Conferences related to Integrated circuit metallization

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2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.


2020 IEEE International Solid- State Circuits Conference - (ISSCC)

ISSCC is the foremost global forum for solid-state circuits and systems-on-a-chip. The Conference offers 5 days of technical papers and educational events related to integrated circuits, including analog, digital, data converters, memory, RF, communications, imagers, medical and MEMS ICs.


2020 IEEE/MTT-S International Microwave Symposium (IMS)

The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2036 IEEE/MTT-S International Microwave Symposium - IMS 2036

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2031 IEEE/MTT-S International Microwave Symposium - IMS 2031

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2029 IEEE/MTT-S International Microwave Symposium - IMS 2029

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2026 IEEE/MTT-S International Microwave Symposium - IMS 2026

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2025 IEEE/MTT-S International Microwave Symposium - IMS 2025

    The IEEE International Microwave Symposium (IMS) is the world s foremost conferencecovering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies;encompassing everything from basic technologies to components to systems including thelatest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulationand more. The IMS includes technical and interactive sessions, exhibits, student competitions,panels, workshops, tutorials, and networking events.

  • 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2023 IEEE/MTT-S International Microwave Symposium - IMS 2023

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2022 IEEE/MTT-S International Microwave Symposium - IMS 2022

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2021 IEEE/MTT-S International Microwave Symposium - IMS 2021

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.

  • 2019 IEEE/MTT-S International Microwave Symposium - IMS 2019

    Comprehensive symposium on microwave theory and techniques including active and passive circuit components, theory and microwave systems.

  • 2018 IEEE/MTT-S International Microwave Symposium - IMS 2018

    Microwave theory and techniques, RF/microwave/millimeter-wave/terahertz circuit design and fabrication technology, radio/wireless communication.

  • 2017 IEEE/MTT-S International Microwave Symposium - IMS 2017

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.

  • 2016 IEEE/MTT-S International Microwave Symposium - IMS 2016

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2015 IEEE/MTT-S International Microwave Symposium - MTT 2015

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics. The IMS includes technical sessions, both oral and interactive, worksh

  • 2014 IEEE/MTT-S International Microwave Symposium - MTT 2014

    IMS2014 will cover developments in microwave technology from nano devices to system applications. Technical paper sessions, interactive forums, plenary and panel sessions, workshops, short courses, industrial exhibits, and a wide array of other technical activities will be offered.

  • 2013 IEEE/MTT-S International Microwave Symposium - MTT 2013

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter -wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2012 IEEE/MTT-S International Microwave Symposium - MTT 2012

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2011 IEEE/MTT-S International Microwave Symposium - MTT 2011

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2010 IEEE/MTT-S International Microwave Symposium - MTT 2010

    Reports of research and development at the state-of-the-art of the theory and techniques related to the technology and applications of devices, components, circuits, modules and systems in the RF, microwave, millimeter-wave, submillimeter-wave and Terahertz ranges of the electromagnetic spectrum.

  • 2009 IEEE/MTT-S International Microwave Symposium - MTT 2009

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2008 IEEE/MTT-S International Microwave Symposium - MTT 2008

