Conferences related to Isothermal processes

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2021 IEEE Pulsed Power Conference (PPC)

The Pulsed Power Conference is held on a biannual basis and serves as the principal forum forthe exchange of information on pulsed power technology and engineering.


2020 59th IEEE Conference on Decision and Control (CDC)

The CDC is the premier conference dedicated to the advancement of the theory and practice of systems and control. The CDC annually brings together an international community of researchers and practitioners in the field of automatic control to discuss new research results, perspectives on future developments, and innovative applications relevant to decision making, automatic control, and related areas.


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC)

All areas of ionizing radiation detection - detectors, signal processing, analysis of results, PET development, PET results, medical imaging using ionizing radiation


2020 Joint Conference of the IEEE International Frequency Control Symposium and International Symposium on Applications of Ferroelectrics (IFCS-ISAF)

Ferroelectric materials and applications


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Periodicals related to Isothermal processes

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.


Control Systems Technology, IEEE Transactions on

Serves as a compendium for papers on the technological advances in control engineering and as an archival publication which will bridge the gap between theory and practice. Papers will highlight the latest knowledge, exploratory developments, and practical applications in all aspects of the technology needed to implement control systems from analysis and design through simulation and hardware.


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Most published Xplore authors for Isothermal processes

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Xplore Articles related to Isothermal processes

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A bi-fet operational amplifier with 400ns settling time

1985 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1985

This paper will describe a 15MHz 30V/μs slew rate operational amplifier which settles to .01% in 400ns for a 10V step. The offset is internally trimmed to 250μV without affecting temperature drift.


A five-terminal, complementary tracking ± 15V ± 200 mA monolithic voltage regulator

1971 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1971

This paper will discuss a dual function, single-chip, IC regulator with preadjusted output voltages to within ±1%, internal frequency compensation, current limiting, maximum junction temperature shutdown, and excellent temperature stability due to a thermally symmetric die layout.


The Isothermal Wafer Level Test for VLSl Interconnect Evaluation

International Report on Wafer Level Reliability Workshop, 1992

None


Measurement of interaction fields in particulate tapes by linearization of the Henkel plot

1992 IEEE International Magnetics Conference (INTERMAG), 1992

None


Improvement of Polyimide Electrical Properties During Short-Term of Thermal Aging

2008 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, 2008

An atypical enhancement of both the dielectric properties and the static (dc) conductivity in polyimide (PI) films has been observed using isothermal dielectric relaxation spectroscopy at 300degC under air atmosphere during short-term thermal aging (up to 200h). Simultaneously, an increase of the dielectric strength of PI is observed. Despite a close similarity with the typical electrical signature of the crystallization ...


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Educational Resources on Isothermal processes

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IEEE-USA E-Books

  • A bi-fet operational amplifier with 400ns settling time

    This paper will describe a 15MHz 30V/μs slew rate operational amplifier which settles to .01% in 400ns for a 10V step. The offset is internally trimmed to 250μV without affecting temperature drift.

  • A five-terminal, complementary tracking ± 15V ± 200 mA monolithic voltage regulator

    This paper will discuss a dual function, single-chip, IC regulator with preadjusted output voltages to within ±1%, internal frequency compensation, current limiting, maximum junction temperature shutdown, and excellent temperature stability due to a thermally symmetric die layout.

  • The Isothermal Wafer Level Test for VLSl Interconnect Evaluation

    None

  • Measurement of interaction fields in particulate tapes by linearization of the Henkel plot

    None

  • Improvement of Polyimide Electrical Properties During Short-Term of Thermal Aging

    An atypical enhancement of both the dielectric properties and the static (dc) conductivity in polyimide (PI) films has been observed using isothermal dielectric relaxation spectroscopy at 300degC under air atmosphere during short-term thermal aging (up to 200h). Simultaneously, an increase of the dielectric strength of PI is observed. Despite a close similarity with the typical electrical signature of the crystallization phenomenon occurring in semi-crystalline polymers, DSC measurements have not revealed the presence of an exothermic crystallization peak in PI up to 500degC thus denying this assumption. In this paper, a cross-linking reaction under oxidant atmosphere is therefore proposed for explaining such electrical improvements. Indeed, oxygen diffusion in the polymers' bulk is generally followed by the formation of links between macromolecular chains leading the molecular and charge motions more difficult. This phenomenon, inducing usually an enhancement of the electrical and mechanical properties, is also supported by FTIR chemical changes of PI during aging and theoretical cross-linking mechanisms in presence of oxygen.

  • Quasi in situ study about growth kinetics of Ag<inf>3</inf>Sn at the interface of eutectic SnPb/electroplated Ag soder joint in the long-term satellite

    The interfacial reaction and the growth kinetics of intermetallic compounds between 63Sn37Pb (wt.%) solder and the electroplated silver layer during the solid-state aging were studied in this paper. To measure the growth kinetics of Ag3Sn, the product of the interfacial reaction, more accurately, we used the quasi in situ method. And three same joints between solar cells and solder were annealed at 100°C, 120°C and 150°C for various aging durations. The results showed that the electroplated Ag layer gradually transformed into scalloped Ag3Sn, and the growth kinetics of Ag3Sn was a diffusion-controlled process during isothermal aging. Through measuring the thickness of Ag3Sn during the isothermal storage, the activation energy for IMC at eutectic SnPb solder/electroplated Ag layer interface was calculated and the result was 106 kJ/mole. On the basis of the growth kinetics, a correspondence between long- term thermal recycle and isothermal aging was presented. And the relation could be used to replace the long-term thermal recycle with accelerated annealing experiment, which would have a significant meaning for testing the reliability of low earth orbit satellites' solar cells.

  • Sintering of Nano-sized Zirconia Powder Processed by Powder Injection Moulding

    The nano-sized Yttria Stabilized Zirconia (Nano YSZ) powder with an average particles size of 50nm is initially heat treated and then mixed with wax-based binder system. The prepared feedstock is then formed into a shape by powder injection moulding process. The green parts are then thermally debound and sintered. The sintering behavior of the nano-sized particles is presented and compared with those of BASF feedstock. It is found that Nano YSZ can achieve 98% of its theoretical density. Homogenous microstructure is obtained with an average grain size of 500nm. The hardness value of the sintered Nano YSZ is similar to those obtained from BASF feedstock.

  • Rapid thermal processing of CIS precursors

    An alternative process for CuInSe/sub 2/ formation is presented. In this approach, a binary two-layer precursor CuSe/In-Se is first deposited on a Mo/glass substrate at low temperature by migration enhanced epitaxy (MEE). When the Se ambient is controlled, rapid thermal processing (RTP) is able to synthesize single phase CuInSe/sub 2/. The structure, morphology, and composition of the films were characterized by XRD, SEM and ICP.

  • Generalized /spl delta/m curves for particulate recording media obtained by Fourier analysis

    The generalized /spl delta/m/sub a/ curve obtained by the Fourier analysis of the first magnetization and major hysteresis loop is analyzed within the frame of a generalized moving Preisach model. Analytical expressions of the Fourier coefficients are obtained when the mean field interactions are negligible. Experimental and simulated /spl delta/m and /spl delta/m/sub a/ curves are obtained for commercial particulate recording tapes. The condition is established for using the generalized curves instead of the classical ones in particulate media.

  • Experimental study of a flat silicon heat pipe with microcapillary grooves

    An increase in power densities in electronic devices is a direct consequence of their miniaturization and performance improvements. We propose the use of flat miniature heat pipes with micro capillary grooves to spread heat flux across a heat sink. Silicon/water heat pipes were fabricated and tested to demonstrate the feasibility of heat spreading with this type of heat pipe.



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