Impedance matching

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In electronics, impedance matching is the practice of designing the input impedance of an electrical load or the output impedance of its corresponding signal source in order to maximize the power transfer and/or minimize reflections from the load. (Wikipedia.org)






Conferences related to Impedance matching

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2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting

The joint meeting is intended to provide an international forum for the exchange of information on state of the art research in the area of antennas and propagation, electromagnetic engineering and radio science


2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


2020 IEEE 11th Latin American Symposium on Circuits & Systems (LASCAS)

LASCAS aims at presenting a high-quality forum for researchers, designers, developers and graduate students to present the advances of their work on circuits and systems, amidst an international audience with experts from academia and industry all over the world. The LASCAS 2020 symposium will cover novel technical developments in all the areas of the Circuits and Systems Society, but focusing in the areas of biomedical and implantable devices and applications, low power integrated circuits, high speed communication interfaces and circuits and systems design for renewable energy applications.

  • 2019 IEEE 10th Latin American Symposium on Circuits & Systems (LASCAS)

    LASCAS is the Flagship Conference of IEEE's Circuits and Systems Society in Latin America. Since its inception and first edition in 2010, LASCAS aims at presenting a high-quality forum for researchers and graduate students to present the advances of their work, admits an international audience with experts from all over the world. This 10th edition will take place in Armenia, Quindío, Colombia

  • 2018 IEEE 9th Latin American Symposium on Circuits & Systems (LASCAS)

    To present the most recent developments in the fields of electronic circuits and systems, including the whole range of applications.

  • 2017 IEEE 8th Latin American Symposium on Circuits & Systems (LASCAS)

    Circuits and Systems

  • 2016 IEEE 7th Latin American Symposium on Circuits & Systems (LASCAS)

    The IEEE Latin American Symposium on Circuits and Systems (LASCAS) is the Latin American flagship conference and networking forum for worldwide engineers and researchers in the field of circuits and systems. While LASCAS is being organized by Latin American circuits & Systems community , it brings together worldwide researchers and engineers interested in theoretical, experimental, applications, or technology aspects of circuits & systems across a wide spectrum of scientific and technical fields:semiconductors, optoelectronics, sensors, VLSI, analog and digital circuits, RF circuits, biomedical circuits & systems, testing & reliability, multimedia and communications circuits & systems, among other topics.LASCAS will have a special emphasis on student activities, with grants for Latin American undergraduate students, and specific undergraduate student activities.

  • 2015 IEEE 6th Latin American Symposium on Circuits & Systems (LASCAS 2015)

    The IEEE Latin American Symposium on Circuits and Systems (ISCAS) is Latin American flagship conference and networking forum for worldwide engineers and researchers in the field of circuits and systems. While LASCAS is being organized by Latin American circuits & Systems community , brings together worldwide researchers and engineers interested in theoretical, experimental, applications, or technology aspects of circuits & systems across a wide spectrum of scientific and technical fields:semiconductors, optoelectronics, sensors, VLSI, analog and digital circuits, neural network, biomedical circuits & systems, testing & reliability, multimedia and communications circuits & systems, among other topics.LASCAS will have a special emphasis on student activities, with grants for Latin American undergraduate students, and specific undergraduate student activities.

  • 2014 IEEE 5th Latin American Symposium on Circuits and Systems (LASCAS)

    The goal is to be the International Symposiumof IEEE Circuits and Systems in Latin America. The symposium will cover technical novelties andtutorial overviews on circuits and systems topics. It is the most important symposium on circuits and systems in Latin America having participants for all over the world.

  • 2013 IEEE 4th Latin American Symposium on Circuits and Systems (LASCAS)

    LASCAS 2013 is the International Symposium of IEEE Circuits and Systems in Latin America. LASCAS 2013 will include oral and poster, tutorials given by experts in state-of-the-art topics, and special sessions with the aim of complementing the regular program with topics of of relevant interest to the circuits and systems community.

  • 2012 IEEE 3rd Latin American Symposium on Circuits and Systems (LASCAS)

    LASCAS's goal is to be the International Symposium of IEEE Circuits and Systems in Latin America. LASCAS 2012, sponsored by the IEEE Circuits and Systems Society and supported by INAOE, will be held in Playa del Carmen, Mexico. The scope of the conference is on topics related to circuits and systems such as: Analog and Digital Signal Processing, Biomedical Circuits and Systems, Multimedia Systems and Applications, Nanoelectronics, Cellular Neural Networks and Array Computing, Neural Systems and Applications, Circuits and Systems for Communications, Nonlinear Circuits and Systems, Computer-Aided Design, Power Systems and Power Electronic Circuits, Sensory Systems, Graph Theory and Computing, Visual Signal Processing and Communications, Life Science Systems and Applications, VLSI Systems and Applications, Electronic Testing, & Fault Tolerant Circuits.

