Conferences related to Inorganic chemicals

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2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE Frontiers in Education Conference (FIE)

The Frontiers in Education (FIE) Conference is a major international conference focusing on educational innovations and research in engineering and computing education. FIE 2019 continues a long tradition of disseminating results in engineering and computing education. It is an ideal forum for sharing ideas, learning about developments and interacting with colleagues inthese fields.


2020 IEEE International Conference on Plasma Science (ICOPS)

IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.


2020 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.


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Periodicals related to Inorganic chemicals

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Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Computational Biology and Bioinformatics, IEEE/ACM Transactions on

Specific topics of interest include, but are not limited to, sequence analysis, comparison and alignment methods; motif, gene and signal recognition; molecular evolution; phylogenetics and phylogenomics; determination or prediction of the structure of RNA and Protein in two and three dimensions; DNA twisting and folding; gene expression and gene regulatory networks; deduction of metabolic pathways; micro-array design and analysis; proteomics; ...


Control Systems Technology, IEEE Transactions on

Serves as a compendium for papers on the technological advances in control engineering and as an archival publication which will bridge the gap between theory and practice. Papers will highlight the latest knowledge, exploratory developments, and practical applications in all aspects of the technology needed to implement control systems from analysis and design through simulation and hardware.


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Most published Xplore authors for Inorganic chemicals

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Xplore Articles related to Inorganic chemicals

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Further Development on Area Measurement Using Sinusoidal Image Perturbation

IEEE Transactions on Industrial Electronics and Control Instrumentation, 1973

A more thorough examination of an area-measurement system employing chemical arrays is presented. An improvement in area-measurement accuracy is obtained when the amplitude of the sinusoidal perturbation signal is increased beyond the array-connector separation. The measurement error for various images in different positions on the receptor-connector matrix is considered.


Potential Applications Of Plasma Science Techniques For Water Treatment Systems

Proceedings of 1994 IEEE 21st International Conference on Plasma Sciences (ICOPS), 1994

None


Study on Mechanical and Corona-resistance Property of Polyimide/silica Hybrid Films

2007 IEEE International Conference on Solid Dielectrics, 2007

Polyimide/Silica (PI/SiO2) hybrid films were prepared through Sol-Gel route using tetraethoxysilane (TEOS) as inorganic precursors. The fracture morphologies of hybrid films were characterized by Scanning Electron Microscope (SEM). The result showed that the silica particles were dispersed finely in PI matrix, and the dispersity of silica particles didn't change with silica content. The sizes of inorganic particles changed little with ...


Single-Wafer vs. Batch Wet Surface Preparation in BEOL: a Comparison of Polymer Cleans using Inorganic Chemicals in Flash Memory Production

The 17th Annual SEMI/IEEE ASMC 2006 Conference, 2006

In this paper a specific case study comparing a batch and a single-wafer process using inorganic chemicals to remove post-etch residue (polymer) on flash device wafers is presented. The adoption of polymer cleans using dilute sulfuric-peroxide-HF (DSP<sup>+</sup>) mixture on a single-wafer SEZ spin processor was reported earlier and has resulted in a significant cost reduction and marked yield improvement at ...


Cost reduction and yield improvement by removing postash polymer residue from BEOL structures using inorganic chemicals

Semiconductor Manufacturing Technology Workshop, 2002, 2002

As finer architectures and higher aspect ratios result in the introduction of new materials, IC manufacturing processes must change to meet unprecedented higher requirements without adding cost and affecting throughput. This represents an enormous challenge to equipment design and chemical formulation development alike. Moreover, the transition to 300 mm wafer technology demands adaptation of 200-mm applications or even completely new ...


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Educational Resources on Inorganic chemicals

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IEEE-USA E-Books

  • Further Development on Area Measurement Using Sinusoidal Image Perturbation

    A more thorough examination of an area-measurement system employing chemical arrays is presented. An improvement in area-measurement accuracy is obtained when the amplitude of the sinusoidal perturbation signal is increased beyond the array-connector separation. The measurement error for various images in different positions on the receptor-connector matrix is considered.

  • Potential Applications Of Plasma Science Techniques For Water Treatment Systems

    None

  • Study on Mechanical and Corona-resistance Property of Polyimide/silica Hybrid Films

    Polyimide/Silica (PI/SiO2) hybrid films were prepared through Sol-Gel route using tetraethoxysilane (TEOS) as inorganic precursors. The fracture morphologies of hybrid films were characterized by Scanning Electron Microscope (SEM). The result showed that the silica particles were dispersed finely in PI matrix, and the dispersity of silica particles didn't change with silica content. The sizes of inorganic particles changed little with silica content and they were all less than 100nm when the silica content was less than 15wt%. Moreover, the interface between inorganic and organic phases was clear. The sizes of silica particles reached hundreds nanometers, and the interface between two phases became obscure at silica content of 30wt%. The mechanical properties measurement showed that the tensile strength and elongation at break of hybrid films were influenced by silica content. The two parameters got to maximum at silica content of 3wt%. The corona-resistance measurement showed that the corona-resistance property of hybrid films was improved by introducing silica. And the corona-resistance time was 180h at silica content of 30wt%.

