Conferences related to Intermetallic

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2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE International Conference on Plasma Science (ICOPS)

IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.


2019 IEEE International Reliability Physics Symposium (IRPS)

Meeting of academia and research professionals to discuss reliability challenges.


2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

The EMPC 2019 program will focus on industrial needs, trends and solutions, and academic R&DThis event brings together researchers, innovators, technologists, business and marketingmanagers with an interest in microelectronics and photonics packaging, providing communication,education and interaction focused on developments of technologies of the present and for thefuture, including 3D Integration, SMT, CoB and FC-Assembly, Embedding, Wafer LevelPackaging, Encapsulation, Printed Electronics, MEMS, Photonics, HF, HT and Power-Electronics, Flexible Electronics, Advanced Materials, Thermal Management,Modeling/Design/Simulation and Reliability.


2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

electronic components, materials, packaging, integration, microfluidics, mems, sensors



Periodicals related to Intermetallic

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Electron Device Letters, IEEE

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronic devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.



Most published Xplore authors for Intermetallic

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Xplore Articles related to Intermetallic

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Integrated temperature microsensors for characterization and optimization of thermosonic ball bonding process

IEEE Transactions on Components and Packaging Technologies, 2000

A novel ball bond process optimization method based on the thermal response of an integrated aluminum microsensor is reported. The in situ temperature during ball bonding is measured and analyzed. The ultrasonic period shows distinct stages corresponding to scrubbing of the ball on the pad, intermetallic bond growth, and ball deformation by ultrasonic softening. A peak of the signal indicates ...


The correlation between the mechanical and electrochemical properties of solder joints

2015 38th International Spring Seminar on Electronics Technology (ISSE), 2015

The mechanical properties of a solder joint is partially determined by the microstructure of the solder. This microstructure is formed during the soldering process and it highly depends on the technological parameters. We have introduced a new selective electrochemical sample preparation method in which the tin phases can be removed from a cross-section of a solder joint, while the intermetallic ...


Phase transformation at high temperature and coercivity of Sm(Co,Cu,Fe,Zr)7-9 magnet alloys

IEEE Transactions on Magnetics, 1987

The phase diagram near compositions of magnet alloys, that is, Sm- Co-13.0at%Cu-10.0at%Fe, Sm-Co-7.0at%Cu-22.0at%Fe and Sm- Co-7.0at%Cu-22.0at%Fe-2.0 at%Zr sections of the phase diagram were determined in the Sm content range from 6 to 16 at%. Furthermore, relationships between phase transformation at high temperature and coercivity were investigated. The Sm<inf>2</inf>(Co,Cu,Fe,Zr)<inf>17</inf>(Zr=0 and 2.0at%) intermetallic compound (2/17 phase) has the hexagonal TbCu<inf>7</inf>, hexagonal Th<inf>2</inf>Ni<inf>17</inf>or ...


New Ti-Sn Intermetallic Compound and<formula formulatype="inline"><tex Notation="TeX">$({\hbox {Nb}},{\hbox {Ti}})_{3}{\hbox {Sn}}$</tex></formula>Conductor

IEEE Transactions on Applied Superconductivity, 2009

New Ti-Sn intermetallic compound of Ti2Sn3could be easily synthesized at both of diffusion couple and powder mixture. It was found that Ti2Sn3is very brittle and easily deformed to fine powders. This new high Sn-based compound could be used for an additional Ti and Sn source for the bronze processed (Nb,Ti)3Sn wires. The hybrid bronze processed wires are demonstrated with additional ...


First-principles Investigation of the Structural and Electronic Properties of Cu Based Intermetallics

2008 10th Electronics Packaging Technology Conference, 2008

Cu6Sn5 is an important intermetallic compound (IMC), which was known to improve greatly the reliability of the solder joints in integrated circuits. The first-principles calculation were performed to determine the stable structure of Cu(6-x) NixSn5 IMC. The structural and electronic properties of Cu(6-x)NixSn5 IMCs have been calculated. The results of energy calculation and density of states demonstrate that this Cu4Ni2Sn5 ...



