Conferences related to Integrated circuit interconnections

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2021 IEEE Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


2020 59th IEEE Conference on Decision and Control (CDC)

The CDC is the premier conference dedicated to the advancement of the theory and practice of systems and control. The CDC annually brings together an international community of researchers and practitioners in the field of automatic control to discuss new research results, perspectives on future developments, and innovative applications relevant to decision making, automatic control, and related areas.


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.


2020 IEEE International Solid- State Circuits Conference - (ISSCC)

ISSCC is the foremost global forum for solid-state circuits and systems-on-a-chip. The Conference offers 5 days of technical papers and educational events related to integrated circuits, including analog, digital, data converters, memory, RF, communications, imagers, medical and MEMS ICs.


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Periodicals related to Integrated circuit interconnections

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Automatic Control, IEEE Transactions on

The theory, design and application of Control Systems. It shall encompass components, and the integration of these components, as are necessary for the construction of such systems. The word `systems' as used herein shall be interpreted to include physical, biological, organizational and other entities and combinations thereof, which can be represented through a mathematical symbolism. The Field of Interest: shall ...


Circuits and Systems I: Regular Papers, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


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Most published Xplore authors for Integrated circuit interconnections

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Xplore Articles related to Integrated circuit interconnections

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Low-K cu damascene interconnection leakage and process induced damage assessment

2004 International Conference on Integrated Circuit Design and Technology (IEEE Cat. No.04EX866), 2004

None


Packaging for high performance computers

1978 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1978

The session will be focused on how packaging technology influences the performance and cost of current and future computers. Alternative packaging designs will be compared, with emphasis on their capabilities, limitations and extendability to future machines.


Programmable interconnection technique

1966 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1966

None


Proceedings Fourth International Symposium on Quality Electronic Design

Fourth International Symposium on Quality Electronic Design, 2003. Proceedings., 2003

The following topics are dealt with: VLSI design, modeling, simulation; IC packages; interconnected systems; noise analysis; system on chip; submicron technology; high speed circuits; reliability; IC testing; leakage currents; testing measurements.


Surface mount technology in communications products

8th IEEE/CHMT International Conference on Electronic Manufacturing Technology Symposium, 1990

Summary form only given. Motorola development efforts in the area of communications-product surface-mount assembly are discussed. Attention is given to the development of a single-layer metallized chip carrier technology which has resulted in high-density packaging of integrated circuits with no compromise of field reliability or environmental performance. Techniques for the attachment or surface mount of these and other components directly ...


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Educational Resources on Integrated circuit interconnections

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IEEE.tv Videos

Maker Faire 2008: Spectrum's Digital Clock Contest Winner
IMS 2012 Microapps - Integrated Electrothermal Solution Delivers Thermally Aware Circuit Simulation Rick Poore, Agilent EEsof
Sources of Innovation
ASC-2014 SQUIDs 50th Anniversary: 1 of 6 Arnold Silver
Micro-Apps 2013: Optimizing Chip, Module, Board Transitions Using Integrated EM and Circuit Design Simulation Software
An Integrated Optical Parallel Multiplier Exploiting Approximate Binary Logarithms - Jun Shiomi - ICRC 2018
Micro-Apps 2013: Integrated Electro-Thermal Design of a SiGe PA
An IEEE IPC Special Session with Kasia Balakier of UCL
BSIM Spice Model Enables FinFET and UTB IC Design
Education for Analog ICs
Micro-Apps 2013: Designing an ETSI E-Band Circuit for a MM Wave Wireless System
Neuromorphic Mixed-Signal Circuitry for Asynchronous Pulse Processing Neuromorphic Mixed-Signal Circuitry for Asynchronous Pulse Processing - Peter Petre: 2016 International Conference on Rebooting Computing
APEC 2011-Intersil Promo Apec 2011
The Evolution and Future of RF Silicon Technologies for THz Applications
2015 IEEE Honors: IEEE Jun-ichi Nishizawa Medal - Dimitri A. Antoniadis
IMS 2012 Microapps - Fully Integrating 3D Electromagnetic (EM) Simulation into Circuit Simulation
Towards Logic-in-Memory circuits using 3D-integrated Nanomagnetic Logic - Fabrizio Riente: 2016 International Conference on Rebooting Computing
Quantum Computation - ASC-2014 Plenary series - 4 of 13 - Tuesday 2014/8/12
Radio Frequency Identification(RFID)
ON-CHIP VOLTAGE AND TIMING DIAGNOSTIC CIRCUITS

IEEE-USA E-Books

  • Low-K cu damascene interconnection leakage and process induced damage assessment

    None

  • Packaging for high performance computers

    The session will be focused on how packaging technology influences the performance and cost of current and future computers. Alternative packaging designs will be compared, with emphasis on their capabilities, limitations and extendability to future machines.

  • Programmable interconnection technique

    None

  • Proceedings Fourth International Symposium on Quality Electronic Design

    The following topics are dealt with: VLSI design, modeling, simulation; IC packages; interconnected systems; noise analysis; system on chip; submicron technology; high speed circuits; reliability; IC testing; leakage currents; testing measurements.

  • Surface mount technology in communications products

    Summary form only given. Motorola development efforts in the area of communications-product surface-mount assembly are discussed. Attention is given to the development of a single-layer metallized chip carrier technology which has resulted in high-density packaging of integrated circuits with no compromise of field reliability or environmental performance. Techniques for the attachment or surface mount of these and other components directly to printed circuit boards are also examined.<<ETX>>

  • Determination of yield bounds prior to routing

    Integrated circuit manufacturing complexities have resulted in decreasing product yields and reliabilities. This process has been accelerated with the advent of very deep sub-micron technologies coupled with the introduction of newer materials and technologies like copper interconnects, silicon-on- insulator and increased wafer sizes. The need to improve product yields has been recognized and currently some yield enhancement techniques are used in industry CAD tools. Still, the significant increase in problem size implies that considerable time and effort can be saved if the designer could predict the yield of each design stage. In this paper we undertake an effort to derive bounds on the yield of the routing for a given placement. When the design is routed, resulting in a yield which is significantly smaller than the bound, the designer can choose to change the router cost functions, modify the placement or even re-design the unit in an attempt to increase the yield. We compare the bounds on yield obtained for a set of standard benchmarks against exact yield values for the "vanilla" routings, and the run times needed to calculate the two. The results indicate that reasonably good estimates of yield can be obtained in significantly lower amounts of run time. The accuracy of the estimates increases when larger designs are considered as the simplifying assumptions made and the model no longer influences the estimates significantly.

  • Fast and accurate isothermal measurements on process-split wafers

    None

  • Silicon Integrated Systems Beyond Half Micron

    None

  • Bimodal MOS-bipolar monolithic kitchip array

    None

  • Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits

    This article describes heat dissipation challenges in 3-D ICs; using two case studies, it also presents insights and design guidelines for 3-D thermal management.



Standards related to Integrated circuit interconnections

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