Conferences related to Internal stresses

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2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE International Conference on Plasma Science (ICOPS)

IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.


2020 IEEE International Conference on Robotics and Automation (ICRA)

The International Conference on Robotics and Automation (ICRA) is the IEEE Robotics and Automation Society’s biggest conference and one of the leading international forums for robotics researchers to present their work.


2020 IEEE International Magnetic Conference (INTERMAG)

INTERMAG is the premier conference on all aspects of applied magnetism and provides a range of oral and poster presentations, invited talks and symposia, a tutorial session, and exhibits reviewing the latest developments in magnetism.


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Periodicals related to Internal stresses

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Consumer Electronics, IEEE Transactions on

The design and manufacture of consumer electronics products, components, and related activities, particularly those used for entertainment, leisure, and educational purposes


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


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Most published Xplore authors for Internal stresses

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Xplore Articles related to Internal stresses

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Traveler information in support of driver's diversion decisions: A survey of driver's preferences

Proceedings of VNIS '93 - Vehicle Navigation and Information Systems Conference, 1993

Results from the analysis of a survey of drivers' information needs and preferences are presented. Emphasis is placed on drivers' preferences for traveler information in support of diversion decisions. In particular, the effects of different trip types on drivers' information needs are examined using several approaches, including factor and discriminant analysis. The findings, while revealing some consistency between drivers' reported ...


Electrical equivalent method for thermal stress analysis

Proceedings., 39th Electronic Components Conference, 1969

A method that can help to improve understanding of thermal-stress problems and is useful for the first-order analysis of thermal stresses in the layered structures of laminates is introduced. The technique models the thermal expansion and the elasticity of each layer as components in a three-terminal equivalent electrical circuit. A model of the laminate is developed by connecting the equivalent ...


Enhancement in ultrathin oxide growth by thermal-induced tensile stress

IEEE Transactions on Device and Materials Reliability, 2006

Rapid-thermal oxide grown under the condition that a certain portion of the substrate wafer was covered by another wafer with special shape was studied. It is interesting to find that in the ultrathin oxide regime, the thickness of oxide with covered wafer is even larger than that without. Thermal-induced tensile stress is believed to be the origin of the above ...


The Shear Strength of T-shaped Broad-Limb Special Column Using the Finite Element Method

2010 Third International Conference on Information and Computing, 2010

The T-shaped broad-limb special column is analyzed using the finite element method through the rational choice of calculated parameters and the results is compared with that of the experiment, and the two results is in good agreement which verify the calculation model's correctness. Based on the correct model, the curve between the shear strength and the loading angles is analyzed ...


Reduction of fast dU/dt impact for protection of distribution transformers

2009 IEEE Conference on Electrical Insulation and Dielectric Phenomena, 2009

Transformers operating in power networks are subjected to lightning, network switching phenomena like protection action and selected failure stages. Those effects may result in additional stresses on insulation system of the windings in form of external overvoltages or internal resonances in windings caused by fast dU/dt transients. This paper presents the method for reduction of dU/dt based on specially designed ...


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Educational Resources on Internal stresses

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IEEE.tv Videos

Parry Aftab of Cybersafety India at Internet Inclusion: Advancing Solutions, Delhi, 2016
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An Optical Co-Processor for Large-Scale Machine Learning - Laurent Daudet at INC 2019
Synthesis and Selection of High Priority Areas - ETAP Delhi 2016
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IEEE-USA E-Books

  • Traveler information in support of driver's diversion decisions: A survey of driver's preferences

    Results from the analysis of a survey of drivers' information needs and preferences are presented. Emphasis is placed on drivers' preferences for traveler information in support of diversion decisions. In particular, the effects of different trip types on drivers' information needs are examined using several approaches, including factor and discriminant analysis. The findings, while revealing some consistency between drivers' reported information needs for diversion decisions, also reveal significant differences in these needs by trip type. Time thresholds for determining when to divert are analyzed. Significant differences by trip type are found. The major recommendation arising from the analysis is development of an advanced traveler information system (ATIS) that can be customized to meet users' needs.

  • Electrical equivalent method for thermal stress analysis

    A method that can help to improve understanding of thermal-stress problems and is useful for the first-order analysis of thermal stresses in the layered structures of laminates is introduced. The technique models the thermal expansion and the elasticity of each layer as components in a three-terminal equivalent electrical circuit. A model of the laminate is developed by connecting the equivalent circuits of the layers in a network. Currents and voltages are obtained by network analysis. The thermal stresses in the laminate are derived from the branch currents; the local thermal expansion coefficients for the surfaces or for internal bonding interfaces are given by the node voltages.<<ETX>>

  • Enhancement in ultrathin oxide growth by thermal-induced tensile stress

    Rapid-thermal oxide grown under the condition that a certain portion of the substrate wafer was covered by another wafer with special shape was studied. It is interesting to find that in the ultrathin oxide regime, the thickness of oxide with covered wafer is even larger than that without. Thermal-induced tensile stress is believed to be the origin of the above enhanced oxidation rate. A novel ultrathin oxide grown at a low temperature of 800/spl deg/C is demonstrated. The capacitance-voltage and current-voltage characteristics of MOS capacitors with oxides grown with and without cover wafers under the same oxide thickness were compared.

  • The Shear Strength of T-shaped Broad-Limb Special Column Using the Finite Element Method

    The T-shaped broad-limb special column is analyzed using the finite element method through the rational choice of calculated parameters and the results is compared with that of the experiment, and the two results is in good agreement which verify the calculation model's correctness. Based on the correct model, the curve between the shear strength and the loading angles is analyzed and the column torsional effects is investigated when the column is loaded on different horizontal loading angles. The results show that, the relationship curve between the shear strength and the loading angles of T-shaped broad-limb special columns is approximately a rounded rectangle and the maximum shear strength are obtained when the loading angles is 60° and 240°, and the torsional effect in the column body is considerably smaller.