Educational Resources on Intermetallic

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IEEE.tv Videos

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IEEE-USA E-Books

  • Integrated temperature microsensors for characterization and optimization of thermosonic ball bonding process

    A novel ball bond process optimization method based on the thermal response of an integrated aluminum microsensor is reported. The in situ temperature during ball bonding is measured and analyzed. The ultrasonic period shows distinct stages corresponding to scrubbing of the ball on the pad, intermetallic bond growth, and ball deformation by ultrasonic softening. A peak of the signal indicates the end of interconnection growth. This can be used for bond time optimization. When optimizing bonding force, the sensor signal correlates with ball shear strength. Using this method, bonding force process windows can be determined by on-line measurements. A test measurement shows that at a chip temperature of 34/spl deg/C, the bonding force optimized by the microsensor method is 260 mN whereas it is 252 mN when using conventional shear testing for optimization. In summary, the method produces a wealth of new insights in transient thermal phenomena of the ball bonding process and promises to simplify the evaluation of process windows.

  • The correlation between the mechanical and electrochemical properties of solder joints

    The mechanical properties of a solder joint is partially determined by the microstructure of the solder. This microstructure is formed during the soldering process and it highly depends on the technological parameters. We have introduced a new selective electrochemical sample preparation method in which the tin phases can be removed from a cross-section of a solder joint, while the intermetallic phases stay intact. For the quantitative characterization of the revealed intermetallic microstructure we also introduced a novel method. We compare the electrochemical impedance spectrum of the polished surface of the cross-sectioned sample to the spectrum measured after the selective material removal. The peak shear force values of components soldered with different cooling rates are compared to a composed arbitrary unit which is proportional to the total surface of the intermetallic compounds in the solder bulk.

  • Phase transformation at high temperature and coercivity of Sm(Co,Cu,Fe,Zr)7-9 magnet alloys

    The phase diagram near compositions of magnet alloys, that is, Sm- Co-13.0at%Cu-10.0at%Fe, Sm-Co-7.0at%Cu-22.0at%Fe and Sm- Co-7.0at%Cu-22.0at%Fe-2.0 at%Zr sections of the phase diagram were determined in the Sm content range from 6 to 16 at%. Furthermore, relationships between phase transformation at high temperature and coercivity were investigated. The Sm<inf>2</inf>(Co,Cu,Fe,Zr)<inf>17</inf>(Zr=0 and 2.0at%) intermetallic compound (2/17 phase) has the hexagonal TbCu<inf>7</inf>, hexagonal Th<inf>2</inf>Ni<inf>17</inf>or rhombohedral Th<inf>2</inf>Zn<inf>17</inf>structure depending on the quantity of Cu, Fe and Zr, and temperature. The alloys quenched after homogenizing treatment, by which the 2/17 phase with TbCu<inf>7</inf>structure is obtained, can possess high coercivity after the aging treatment.

  • New Ti-Sn Intermetallic Compound and<formula formulatype="inline"><tex Notation="TeX">$({\hbox {Nb}},{\hbox {Ti}})_{3}{\hbox {Sn}}$</tex></formula>Conductor

    New Ti-Sn intermetallic compound of Ti2Sn3could be easily synthesized at both of diffusion couple and powder mixture. It was found that Ti2Sn3is very brittle and easily deformed to fine powders. This new high Sn-based compound could be used for an additional Ti and Sn source for the bronze processed (Nb,Ti)3Sn wires. The hybrid bronze processed wires are demonstrated with additional Ti2Sn3modules in the bronze matrix. Significantly thick (Nb,Ti)3Sn layers were formed. Although Nb cores still remained in the center of filaments, (Nb,Ti)3Sn layers had no apparent gradient of Sn and Ti concentrations. We found the formation of (Cu,Nb)SnTi phases along (Nb,Ti)3Sn filaments. After heat treatment, no large Kirkendall voids were observed in the position filled up Ti2Sn3powders. Fine tau1-CuSn3Ti5precipitates are dispersed and they may behave as the reinforcement for the bronze matrix. It might resemble the effect of the ODS copper. The_T_cof hybrid bronze processed wires made with additional Ti2Sn3modules is comparable with that of the commercially bronze processed wires, which is about 17.5 K.