  • 2007 IEEE/MTT-S International Microwave Symposium - MTT 2007

  • 2006 IEEE/MTT-S International Microwave Symposium - MTT 2006

  • 2005 IEEE/MTT-S International Microwave Symposium - MTT 2005

  • 2004 IEEE/MTT-S International Microwave Symposium - MTT 2004

  • 2003 IEEE/MTT-S International Microwave Symposium - MTT 2003

  • 2002 IEEE/MTT-S International Microwave Symposium - MTT 2002

  • 2001 IEEE/MTT-S International Microwave Symposium - MTT 2001

  • 2000 IEEE/MTT-S International Microwave Symposium - MTT 2000

  • 1999 IEEE/MTT-S International Microwave Symposium - MTT '99

  • 1998 IEEE/MTT-S International Microwave Symposium - MTT '98

  • 1997 IEEE/MTT-S International Microwave Symposium - MTT '97

  • 1996 IEEE/MTT-S International Microwave Symposium - MTT '96


2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

The EMPC 2019 program will focus on industrial needs, trends and solutions, and academic R&DThis event brings together researchers, innovators, technologists, business and marketingmanagers with an interest in microelectronics and photonics packaging, providing communication,education and interaction focused on developments of technologies of the present and for thefuture, including 3D Integration, SMT, CoB and FC-Assembly, Embedding, Wafer LevelPackaging, Encapsulation, Printed Electronics, MEMS, Photonics, HF, HT and Power-Electronics, Flexible Electronics, Advanced Materials, Thermal Management,Modeling/Design/Simulation and Reliability.


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Periodicals related to Integrated circuit metallization

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


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Most published Xplore authors for Integrated circuit metallization

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Xplore Articles related to Integrated circuit metallization

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Proceedings Fourth International Symposium on Quality Electronic Design

Fourth International Symposium on Quality Electronic Design, 2003. Proceedings., 2003

The following topics are dealt with: VLSI design, modeling, simulation; IC packages; interconnected systems; noise analysis; system on chip; submicron technology; high speed circuits; reliability; IC testing; leakage currents; testing measurements.


High packing linear integrated circuits using planar metallization with polymer

1977 International Electron Devices Meeting, 1977

A linear IC for the TV chroma systems has been packed on a 2.34&#215;2.36mm<sup>2</sup>chip using a two-level interconnection with Planar Metallization with Polymer (PMP) technology, and is packaged by plastic direct molding. The chip area of this device is reduced about 40% as compared to the conventional device with the sam function. Advanced PMF technique makes it possible to realize ...


Influence of process parameters on chemical-mechanical polishing of copper

European Workshop Materials for Advanced Metallization,, 1997

Chemical-mechanical polishing (CMP) appears to be the most promising technology for global planarization of device topography and metal patterning in the damascene technique. Cu has been recently studied as a candidate material for future integrated circuit metallization because of its low resistivity and better electromigration resistance than current Al alloy interconnects. In order to achieve a highly reliable CMP process ...


Computer-aided inspection of some design rules of integrated circuit layers

Second IEEE International Workshop on Intelligent Data Acquisition and Advanced Computing Systems: Technology and Applications, 2003. Proceedings, 2003

The visual inspection algorithms for verification of industrial design rules of integrated circuits are proposed. The algorithms include segmentation of images of layout with subsequent extraction of typical patterns on these images for defects localization. The unique feature of the technology is that the inspection of the design technological rules is performed at different stages of processing. Thus a time-consuming ...


Evaluation of eutectic solder bump interconnect technology

Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330), 1999

This paper describes the electroplated solder bump process and provides results from evaluations of the reliability performance and mechanical integrity of the bump interconnect technology for direct chip attach applications. Evaluations include studying the effects of several variables, including (a) the solder bump volume (determined by bump height and diameter), (b) the integrated circuit bond pad configuration (using various passivation ...


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Educational Resources on Integrated circuit metallization

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IEEE.tv Videos

Maker Faire 2008: Spectrum's Digital Clock Contest Winner
IMS 2012 Microapps - Integrated Electrothermal Solution Delivers Thermally Aware Circuit Simulation Rick Poore, Agilent EEsof
Sources of Innovation
ASC-2014 SQUIDs 50th Anniversary: 1 of 6 Arnold Silver
Micro-Apps 2013: Optimizing Chip, Module, Board Transitions Using Integrated EM and Circuit Design Simulation Software
An Integrated Optical Parallel Multiplier Exploiting Approximate Binary Logarithms - Jun Shiomi - ICRC 2018
An IEEE IPC Special Session with Kasia Balakier of UCL
Micro-Apps 2013: Integrated Electro-Thermal Design of a SiGe PA
BSIM Spice Model Enables FinFET and UTB IC Design
Education for Analog ICs
Micro-Apps 2013: Designing an ETSI E-Band Circuit for a MM Wave Wireless System
Neuromorphic Mixed-Signal Circuitry for Asynchronous Pulse Processing Neuromorphic Mixed-Signal Circuitry for Asynchronous Pulse Processing - Peter Petre: 2016 International Conference on Rebooting Computing
APEC 2011-Intersil Promo Apec 2011
The Evolution and Future of RF Silicon Technologies for THz Applications
2015 IEEE Honors: IEEE Jun-ichi Nishizawa Medal - Dimitri A. Antoniadis
IMS 2012 Microapps - Fully Integrating 3D Electromagnetic (EM) Simulation into Circuit Simulation
Towards Logic-in-Memory circuits using 3D-integrated Nanomagnetic Logic - Fabrizio Riente: 2016 International Conference on Rebooting Computing
Quantum Computation - ASC-2014 Plenary series - 4 of 13 - Tuesday 2014/8/12
Radio Frequency Identification(RFID)
ON-CHIP VOLTAGE AND TIMING DIAGNOSTIC CIRCUITS

