Conferences related to Integrated circuit measurements

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2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE International Instrumentation and Measurement Technology Conference (I2MTC)

The Conference focuses on all aspects of instrumentation and measurement science andtechnology research development and applications. The list of program topics includes but isnot limited to: Measurement Science & Education, Measurement Systems, Measurement DataAcquisition, Measurements of Physical Quantities, and Measurement Applications.


2020 IEEE International Solid- State Circuits Conference - (ISSCC)

ISSCC is the foremost global forum for solid-state circuits and systems-on-a-chip. The Conference offers 5 days of technical papers and educational events related to integrated circuits, including analog, digital, data converters, memory, RF, communications, imagers, medical and MEMS ICs.


2020 IEEE International Symposium on Circuits and Systems (ISCAS)

The International Symposium on Circuits and Systems (ISCAS) is the flagship conference of the IEEE Circuits and Systems (CAS) Society and the world’s premier networking and exchange forum for researchers in the highly active fields of theory, design and implementation of circuits and systems. ISCAS2020 focuses on the deployment of CASS knowledge towards Society Grand Challenges and highlights the strong foundation in methodology and the integration of multidisciplinary approaches which are the distinctive features of CAS contributions. The worldwide CAS community is exploiting such CASS knowledge to change the way in which devices and circuits are understood, optimized, and leveraged in a variety of systems and applications.


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Periodicals related to Integrated circuit measurements

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Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Circuits and Systems for Video Technology, IEEE Transactions on

Video A/D and D/A, display technology, image analysis and processing, video signal characterization and representation, video compression techniques and signal processing, multidimensional filters and transforms, analog video signal processing, neural networks for video applications, nonlinear video signal processing, video storage and retrieval, computer vision, packet video, high-speed real-time circuits, VLSI architecture and implementation for video technology, multiprocessor systems--hardware and software-- ...


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


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Most published Xplore authors for Integrated circuit measurements

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Xplore Articles related to Integrated circuit measurements

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An X-band balanced-mixer integrated circuit

1966 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1966

None


Fast and accurate isothermal measurements on process-split wafers

2001 IEEE International Integrated Reliability Workshop. Final Report (Cat. No.01TH8580), 2001

None


A four-quadrant analog divider multiplier with 0.01% distortion

1983 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1983

A 600MHz transconductance amplifier exhibiting 1% gain compression at 300MHz and 80% of full range with 0.2% thermal distortion, using cascomp technology, will be reported.


Common and differential crosstalk characterization on the silicon substrate

IEEE Microwave and Guided Wave Letters, 1999

Integrated circuit pad-to-pad crosstalk characterization structures were fabricated and measured over a 8000 μm×2500 μm area using Al pads on a silicon substrate. The structures were tested by a pure-mode network analyzer to yield common- and differential-mode crosstalk at 1 and 2 GHz. Differential-mode signals introduce far less substrate noise. This novel technique can characterize substrate noise levels near sensitive ...


Interconnect capacitances, crosstalk, and signal delay in vertically integrated circuits

Proceedings of International Electron Devices Meeting, 1995

The impact of the three-dimensional circuit structure in Vertically Integrated Circuits (VICs) on interconnect capacitances, crosstalk and signal delay is investigated based on measurements and simulations. In comparison with planar IC technologies, increased substrate coupling and reduced coupling capacitances between adjacent interconnection lines considerably improve the noise immunity for VICs with chiplayers fabricated in silicon-bulk technology. For thin-film silicon-on-insulator chiplayers, ...


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Educational Resources on Integrated circuit measurements

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IEEE.tv Videos

Micro-Apps 2013: Determining Circuit Material Dielectric Constant from Phase Measurements
Maker Faire 2008: Spectrum's Digital Clock Contest Winner
ON-CHIP VOLTAGE AND TIMING DIAGNOSTIC CIRCUITS
IMS 2012 Microapps - Integrated Electrothermal Solution Delivers Thermally Aware Circuit Simulation Rick Poore, Agilent EEsof
Sources of Innovation
ASC-2014 SQUIDs 50th Anniversary: 1 of 6 Arnold Silver
Micro-Apps 2013: Optimizing Chip, Module, Board Transitions Using Integrated EM and Circuit Design Simulation Software
An Integrated Optical Parallel Multiplier Exploiting Approximate Binary Logarithms - Jun Shiomi - ICRC 2018
BSIM Spice Model Enables FinFET and UTB IC Design
An IEEE IPC Special Session with Kasia Balakier of UCL
Micro-Apps 2013: Integrated Electro-Thermal Design of a SiGe PA
Education for Analog ICs
Micro-Apps 2013: Designing an ETSI E-Band Circuit for a MM Wave Wireless System
Neuromorphic Mixed-Signal Circuitry for Asynchronous Pulse Processing Neuromorphic Mixed-Signal Circuitry for Asynchronous Pulse Processing - Peter Petre: 2016 International Conference on Rebooting Computing
Joint TX and Feedback RX IQ Mismatch Compensation for Integrated Direct Conversion Transmitters: RFIC Interactive Forum 2017
A Fully-Integrated SOI CMOS Complex-Impedance Detector for Matching Network Tuning in LTE Power Amplifier: RFIC Interactive Forum
IMS 2011 Microapps - Panel Session: Nonlinear Measurements
Micro-Apps 2013: Design and Simulation of Phased Arrays in VSS
APEC 2011-Intersil Promo Apec 2011
The Evolution and Future of RF Silicon Technologies for THz Applications

