Conferences related to Inorganic materials

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2023 Annual International Conference of the IEEE Engineering in Medicine & Biology Conference (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted full papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions,will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.


2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting

The joint meeting is intended to provide an international forum for the exchange of information on state of the art research in the area of antennas and propagation, electromagnetic engineering and radio science


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE International Conference on Plasma Science (ICOPS)

IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.


2020 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.


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Periodicals related to Inorganic materials

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Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Computing in Science & Engineering

Physics, medicine, astronomy—these and other hard sciences share a common need for efficient algorithms, system software, and computer architecture to address large computational problems. And yet, useful advances in computational techniques that could benefit many researchers are rarely shared. To meet that need, Computing in Science & Engineering (CiSE) presents scientific and computational contributions in a clear and accessible format. ...


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Most published Xplore authors for Inorganic materials

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Xplore Articles related to Inorganic materials

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Corrections to "Reconstruction of the Constitutive Parameters for an /spl Omega/ Material in a Rectangular Waveguide"

IEEE Transactions on Microwave Theory and Techniques, 1997

None


Crack Identification in Metallic Materials

Digest of the Fifth Biennial IEEE Conference on Electromagnetic Field Computation, 1992

None


Losses caused by roughness of metallization in printed-circuit boards

IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005., 2005

In this paper the effect of metal roughness on the total loss, the extracted tan /spl delta/, and signal integrity of typical interconnections found in printed-circuit boards is extracted from measurements on three different materials. The differing characteristics of the roughened metal cross sections are highlighted, and a simplified, practical, two-dimensional, causal, broadband modeling methodology is shown.


Material failure and inertial instabilities in a shocked and imploded cylindrical aluminum sample

25th Anniversary, IEEE Conference Record - Abstracts. 1998 IEEE International Conference on Plasma Science (Cat. No.98CH36221), 1998

Summary form only given. We have used the LANL PEGASUS Z-pinch facility to drive a thin cylindrically-convergent Al liner to /spl sim/3 km/s to launch /spl sim/30 GPa shocks in a 3-mm thick 10-mm-i.d. aluminum cylinder whose interior is filled with 1 atm Xe gas. The subsequent material motion of the metal and gas is diagnosed with both radial and ...


Superior metal step coverage and dielectric quality in a simple two-level metal 1.0 mu m CMOS technology

Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference, 1989

A two-level metal process for a fourth-generation 1.0- mu m CMOS technology has been developed which yields superior aluminum step coverages and high- quality dielectrics without introducing complicated processing sequences. The process is cost-effective since it includes traditional materials and high throughput operations and is readily extendable to three levels of metal. The process incorporates a highly smoothed BPSG for ...


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Educational Resources on Inorganic materials

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IEEE.tv Videos

Nanotechnology For Electrical Engineers
EMBC 2011-Keynote-From Nature and Back Again ... Giving New Life to Materials for Energy, Electronics, Medicine and the Environment - Angela Belcher, PhD
Spatial-Spectral Materials for High Performance Optical Processing - IEEE Rebooting Computing 2017
IMS 2012 Microapps - Bonding Materials used in Multilayer Microwave PCB Applications
Wanda Reder: Educational Materials for Expert and Non-Expert — IEEE Power and Energy Society’s “Plain Talk” — Studio Tech Talks: Sections Congress 2017
Unconventional Superconductivity: From History to Mystery
Nanotechnology, we are already there: APEC 2013 KeyTalk with Dr. Terry Lowe
Multi-Function VCO Chip for Materials Sensing and More - Jens Reinstaedt - RFIC Showcase 2018
Unique Fixtures for Characterizing Electromagnetic Properties of Materials at THz Frequencies: MicroApps 2015 - Keysight Technologies
Care Innovations: Green Engineering (com legendas em portugues)
MicroApps: Fast, Accurate and Nondestructive Solutions of Materials Test up to 1.1 THz (Agilent Technologies)
Magnetic Materials and Magnetic Devices - Josep Fontcuberta: IEEE Magnetics Distinguished Lecture 2016
IRDS: Metrology - George Orji at INC 2019
2013 IEEE Corporate Innovation Award
Materials Challenges for Next-Generation, High-Density Magnetic Recording - Kazuhiro Hono: IEEE Magnetics Distinguished Lecture 2016
35 Years of Magnetic Heterostructures
IMS MicroApp: Advances in High Frequency Printed Circuit Board (PCB)
Educational Resources for Humanitarian Activities - Michael Lightner - Brief Sessions: Sections Congress 2017
Advanced Simulation of Nanodevices - Luca Selmi at INC 2019
Recent Research Activities of Applied Superconductivity in China

IEEE-USA E-Books

  • Corrections to "Reconstruction of the Constitutive Parameters for an /spl Omega/ Material in a Rectangular Waveguide"

    None

  • Crack Identification in Metallic Materials

    None

  • Losses caused by roughness of metallization in printed-circuit boards

    In this paper the effect of metal roughness on the total loss, the extracted tan /spl delta/, and signal integrity of typical interconnections found in printed-circuit boards is extracted from measurements on three different materials. The differing characteristics of the roughened metal cross sections are highlighted, and a simplified, practical, two-dimensional, causal, broadband modeling methodology is shown.