IEEE-USA E-Books

  • Proceedings Fourth International Symposium on Quality Electronic Design

    The following topics are dealt with: VLSI design, modeling, simulation; IC packages; interconnected systems; noise analysis; system on chip; submicron technology; high speed circuits; reliability; IC testing; leakage currents; testing measurements.

  • High packing linear integrated circuits using planar metallization with polymer

    A linear IC for the TV chroma systems has been packed on a 2.34&#215;2.36mm<sup>2</sup>chip using a two-level interconnection with Planar Metallization with Polymer (PMP) technology, and is packaged by plastic direct molding. The chip area of this device is reduced about 40% as compared to the conventional device with the sam function. Advanced PMF technique makes it possible to realize this linear IC with high yields and high reliability. In this technique; (1) Purified PIQ (a high heat resisting polyimide, Na 0.5ppm) is used for insulating layers. (2) A special solution of hydrazine-hydrate has been developed to etch the PIQ layer to form via-holes down to 3&#215;3&#181;m. Yield of via-hole contact proved to be over 99.9998%. (3) PMP makes it possible to place the pads for thermo-compression bonding on the active region of the device. (4) Pinhole density of the PIQ layer is less than 0.05/cm<sup>2</sup>. Failure of interconnection has not been observed in the reliability test.

  • Influence of process parameters on chemical-mechanical polishing of copper

    Chemical-mechanical polishing (CMP) appears to be the most promising technology for global planarization of device topography and metal patterning in the damascene technique. Cu has been recently studied as a candidate material for future integrated circuit metallization because of its low resistivity and better electromigration resistance than current Al alloy interconnects. In order to achieve a highly reliable CMP process for Cu delineation it is necessary to examine the limitations of the process. Integrating Cu CMP into an interconnect processing sequence requires a detailed understanding of how process parameters affect different aspects of the CMP process and therefore the quality of the patterned lines.

  • Computer-aided inspection of some design rules of integrated circuit layers

    The visual inspection algorithms for verification of industrial design rules of integrated circuits are proposed. The algorithms include segmentation of images of layout with subsequent extraction of typical patterns on these images for defects localization. The unique feature of the technology is that the inspection of the design technological rules is performed at different stages of processing. Thus a time-consuming procedure of image matching with the purpose of localization of defects is performed only for some images from the whole image set. The inspection algorithms are included in the system of metallization layers processing, which is applied both for layout reconstruction of integrated circuits and for the inspection of its manufacture

  • Evaluation of eutectic solder bump interconnect technology

    This paper describes the electroplated solder bump process and provides results from evaluations of the reliability performance and mechanical integrity of the bump interconnect technology for direct chip attach applications. Evaluations include studying the effects of several variables, including (a) the solder bump volume (determined by bump height and diameter), (b) the integrated circuit bond pad configuration (using various passivation opening and under bump metallization diameters), (c) the UBM stud thickness and (d) the underfill material type. The analysis of each of these variables as main effects and, in most cases, interaction effects was achieved by performing mechanical and environmental testing, including solder bump and under bump metallization (UBM) shear strength, die tensile pull, air-to-air temperature cycling (AATC) at a range of -55/125/spl deg/C and cross-sectional analysis. The intent of this study was to determine the significance of the variables and demonstrate successful reliability performance.

