Conferences related to Integrated circuit testing

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2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE International Instrumentation and Measurement Technology Conference (I2MTC)

The Conference focuses on all aspects of instrumentation and measurement science andtechnology research development and applications. The list of program topics includes but isnot limited to: Measurement Science & Education, Measurement Systems, Measurement DataAcquisition, Measurements of Physical Quantities, and Measurement Applications.


2020 IEEE International Reliability Physics Symposium (IRPS)

Meeting of academia and research professionals to discuss reliability challenges


2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

This symposium pertains to the field of electromagnetic compatibility.


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Periodicals related to Integrated circuit testing

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Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Circuits and Systems I: Regular Papers, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


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Most published Xplore authors for Integrated circuit testing

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Xplore Articles related to Integrated circuit testing

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Why We Need Design-for-testability

1991 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1991

Summary form only given. The basic reason for testing integrated circuits is to ensure satisfactory operation of a customer's system. Some systems require continuous uninterrupted operation.


Logic implementation for VLSI

1979 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1979

Circuit speed and design flexibility favor custom logic tailored toward specific applications. Advances in VLSI lead toward modular systems that trade component count for ease of design and testing. Panelists will discuss present and future advances in these two areas and assess their impact on the structure of new generation systems.


Applications '90: instrumentation

IEEE Spectrum, 1990

Important developments in instrumentation during 1989 are described. A proposed design-for-testability standard embracing the boundary-scan technique was approved by voters in an IEEE letter ballot last August. The advent of smart sensors has led to the notion of universal instruments, standard boxes that can measure a variety of parameters when the appropriate sensors are plugged in. More than 40 of ...


Is Low Power Testing Necessary? What does the Test Industry Truly Need?

2009 Asian Test Symposium, 2009

With the changing face of the consumer driven semiconductor industry, there are new challenges facing the industry which need to be resolved. Minimizing power dissipation is a significant and growing challenge with the growth of the wireless and portable device segments and with the need to be `green'. Even during manufacturing test, power is definitely among the top ten items ...


IEE Colloquium on 'Application and Development of the Boundary-Scan Standard' (Digest No.183)

IEE Colloquium on Application and Development of the Boundary-Scan Standard, 1990

None


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Educational Resources on Integrated circuit testing

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IEEE-USA E-Books

  • Why We Need Design-for-testability

    Summary form only given. The basic reason for testing integrated circuits is to ensure satisfactory operation of a customer's system. Some systems require continuous uninterrupted operation.

  • Logic implementation for VLSI

    Circuit speed and design flexibility favor custom logic tailored toward specific applications. Advances in VLSI lead toward modular systems that trade component count for ease of design and testing. Panelists will discuss present and future advances in these two areas and assess their impact on the structure of new generation systems.

  • Applications '90: instrumentation

    Important developments in instrumentation during 1989 are described. A proposed design-for-testability standard embracing the boundary-scan technique was approved by voters in an IEEE letter ballot last August. The advent of smart sensors has led to the notion of universal instruments, standard boxes that can measure a variety of parameters when the appropriate sensors are plugged in. More than 40 of these instruments can be interconnected in a network to share data at rates up to 1 Mb/s. New international standards for the volt and ohm were to have gone into effect on New Year's Day this year. Standards for the ampere and watt derive from those for the volt and ohm and, therefore, would also change. The need for standards to test microwave and millimeter-wave integrated circuits (MIMICs) manifested itself in the formation last year of the NIST (National Institute for Standards and Technology) Consortium for MIMIC Metrology. Composed of industry and government laboratories and spearheaded by NIST, the group is charged with producing standards for measuring the radio frequency and thermal characteristics of microwave monolithic ICs.<<ETX>>

  • Is Low Power Testing Necessary? What does the Test Industry Truly Need?

    With the changing face of the consumer driven semiconductor industry, there are new challenges facing the industry which need to be resolved. Minimizing power dissipation is a significant and growing challenge with the growth of the wireless and portable device segments and with the need to be `green'. Even during manufacturing test, power is definitely among the top ten items needing attention and expertise. Since 90-nm there has been a recognition that power consumption during test can be a factor affecting product quality and yield. Excessive power consumption during manufacturing test affects the reliability of digital integrated circuits, leading to power-driven failures and higher infant mortality. These trends if continuing on their present course will force designers to adopt specific power management and low power design techniques for manufacturing test.

  • IEE Colloquium on 'Application and Development of the Boundary-Scan Standard' (Digest No.183)

    None

  • A military test method for measuring fault coverage

    Proposed MIL-STD-883 Test Procedure 5012, 'Fault Coverage Measurement for Digital Microcircuits', is described. Numerous fault simulation tools are commercially available; this procedure provides a means of obtaining consistent and repeatable fault coverage values from different fault simulators. The procedure describes requirements governing the development of the logic model for the IC, the assumed fault model and fault universe, fault classing, fault simulation, and fault coverage reporting. It provides a consistent means of reporting fault coverage for an IC regardless of the specific logic and fault simulator used.<<ETX>>

  • A new method to calculate parameters of configurable integrated test model

    A configurable integrated test (CIT) model has been developed for GaAs MMIC (monolithic microwave integrated circuit) manufacturing control. The optimal process/test strategy of a MMIC in the production phase can be predicted from this model. A method using an optimization concept is demonstrated for calculating parameters of the CIT model from process/test history. This method can be used to estimate realistic screening probabilities and hence to predict optimal test strategy accurately. The method is described, and examples of its use are presented.<<ETX>>

  • Reducing fabrication variability in analog IC technology by the statistical error propagation method using simple test structures

    The statistical error propagation method is used to analyze the parametric variance of current gain and breakdown voltage in bipolar analog integrated circuits in terms of the relative variance of four process factors; emitter sheet resistance, based sheet resistance, buried layer sheet resistance, and epitaxial thickness. The dominant level of device parameter variance and the dominant process factors to which the device is sensitive are identified, using simple test structures, thereby facilitating the tightening of variability of the device parameter. This technique is useful for integrating the device data into the process control analysis and separating the effects of the critical process factors in a fabrication environment. How the process variance of analog integrated circuits is improved by this method is demonstrated.<<ETX>>

  • Layout-driven test generation

    Conventionally, test vectors are generated using gate-level models to represent the circuit design and abstract fault models (e.g. the stuck-fault model) to describe all of the processing defects causing circuit failure. The authors demonstrate that test vectors can be generated using realistic defect models and actual IC layouts, which should lead to test vectors with a higher defect detectability. The layout-driven generation of the faults has a computational complexity which is similar to that of design-rule checking, i.e. O(n log n).<<ETX>>

  • Testability and yield of MMICs

    Summary form only given. An approach to MMIC (monolithic microwave integrated circuit) yield measurement involving on-wafer functional testing was discussed. On-wafer RF testing, combined with minimum DC testing, provides the necessary testing of individual chips with minimum costs. The on-wafer tests used to screen MMICs for yield current include measurements of output power, complex gain, return loss, noise, and spurious output. To provide effective on-wafer screening of MMICs, testability must be included as part of the design. The design issues that influence on-wafer testability include pad placement, stability, number of connections, and thermal resistance. The testing required to identify good die may range from full functional testing of every specification to simple DC screening. The required level of testing is usually related to the performance requirements of the chip and the design margins.<<ETX>>



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