, the Joint Logistic Commanders established a Panel on Automatic Testing. The Panel developed a Study Plan, which defines 20 tasks to be accomplished in Automatic resting by thie SeYvjr_C-_;, Subpanels covering Manage ment, Acquisition Support, and Testing Technology are operating and have defined over 100 subtasks to be performed. Progress will be monitored by a Management Information System. Results of the Industry/Joint Services Automatic Test Project will play an important part in this program.

  • Wavefront analysis - theory and practice

    Concepts, measurement, and reconstruction techniques for the wavefront of optical beams are considered. The significance of the wavefront is discussed in terms of correctability, beam-propagation, and quality, for increasing levels of complexity, reaching from the geometric optical approximation to the scalar theory of partial coherent beams. Experimental results are presented for the Hartmann-Shack sensor.

  • Case study on the validation of SAC305 and SnCu-based solders in SMT, wave and hand-soldering at the contract assembler level

    At the contractor level once a product is required to be soldered with lead- free solders all the processes must be assessed as to insure the same quality a customer has been accustomed to with a Sn63Pb37 process is achieved. The reflow, wave soldering and hand assembly processes must all be optimized carefully to insure good joint formation as per the appropriate class of electronics with new solder alloys and often new fluxes. The selection of soldering materials and fluxes are important as to insure high quality solder joints with leadfree solders which tend to wet slower than leaded solders but also the process equipment must be lead-free process compatible. Components must be lead-free and able to meet the thermal requirements of the process but also the MSL (moisture sensitivity limits) must be observed. Board finish must be lead-free and the PCB must be able to sustain higher process temperature cycles with no physical damage but also good solderability to enable subsequent soldering at the wave or hand assembly. Tin-silver-copper has received much publicity in recent years as the lead-free solder of choice. The IPC Solder Value Product Council as the preferred option endorsed Sn96.5Ag3.0Cu0.5 (SAC305) for SMT assembly and most assemblers have transitioned to this alloy for their solder paste requirements. The SAC305 alloy due to its 3.0% content of silver is expensive when compared to traditional leaded process for this reason many contract manufacturers and PCBA assemblers are opting for less costly options such as tin-copper based solders for wave, selective, handsoldering, dip tinning operations. In recent years tin-copper based solders with a variety of elemental additives have emerged which improve the overall properties and performance of tin-copper solders. Tin-copper solder without the incremental additions of certain elements is rarely used but the addition of nickel or nickel and bismuth as found for example in K100 and K100LD respectively do offer improvements in wetting, joint cosmetics and in some cases solder joint reliability. In this conversion SAC305 was used for the reflow process, tin-copper-nickel based solder K100 was used in the wave soldering operation and it was also used in solder wire form for hand assembly. This paper is a summary of the experience at a medium sized assembler in achieving the customer driven mandate to go lead-free and the maintenance of production yields and quality using both tin- silver-copper and tin-copper in the assembly of high end printer boards. Over 120,000 builds were achieved with a 99.6% first pass yield for the overall soldering process.

  • Low Environmentally Impact Recovery of Gold using Cyanide Producing Bacteria

    In the electronic assembly, Au is frequently used for surface plating and a bonding wire material. To recover gold from waste electronics, the dissolution process using cyan is a popular method, however, the solution is highly toxic. Accordingly, the environmentally conscious substitute process is preferable. Chromobacterium violaceum having ability of cyanide formation and decomposition were used to dissolve Au and decompose cyanide after Au dissolution. In this study the effects of dissolved oxygen on Au dissolution was investigate as a factor of Au bioleaching and continuous and repeated batch cultures were performed for the continuous Au dissolution as a reproducing cyanide process. Dissolved oxygen concentration decreased by the bacterial respiration but the aeration could recover it and activate Au dissolution. By replacing the medium C.violaceum can produce cyanide repeatedly then 60% of Au was dissolved from Au powder after 300h immersion

  • Evaluation of Electrical Properties of Lap Joints for BSCCO and YBCO Tapes

    The joint process between tapes of coated conductors is a critical issue for the most of the applications of high temperature superconductors (HTS). Using different fabrication techniques joints of YBCO coated superconductors were prepared and characterized through electrical measurements. For soldering material low melting point eutectic alloys, such as In-Sn (m.p. 116degC) and Sn-Pb (m.p. 189degC) were selected to prepare lap joints with effective length between 1 to 20 cm. The splice resistance and the critical current of the joints were evaluated by I-V curve measurements with the maximum current strength above the critical current, in order to evaluate the degree of degradation for each joint method. Pressed lap joints prepared with tapes without external reinforcement presented low resistance lap joint nevertheless some critical current degradation occurs when strong pressing is applied. When mechanical pressure is applied during the soldering process we can reduce the thickness of the solder alloy and a residual resistance arises from contributions of high resistivity matrix and external reinforcement. The lap joints for reinforced tape were prepared using two methods: the first, using ldquoas-suppliedrdquo tape and the other after reinforcement-removal; in the latter case, the tapes were resoldered using Sn-Pb alloy. The results using several joint geometries, distinct surface preparation processes and different soldering materials are presented and analysed. The solder alloy with lower melting point and the longer joint length presented the smallest joint resistance.

  • The UV-Nanoimprint Lithography with Multi-head Nanoimprinting Unit for Sub-50nm Half-pitch Patterns

    Nanoimprint lithography is a promising technology to produce sub-50nm half- pitch features on silicon chips. The contact-based nano lithography, such as thermal and/or UV nano-imprint, is well-known as the next generation lithography. Especially, the UV nano-imprint lithography technology has advantages of the simple process, low cost, high replication fidelity, and relatively high throughput. To achieve nano-imprinting process, nano- imprinting lithography equipment must have required some multi-functional units which are imprinting head, self-alignment wafer stage, overlay and alignment system for multi-layer process, master with sub-50nm half-pitch patterns, and anti-vibration unit, etc

  • A cooperative course in quality methods

    A course in quality methods was given at Rose-Hulman Institute of Technology during the spring of 1991. Since the material of the course involves not only statistical topics but topics from production engineering as well, the course was given by two instructors and jointly listed under mathematics and mechanical engineering. The authors discuss the content of the course, laboratory experiments, and student projects. Alterations in the course based on the authors' experience and future plans are discussed.<<ETX>>

  • Experimental Investigation of Heating Phenomena in Linac Mechanical Interfaces from RF Field Penetration

    In a high duty-factor, high-current, drift-tube linear accelerator, a critical interface exists between the drift-tube stem and the tank wall. This interface must provide vacuum integrity and RF continuity, while simultaneously allowing alignment flexibility. Because of past difficulties with RF heating of vacuum bellows and RF joints encountered by others, a paucity of available information, and the high reliability requirement for the Fusion Materials Irradiation Test (FMIT) accelerator, a program was initiated to study the problem. Because RF heating is the common failure mode, an attempt was made to find a correlation between the drift-tubestem/linac-tank interface geometry and RF field penetration from the tank into the interface region. Experiments were performed at 80 MHz on an RF structure designed to simulate the conditions to which a drift-tube stem and vacuum bellows are exposed in a drift-tube linac. Additional testing was performed on a 367-MHz model of the FMIT prototype drift-tube linac. Experimental results, and a method to predict excessive RF heating, is presented. An experimentally tested solution to the problem is discussed.



Standards related to Joining materials

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No standards are currently tagged "Joining materials"