  • Material failure and inertial instabilities in a shocked and imploded cylindrical aluminum sample

    Summary form only given. We have used the LANL PEGASUS Z-pinch facility to drive a thin cylindrically-convergent Al liner to /spl sim/3 km/s to launch /spl sim/30 GPa shocks in a 3-mm thick 10-mm-i.d. aluminum cylinder whose interior is filled with 1 atm Xe gas. The subsequent material motion of the metal and gas is diagnosed with both radial and axial flash X-rays and with optical framing cameras Instabilities are seeded by implanting wires of assorted higher density metal parallel to the cylinder axis. We have done two shots, varying the target from Al 1100-O to Al 6061-T6 to explore the effect of changing material strength. The images show the spallation failure of the metal-gas interface on shock release and the effect of the seeded instabilities.

  • Superior metal step coverage and dielectric quality in a simple two-level metal 1.0 mu m CMOS technology

    A two-level metal process for a fourth-generation 1.0- mu m CMOS technology has been developed which yields superior aluminum step coverages and high- quality dielectrics without introducing complicated processing sequences. The process is cost-effective since it includes traditional materials and high throughput operations and is readily extendable to three levels of metal. The process incorporates a highly smoothed BPSG for dielectric I and resist- etchback planarization of plasma-enhanced TEOS for dielectric II. Also featured are a tapered aluminum I profile and modified contact window and via etch profiles. Defect density and electromigration data predict excellent yield and reliability for this process.<<ETX>>

  • Researches based on shielding the electromagnetic radiation of armoured concrete architectural electronic distribution room

    Based upon a great sum of site trials and counting emulations on the study of shielding efficiency of armoured concrete, this research studies the interference sources of the electromagnetic radiation and the distribution model of the electromagnetic radiation in the architectural electronic distribution room to realize the concrete iron model unit applied to different shielding efficiency demand and to lay the foundation for environment evaluation of electromagnetic radiation in the architectural electronic distribution room.

  • Suppression of resonant modes in microwave packages

    Undesirable resonant cavity modes of a metal package are shown to be damped effectively by placing a dielectric substrate coated with a resistive film in the cavity. Theoretical predictions are confirmed experimentally. The application of this technique to a hybrid phase shifter in which coupling to a resonant mode of the package degrades circuit performance is discussed. The undesirable interaction of the phase-shifting circuit and a resonant package mode is shown to be suppressed effectively by the introduction of the lossy film.<<ETX>>

  • Simple model for the switching I-V characteristic in electroformed MIM structures

    A simple analytical model for the switching I-V characteristic in electroformed metal-insulator-metal structures is reported. The transitions from the OFF state (high resistance) to the ON state (low resistance) and back are modeled using an equivalent electrical circuit model consisting in two opposite-biased diodes with a series resistance. It is shown how the I-V characteristics are achieved by means of an appropriate change of model parameters.

  • Failure analysis on foreign object damage of aero-engine compressor blade

    Aero-engine blades always failure due to impact of foreign object damage in service. Damnification and consequent fracture failure of blade is one of the main failure modes for the compressor blades in aero-engine. Damage characteristic on blades caused by different kind of material are various. Observation on damaged surfaces, trace analysis and surface element analysis by means of SEM and X-ray energy spectrum are effective methods to estimate the attribute, component and outline of foreign object. In this paper, analysis on several cases of FOD are introduced. The features, principles and rules of several typical FOD modes are summarized through failure cases analysis.

  • Non-Bragg diffraction orders in highly efficient photorefractive polymers

    Summary form only given. Photorefractive polymers have improved considerably in recent years. Due to their higher processing capabilities compared with inorganic photorefractive crystals and their high efficiency and sensitivity they appear as promising new materials for photonic applications. Due to high refractive index modulations that can be achieved in DMNPAA:PVK:ECZ:TNF guest/host photorefractive polymers, we recently demonstrated with these polymers a variety of optical applications including holographic storage and dynamic holographic interferometry with low-power laser diodes in a four-wave mixing geometry. In this paper, we demonstrate that the recording of thick phase holograms in these polymers leads not only to very efficient Bragg diffraction but also to strong diffraction into non-Bragg orders. These non- Bragg orders have features drastically different from those of Raman-Nath diffraction orders on thin gratings.



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