Conferences related to Integrated circuit yield

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2023 Annual International Conference of the IEEE Engineering in Medicine & Biology Conference (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted full papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions,will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.


2021 IEEE Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.


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Periodicals related to Integrated circuit yield

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Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Communications Magazine, IEEE

IEEE Communications Magazine was the number three most-cited journal in telecommunications and the number eighteen cited journal in electrical and electronics engineering in 2004, according to the annual Journal Citation Report (2004 edition) published by the Institute for Scientific Information. Read more at http://www.ieee.org/products/citations.html. This magazine covers all areas of communications such as lightwave telecommunications, high-speed data communications, personal communications ...


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


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Most published Xplore authors for Integrated circuit yield

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Xplore Articles related to Integrated circuit yield

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Programmable interconnection technique

1966 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1966

None


Determination of yield bounds prior to routing

Proceedings 1999 IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems (EFT'99), 1999

Integrated circuit manufacturing complexities have resulted in decreasing product yields and reliabilities. This process has been accelerated with the advent of very deep sub-micron technologies coupled with the introduction of newer materials and technologies like copper interconnects, silicon-on- insulator and increased wafer sizes. The need to improve product yields has been recognized and currently some yield enhancement techniques are used ...


COS/MOS phase comparator

1973 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1973

COS/MOS MSI technology has been applied to the integration of a high performance phase comparator for use in a UHF frequency synthesizer capable of selecting any of 7000 channels with a 25-kHz spacing in the 225-400 MHz frequency range.


Yield statistics for large area ICs

1986 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1986

This report will cover an examination of Poisson statistics and their inadequacy to represent defects in large area chips on a wafer. Measurements of defects will be cited and the consequences on redundancy methods will be discussed.


Manufacturing Low Cost Optoelectronic Components

Summer Topical Meeting Digest on Broadband Analog and Digital Optoelectronics, Optical Multiple Access Networks, Integrated Optoelectronics, Smart Pixels, 1992

Summary form only given. Discusses the manufacturing of low cost optoelectronic components and technologies.


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Educational Resources on Integrated circuit yield

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IEEE.tv Videos

IMS 2012 Microapps - Improve Microwave Circuit Design Flow Through Passive Model Yield and Sensitivity Analysis
Maker Faire 2008: Spectrum's Digital Clock Contest Winner
IMS 2012 Microapps - Integrated Electrothermal Solution Delivers Thermally Aware Circuit Simulation Rick Poore, Agilent EEsof
Sources of Innovation
ASC-2014 SQUIDs 50th Anniversary: 1 of 6 Arnold Silver
Micro-Apps 2013: Optimizing Chip, Module, Board Transitions Using Integrated EM and Circuit Design Simulation Software
An Integrated Optical Parallel Multiplier Exploiting Approximate Binary Logarithms - Jun Shiomi - ICRC 2018
Superconductive Energy-Efficient Computing - ASC-2014 Plenary-series - 6 of 13 - Wednesday 2014/8/13
Micro-Apps 2013: Integrated Electro-Thermal Design of a SiGe PA
BSIM Spice Model Enables FinFET and UTB IC Design
An IEEE IPC Special Session with Kasia Balakier of UCL
IMS 2011 Microapps - Yield Analysis During EM Simulation
Intermodulation Distortion Mitigation in Microwave Amplifiers and Frequency Converters
Education for Analog ICs
Micro-Apps 2013: Designing an ETSI E-Band Circuit for a MM Wave Wireless System
Neuromorphic Mixed-Signal Circuitry for Asynchronous Pulse Processing Neuromorphic Mixed-Signal Circuitry for Asynchronous Pulse Processing - Peter Petre: 2016 International Conference on Rebooting Computing
APEC 2011-Intersil Promo Apec 2011
IMS 2011 Microapps - Improved Microwave Device Characterization and Qualification Using Affordable Microwave Microprobing Techniques for High-Yield Production of Microwave Components
The Evolution and Future of RF Silicon Technologies for THz Applications
2015 IEEE Honors: IEEE Jun-ichi Nishizawa Medal - Dimitri A. Antoniadis

IEEE-USA E-Books

  • Programmable interconnection technique

    None

  • Determination of yield bounds prior to routing

    Integrated circuit manufacturing complexities have resulted in decreasing product yields and reliabilities. This process has been accelerated with the advent of very deep sub-micron technologies coupled with the introduction of newer materials and technologies like copper interconnects, silicon-on- insulator and increased wafer sizes. The need to improve product yields has been recognized and currently some yield enhancement techniques are used in industry CAD tools. Still, the significant increase in problem size implies that considerable time and effort can be saved if the designer could predict the yield of each design stage. In this paper we undertake an effort to derive bounds on the yield of the routing for a given placement. When the design is routed, resulting in a yield which is significantly smaller than the bound, the designer can choose to change the router cost functions, modify the placement or even re-design the unit in an attempt to increase the yield. We compare the bounds on yield obtained for a set of standard benchmarks against exact yield values for the "vanilla" routings, and the run times needed to calculate the two. The results indicate that reasonably good estimates of yield can be obtained in significantly lower amounts of run time. The accuracy of the estimates increases when larger designs are considered as the simplifying assumptions made and the model no longer influences the estimates significantly.