IEEE-USA E-Books

  • An X-band balanced-mixer integrated circuit

    None

  • Fast and accurate isothermal measurements on process-split wafers

    None

  • A four-quadrant analog divider multiplier with 0.01% distortion

    A 600MHz transconductance amplifier exhibiting 1% gain compression at 300MHz and 80% of full range with 0.2% thermal distortion, using cascomp technology, will be reported.

  • Common and differential crosstalk characterization on the silicon substrate

    Integrated circuit pad-to-pad crosstalk characterization structures were fabricated and measured over a 8000 μm×2500 μm area using Al pads on a silicon substrate. The structures were tested by a pure-mode network analyzer to yield common- and differential-mode crosstalk at 1 and 2 GHz. Differential-mode signals introduce far less substrate noise. This novel technique can characterize substrate noise levels near sensitive radio frequency (RF) and microwave circuits.

  • Interconnect capacitances, crosstalk, and signal delay in vertically integrated circuits

    The impact of the three-dimensional circuit structure in Vertically Integrated Circuits (VICs) on interconnect capacitances, crosstalk and signal delay is investigated based on measurements and simulations. In comparison with planar IC technologies, increased substrate coupling and reduced coupling capacitances between adjacent interconnection lines considerably improve the noise immunity for VICs with chiplayers fabricated in silicon-bulk technology. For thin-film silicon-on-insulator chiplayers, noise immunity can be assured through the integration of conductive layers between active chips. The reduced interconnection lengths at system level lead to decreased interconnect delays despite higher total interconnect capacitances.

  • Measurement Environment for Reliability Study of High Current First Level Interconnections

    Reliability of integrated circuits in electronic packages and connections is a major concern, due to the increasing die size, power dissipation and temperature. The extension of existing interconnection technologies towards higher current/power handling capabilities is a challenging and demanding task. In this paper a powerful system for experimental evaluation and reliability study for high current first level interconnections, up to 20 A, is presented. The system is used for evaluation of wire and flip-chip interconnections.

  • Uniformly Ion Implantation for GaAs FETs - Relation to Material and Processing Variabies

    Uniformly ion implanted semi-insulating wafers of gallium arsenide are desirable if the material is ever to be used for high yield integrated circuit manufacture. In this work an established implantation and device technology is described. Careful measurements and characterisation of implanted samples from different suppliers relate material properties to electrical measurements of sheet carrier concentration, mobility and profiles. Variations in processing procedure and material are then related to FET device parameters using both DC and RF characterisation.

  • Circuit analysis and optimization driven by worst-case distances

    In this paper, a new methodology for integrated circuit design considering the inevitable manufacturing and operating tolerances is presented. It is based on a new concept for specification analysis that provides exact worst-case transistor model parameters and exact worst-case operating conditions. Corresponding worst-case distances provide a key measure for the performance, the yield, and the robustness of a circuit. A new deterministic method for parametric circuit design that is based on worst-case distances is presented. It comprises nominal design, worst-case analysis, yield optimization, and design centering. In contrast to current approaches, it uses standard circuit simulators and at the same time considers deterministic design parameters of integrated circuits at reasonable computational costs. The most serious disadvantage of geometric approaches to design centering is eliminated, as the method's complexity increases only linearly with the number of design variables.<<ETX>>

  • Characterization of crosstalk noise in submicron CMOS integrated circuits: an experimental view

    A way to characterize the crosstalk noise susceptibility for integrated circuits fabrication technologies is presented. A comparison between 0.7- and 0.35-/spl mu/m technologies shows the increasing importance of crosstalk noise and, therefore, the need to consider this effect at the design level in submicron integrated circuits. An approach to measure the internal crosstalk generated by long metal interconnects based on using an RS latch sensor is proposed. An implementation and experimental measurements for 0.7-/spl mu/m technology are reported, confirming the very high noise peak values.

  • A systems approach to electromigration prevention in bipolar integrated circuits

    A rigorous statistical technique is presented for properly modeling the design rules for the maximum current density permitted to pass through the interconnecting metal of an integrated circuit. The electromigration model includes consideration of the circuit's overall manufacturing and systems environment. Process variables, assembly variables, and variations in the system's electrical and thermal environment are statistically accounted for when determining current density limits in the metallization. This assures that the reliability requirements of the circuit are met.<<ETX>>



Standards related to Integrated circuit measurements

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IEEE Standard Interface for Hardware Description Models of Electronic Components

Development of a standard simulation and related tool interface for component models written in VHDL, Verilog, C and other description languages.



Jobs related to Integrated circuit measurements

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