  • First-principles Investigation of the Structural and Electronic Properties of Cu Based Intermetallics

    Cu6Sn5 is an important intermetallic compound (IMC), which was known to improve greatly the reliability of the solder joints in integrated circuits. The first-principles calculation were performed to determine the stable structure of Cu(6-x) NixSn5 IMC. The structural and electronic properties of Cu(6-x)NixSn5 IMCs have been calculated. The results of energy calculation and density of states demonstrate that this Cu4Ni2Sn5 IMC had a more stable structure than Cu6Sn5. The mechanical stability of the systems was studied to compare the compressibility of the matrices. A priori rule is formulated to correlate the stability and composition of the said intermetallics.

  • Origin Of Strong Intrinsic Kerr Effect In FePt And FePd Ordered Compounds

    None

  • Characterization of microstructure and properties of nanostructured Fe-Al/WC intermetallic composite coating deposited by cold spraying

    A nanostuctured Fe-Al/WC intermetallic compound-based coating was produced by cold spraying of ball-milled powder assisted with post-annealing treatment. The microstructure of the as-milled powder and cold-sprayed coating was investigated. It was found that the as-milled Fe-Al/WC composite alloy powder had lamellar structure and the microstructure of the as-sprayed coating depended significantly on the microstructure of as-milled powder. A Fe-Al intermetallic phase was formed during the annealing treatment at a temperature higher than 500°C. The microhardness of the as-sprayed coating reached 680 Hv0.1and more. The effect of the annealing treatment on the coating microstructure and hardness was examined.

  • Reliability of interfaces for lead-free solder bumps

    This study aims at a better understanding of the reliability of lead-free solder bumps for flip-chip applications. Without the presence of lead, copper in the under bump metal (UBM) layer dissolves extensively into the molten solder during reflow, which forms a thick intermetallic layer at the interface. It was found that with a annealing step before reflow, the thickness of the intermetallic layer can be reduced. When nickel is used as the UBM and SnAgCu is used as the bump material, (Cu,Ni)/sub 6/Sn/sub 5/ ternary intermetallic is formed at the interface. The ternary intermetallic increased the chance of failure at the interface during ball shear test. After thermal cycling, the probability of failure at the interface further increased.

  • Synthesis of coatings based on intermetallic titanium-aluminum by vacuum arc deposition

    The methods for the synthesis of intermetallic coatings are investigated. The synthesis of coatings was carried out with two accelerators plasma in environments of Ar inert gas. The distribution ratio of the rate of growth of coatings at different points in the vacuum chamber is obtained. We investigated two different methods: simultaneous deposition of the plasma generated by a titanium and aluminum cathodes and layer by layer. Deposition of coatings were investigated by X-ray and optical methods. That the coatings consist of Ti, Al, intermetallic compounds (Ti-Al) is established. Analysis of the results of the phase composition of coatings on the samples showed that the percentage of the intermetallic compound in the coating affects: spatial location of samples in vaccum chamber, an additional bombardment of the substrate by ions of the reaction gas, modes of processing. An optimum mode of synthesis of intermetallic coatings is identified.

  • Metallurgical Aspects of Aluminum Wire Bonds to Gold Metallization

    A study is made of the intermetallics which form when aluminum wire is ultrasonically joined to thin and thick film gold metallizations and stored for extended times at moderate temperatures. Conclusions are reached concerning the effects of conductor surface topography, thickness, and purity on bond reliability.



Standards related to Intermetallic

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No standards are currently tagged "Intermetallic"