  • EYE: a tool for measuring the defect sensitivity of IC layout

    The development of new aggressively target IC processes brings new challenges to the design and fabrication of high yielding ICs. As much as 50% of yield loss in digital ICs can be attributed to the metallisation stages of fabrication. This can be a particular problem when new process technologies such as multilevel interconnect are being introduced. This paper addresses the problem of design for manufacture of IC layout by presenting a tool that enables the measurement of critical area and hence layout defect sensitivity. The EYE (Edinburgh Yield Estimator) tool has two main uses, yield prediction and the comparison of defect sensitivities of place and routing algorithms. Its use as a tool to measure and optimise the defect sensitivity and hence the manufacturability of the IC layout produced by automated routing algorithms will be explored in this paper.

  • Electromigration reliability indicators

    There are many requirements for different types of test for different stages in the development and use of an interconnect technology. For a new technology, metal alloy or layer structure, deposition process etc., there is a need for a full evaluation in order to reassure the user. The classical batch accelerated testing is used because the degree of acceleration is not excessive and the test conditions are not too removed from field use. There is a need for a faster secondary test, preferably at wafer level on unpackaged test structures, which can be used with some confidence on samples produced during the early evaluation stages ofa process or for use to decide preferences between process options. Finally there is a need for very fast, wafer-level tests for routine statistical process control of the fabrication process which can give some indication ofthe sample quality in minutes so that there is rapid feedback. In this case it need not test for electromigration failure itself but should also be sensitive to more basic problems such as unevenness in the photolithography ofthe line width, cracks etc. The aim is to produce a high quality and homogeneous product since it is the device with the shortest lifetime, rather than the statistical average which matters.<<ETX>>

  • Advantages of vapor-plated phosphosilicate films in large-scale integrated circuit arrays

    The yield and reliability of silicon integrated circuits are significantly increased by the application of a chemical vapor deposited phosphosilicate layer after first level metallization. These benefits are directly attributable to the physical and electronic properties of phosphosilicate films. A number of limitations of planar silicon devices, such as susceptibility of the metallization to scratches or corrosion effects, and the possibility of surface-related instability due to ion migration effects are overcome by this process. In multilevel metallized large-scale integrated circuit arrays, deposited phosphosilicate films are a very satisfactory dielectric between metal layers, providing the capability of reliable, low- resistance interconnections. Used as either passive films on single-scale metallized devices, or as the second dielectric layer in multilevel metallized devices, chemical vapor deposited phosphosilicate films have been found to possess a number of significant advantages compared to silicon dioxide films deposited from silane under similar conditions. Results of a comprehensive study of the properties of bipolar and MOS devices of various degrees of complexity, coated with phosphosilicate films, will be presented.

  • A metallization providing two levels of interconnect for beam leaded silicon integrated circuits

    A two level metal structure is described for beam leaded silicon integrated circuits. The two level structure consists of a Ti-Pt first level, plasma deposited silicon nitride as interlevel dielectric, and Ti-Pt-Au as a second level. An example of the application of the structure to a bipolar LSI circuit is presented for the case of a 24 × 9 bit sequential access memory implemented with a Schottky I2L technology.

  • MulCh: a multi-layer channel router using one, two, and three layer partitions

    Chameleon, a channel router for three layers of interconnect, has been implemented to accept specification of an arbitrary number of layers. Chameleon is based on a strategy of decomposing the multilayer problem into two- and three-layer problems in which one of the layers is reserved primarily for vertical wire runs and the other layer(s) for horizontal runs. In some situations, however, it is advantageous to consider also layers that allow the routing of entire nets, using both horizontal and vertical wires. MulCh is a multilayer channel router that extends the algorithms of Chameleon in this direction. MulCh can route channels with any number of layers and automatically chooses a good assignment of wiring strategies to the different layers. In test cases, MulCh shows significant improvement over Chameleon in terms of channel width, net length, and number of vias.<<ETX>>



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