  • Reduction of fast dU/dt impact for protection of distribution transformers

    Transformers operating in power networks are subjected to lightning, network switching phenomena like protection action and selected failure stages. Those effects may result in additional stresses on insulation system of the windings in form of external overvoltages or internal resonances in windings caused by fast dU/dt transients. This paper presents the method for reduction of dU/dt based on specially designed upstream choke device. The new concept employs the upstream impedance placed on high voltage line and application dependent surge capacitance. The upstream choke mitigation impact will be presented for induced lightning stroke producing the fast surge with high dU/dt on the transformer terminals. The comparison of insulation stress for various transients with different rise time properties will be shown. The simulation results along with real measurements of choke operation will be compared.

  • Internal stresses evolution of non conductive pastes (NCPs) and underfill materials for flip chip applications

    In this paper, effects of internal stress on material properties such as CTE, modulus, and glass transition temperature (T/sub g/) of various NCPs and underfill materials for flip chip applications are discussed. And a simple method for the internal stress estimation using material properties is introduced. Usually, internal stresses are generated inside NCPs and underfill materials during a curing process. And these internal stresses affect thermomechanical properties of cured NCPs and underfill materials. Using thermo-mechanical analyzer (TMA), dimensional changes of all materials were measured. Dimensional changes after 1st heating cycle rapidly increased near T/sub g/, however, it was not observed after the 2nd and 3rd heating cycles. This difference between the 1st and 2nd cycles is due to excess free volume built during curing processes. Also, using dynamic mechanical analyzer (DMA), modulus and T/sub g/ were measured. The modulus of the 1st cycle was smaller than that of the 2nd cycle for all materials. Based on these differences in the 1st and 2nd cycles, internal stresses of various materials were theoretically estimated. The estimated stresses build-up of the 1st cycle was different from those of the 2nd cycle for all materials. It is considered that internal stresses generated during a curing process alter the stress state inside materials.

  • Mechanisms of ultrasonic thrombolysis

    An ultrasonic transversely vibrating wire delivers energy to an active zone to facilitate thrombolysis in a blood vessel. Ultimately, all the energy delivered into the treatment region at the active zone ends up as heat. The heat created can originate from three sources. The first source of heat is from stresses in the waveguide and resultant internal frictional losses of the material; this heat is conducted into the fluid surrounding the waveguide. The second source of heat is from absorption due to acoustic propagation through the fluid. The third source of heat is from viscous losses as the wire moves through the fluid. This paper determines that the average power of an Omniwave ultrasonic thrombolysis system running in a single 20 kHz transverse mode with a 120 micrometer peak-to-peak amplitude is about 1.3 Watts due primarily to viscous losses.

  • Effect of core shell morphology on dielectric properties of Zr doped BaTiO/sub 3/

    The core-shell grains and lattice structure in Zr-modified BaTiO/sub 3/ were characterized. Through TEM (transmission electron microscopy), CBED (convergent-beam electron diffraction), and EDS (dispersive X-ray spectroscopy) techniques, the shells were identified as diffuse regions of pseudocubic structure surrounding a tetragonal BaTiO/sub 3/ core. Grain morphology and developed internal stresses in BaTiO/sub 3/-based high dielectric materials are shown to be a dominant factor in the development and stability of the high dielectric properties. Core-shell grains were formed in BaTiO/sub 3/ with ZrO/sub 2/ doping, upon sintering in the range 1300 degrees C-1320 degrees C. A diffused boundary phase led to high internal stresses, suppression of T/sub c/, a distribution of Curie points, and a flattened permittivity peak. The internal stress was found to be an accurate basis for estimating the permittivity response to temperature. The stability of these highly stressed samples was also found to be improved as the concentration of core-shell grains increased. Under controlled processing parameters, therefore, significantly enhanced dielectric properties can be achieved.<<ETX>>

  • The Stress-Magnetic Properties of Amorphous Magnetic Alloy

    Effects of internal shear stress applied by torque on the magnetic properties of Fe-based amorphous alloys were studied under weak magnetic fields of less than 800 A/m, where strips were helically bonded onto the shaft so as to form an angle of 45° with respect to the thrust direction. It was found that the permeability of each amorphous alloy in different gluing conditions reached for each sample a constant value above a certain torque and these torque values depend on the internal compressive strain applied by gluing A magnetization process model is considered to explain the above-mentioned behavior and states that the compressive stress affects the restraint of magnetic domain wall displacement.

  • High reliability MCM packaging using low stress liquid type epoxy resin by printing encapsulation systems (PES)

    MCM/sup L/ can expect to be the main current of semiconductor packaging technology in near future. BGA, PLCC and PGA packaging methods will expect much of this application. But the most pressing problem is warp after the packaging process. The warp after packaging needs to be below 150 /spl mu/m at BGA and 100 /spl mu/m at PLCC. We have already developed the Printing Encapsulation Systems (PES). PES is able to make low cost and mass produced semiconductor packaging. This paper describes the use of PES to make MCM/sup L/ semiconductor packaging. We have developed a low warp packaging epoxy resin using elastomer modified epoxy resin to fit BGA, PLCC and PGA. We verified the low stress epoxy resin using dynamic mechanical properties and internal stress measurements. We packaged BGA, PLCC and BGA with this low stress epoxy resin using PES, and measured the warp of each packaging. We obtained good results for the warp, demonstrating that using this low stress epoxy resin and PES, low cost and high reliability packaging of BGA, PLCC and PGA could be achieved.<<ETX>>



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