  • Single-Wafer vs. Batch Wet Surface Preparation in BEOL: a Comparison of Polymer Cleans using Inorganic Chemicals in Flash Memory Production

    In this paper a specific case study comparing a batch and a single-wafer process using inorganic chemicals to remove post-etch residue (polymer) on flash device wafers is presented. The adoption of polymer cleans using dilute sulfuric-peroxide-HF (DSP<sup>+</sup>) mixture on a single-wafer SEZ spin processor was reported earlier and has resulted in a significant cost reduction and marked yield improvement at Spansion Fab 25. Initially, the process was introduced for all metal layers and contact layers 2 through 6. Contact 1, however, was performed on a spray batch tool using a sulfuric-per oxide mixture (SPM) followed by an ammonium-peroxide mixture (APM). As part of their continued desire to use single-wafer tools and to diminish the number and quantity of chemicals used in the fab, the effectiveness of the DSP <sup>+</sup> process on contact 1 was investigated. The results of this investigation are presented here. Detailed wafer metrology and electrical characterization and yield data are discussed

  • Cost reduction and yield improvement by removing postash polymer residue from BEOL structures using inorganic chemicals

    As finer architectures and higher aspect ratios result in the introduction of new materials, IC manufacturing processes must change to meet unprecedented higher requirements without adding cost and affecting throughput. This represents an enormous challenge to equipment design and chemical formulation development alike. Moreover, the transition to 300 mm wafer technology demands adaptation of 200-mm applications or even completely new process design. In the case of post-ash polymer removal in BEOL processing, a cost-effective approach applying novel inorganic mixtures on SEZ single-wafer tools has been found that enables shorter process times whilst ensuring wafer-to-wafer repeatability, low particle levels and even higher yields.

  • A duck robot for weeding work on the paddy field

    In recent years at the rice cultivation, it has been a problem that sprinkling inorganic manure and inorganic agricultural chemicals pollutes environment while raising harvest. Then, growing the rice by organic agriculture, and no agrochemicals and decrease agricultural chemicals has come to be desired earnestly. However, in organic agriculture or agrochemical-free cultivation, it is indispensable to weeds prevention of the breeding and extermination. The work for weed is the bad labor environment on the man in the paddy field of a summer time and which needs physical strength. Recently it is widely used, that small animals, such as a duck and a carp, are bred in a paddy field, and they make the extermination of weeds. However, using a duck for extermination work also has a problem. Namely, training from the egg of a duck, it is because the exclusion from the paddy field after becoming large is difficult. Then, it considered doing these work using small autonomous robots. Through the experiments the effectiveness of the proposed robot is certificated.

  • Electronic energy of Fe-Si alloys calculated by a density-functional method using a pseudopotential approach

    Electronic energies of intermetallic compounds of the Fe-Si system were calculated so as to elucidate the possibility of the prediction of phase stability by a quantum-mechanical calculation on the basis of the local density approximation to density-functional theory and a pseudopotential description of the electron-ion interaction. It could be shown that /spl beta/-FeSi/sub 2/ is more stable than /spl alpha/- and /spl gamma/-FeSi/sub 2/, and that /spl epsi/-FeSi is than FeSi of CsCl- and NaCl-type.

  • The chemistry behind grounding

    The basic objectives of a good electrical grounding system are for human safety, reliability of equipment operation, fault current return and to limit EMI/transient over voltages coupling. After satisfying all the above requirements, the effect of corrosion on the grounding installation must be considered for sustaining effectiveness of grounding. In this paper various types of corrosion and prevention mechanisms and its importance in grounding are described.

  • New results on molecular inorganic and organic conductors

    None

  • Development of some Bio-Composite Materials Hydroxyapatite/Chitosan and TiO<sub>2</sub>/Chitosan

    New-type materials, which consist of organic and inorganic compounds, have been prepared. The materials have various functions and specific nature because of their improved mechanical, thermal, optical, or chemical properties relative to the organic or inorganic materials alone. The aim of this study is to prepare and characterise micro composite films hydroxyapatite/chitosane and TiO2/chitosane of which the use could be made in varied forms intended for applications like filter for the treatment and the purification of water and like photocatalysis. Initially the very thin film in chitosan, which is a few microns, was formed on a drinking glass holder then plunged in a phosphate and calcium supersaturated solution. The physicochemical analyses carried out on obtained composite films showed the nucleation of the nanometric crystal of hydroxyapatite on the surface of the layer of chitosan. By this same alternative soaking process, the preparation of a range of TiO2/chitosan composite was carried out successfully. We showed that the granulation and the shape of materials obtained strongly depend on the morphological and structural properties of polymeric film.



Standards related to Inorganic chemicals

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