  • COS/MOS phase comparator

    COS/MOS MSI technology has been applied to the integration of a high performance phase comparator for use in a UHF frequency synthesizer capable of selecting any of 7000 channels with a 25-kHz spacing in the 225-400 MHz frequency range.

  • Yield statistics for large area ICs

    This report will cover an examination of Poisson statistics and their inadequacy to represent defects in large area chips on a wafer. Measurements of defects will be cited and the consequences on redundancy methods will be discussed.

  • Manufacturing Low Cost Optoelectronic Components

    Summary form only given. Discusses the manufacturing of low cost optoelectronic components and technologies.

  • Surface roughness modelling with neural networks

    Accurate surface modelling has become important in the modem integrated circuits manufacturing technology. On all the real surfaces microscopic roughness appears, which affects many electronic properties of the material, which in turn decides the yield and reliability of the integrated circuits. The surface roughness is a complex function of the processing parameters of the fabrication processes. It is difficult to express surface roughness as a function of process parameters in the form of analytical function. It is necessary to map the input parameters to roughness for a process control since it directly affects the yield and reliability of the product. In this paper we show that neural networks can be used to map these parameters to surface roughness. This approach is also suitable for model based control systems in manufacturing.

  • A multi-chip packaged GaAs 16*16 bit parallel multiplier

    A GaAs 16*16 16-bit parallel multiplier utilizing multichip packaging technology is demonstrated. This multichip approach was taken in an effort to realize GaAs ULSIs with high yield and reliability, using multiple smaller scale integrated circuits. The device is composed of four GaAs 8*8-bit expandable parallel multipliers and a multichip package (MCP). The developed 8*8 multipliers consist of 1097 enhancement/depletion DCFL (directly coupled FET logic) gates each, and have a 3.4 ns multiplication time. The developed MCP is composed of five layers of alumina ceramic which include 50 Omega striplines. The multiplication time of this 16*16-bit multichip multiplier is 7.6 ns, and the total production yield is 70%.<>

  • Common and differential crosstalk characterization on the silicon substrate

    Integrated circuit pad-to-pad crosstalk characterization structures were fabricated and measured over a 8000 μm×2500 μm area using Al pads on a silicon substrate. The structures were tested by a pure-mode network analyzer to yield common- and differential-mode crosstalk at 1 and 2 GHz. Differential-mode signals introduce far less substrate noise. This novel technique can characterize substrate noise levels near sensitive radio frequency (RF) and microwave circuits.

  • Uniformly Ion Implantation for GaAs FETs - Relation to Material and Processing Variabies

    Uniformly ion implanted semi-insulating wafers of gallium arsenide are desirable if the material is ever to be used for high yield integrated circuit manufacture. In this work an established implantation and device technology is described. Careful measurements and characterisation of implanted samples from different suppliers relate material properties to electrical measurements of sheet carrier concentration, mobility and profiles. Variations in processing procedure and material are then related to FET device parameters using both DC and RF characterisation.

  • Circuit analysis and optimization driven by worst-case distances

    In this paper, a new methodology for integrated circuit design considering the inevitable manufacturing and operating tolerances is presented. It is based on a new concept for specification analysis that provides exact worst-case transistor model parameters and exact worst-case operating conditions. Corresponding worst-case distances provide a key measure for the performance, the yield, and the robustness of a circuit. A new deterministic method for parametric circuit design that is based on worst-case distances is presented. It comprises nominal design, worst-case analysis, yield optimization, and design centering. In contrast to current approaches, it uses standard circuit simulators and at the same time considers deterministic design parameters of integrated circuits at reasonable computational costs. The most serious disadvantage of geometric approaches to design centering is eliminated, as the method's complexity increases only linearly with the number of design variables.<<ETX>>



Standards related to Integrated circuit yield

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IEEE Standard Interface for Hardware Description Models of Electronic Components

Development of a standard simulation and related tool interface for component models written in VHDL, Verilog, C and other description languages.



Jobs related to Integrated circuit yield

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