  • 2011 IEEE Second Latin American Symposium on Circuits and Systems (LASCAS)

    LASCAS 2011 will be the second version of the International Symposium of IEEE Circuits and Systems in Latin America. The program will include oral and poster presentations, complemented with special sessions to cover technical novelties and tutorial overviews on circuits and systems topics.

  • 2010 First IEEE Latin American Symposium on Circuits and Systems (LASCAS)

    LASCAS2010 goal is to be the International Symposium of IEEE Circuits and Systems in Latin America. The LASCAS 2010 will include oral and poster; embedded tutorials given by experts in state-of-the-art topics; and special sessions, with the aim of complementing the regular program with topics of particular interest to the circuits and systems community.


2020 IEEE 29th International Symposium on Industrial Electronics (ISIE)

ISIE focuses on advancements in knowledge, new methods, and technologies relevant to industrial electronics, along with their applications and future developments.


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


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Periodicals related to Impedance matching

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Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Circuits and Systems I: Regular Papers, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


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Most published Xplore authors for Impedance matching

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Xplore Articles related to Impedance matching

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Comments on "Potential equations for anisotropic inhomogeneous media"

Proceedings of the IEEE, 1968

None


Microwave logarithmic amplifiers using hybrid-integrated-circuits

1971 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1971

A new approach for logarithmic IF amplifiers with ultra-wide logging bandwidths and center frequencies up to the microwave region will be described.


Design of a high-power wide-band balun for the high-frequency region

Transactions of the American Institute of Electrical Engineers, Part I: Communication and Electronics, 1963

A balun is a device for matching an unbalanced line to a balanced load. Described here is a balun with a cw (continuous wave) rating, with matched load, of 67.5 kva (kilovolt-amperes) over the frequency range from 2 to 30 mc (megacycles). A transmission-line-type design along with a newly developed ferrite core material and special cooling techniques have been used ...


Application of GaAs Schottky-gate FETs in microwave amplifiers

1973 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1973

Wideband input and output coupling networks for microwave amplifier stages incorporating GaAs MESFETs with 1-μm Schottky-gate will be described. Third-order intermodulation distortion of the transistors will also be discussed.


Minimum package parasitics for microwave devices

1976 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1976

As the operation of microwave devices is pushed to higher powers and frequencies, the mechanical and electrical interface between device and circuit becomes increasingly more important. Traditional wirebonding technology will be compared to alternate, more promising methods.


More Xplore Articles

Educational Resources on Impedance matching

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IEEE.tv Videos

Impedance Matching: RF Boot Camp
Fast Broadband Impedance Matching with Automatic Circuit Synthesis: MicroApps 2015 - Keysight Technologies
A Fully-Integrated SOI CMOS Complex-Impedance Detector for Matching Network Tuning in LTE Power Amplifier: RFIC Interactive Forum
Regular Expression Matching with Memristor TCAMs - Cat Graves - ICRC 2018
LDA to Find User Archetypes for Search & Matching
Dynamically Diverse Legged Locomotion for Rough Terrain
PCB Fabrication Influences on Microwave Performance: MicroApps 2015 - Rogers Corporation
Dorothy, we're not in Kansas anymore, we are in Impedance Land. Oh my! EMC Webinar
2D Nanodevices - Paul Hurley at INC 2019
V-Band Flip-Chip pHEMT Balanced Power Amplifier with CPWG-MS-CPWG Topology and CPWG Lange Couplers: RFIC Interactive Forum 2017
Achieving Balance Between Convergence and Diversity in Evolutionary Multi-Objective Optimization - Ke Li
Clustering 101
IMS 2014: Broadband Continuous-mode Power Amplifiers
Visual Clustering
Tech News on IEEE.tv
A High-Efficiency Linear Power Amplifier for 28GHz Mobile Communications in 40nm CMOS: RFIC Interactive Forum 2017
A 73GHz PA for 5G Phased Arrays in 14nm FinFET CMOS: RFIC Industry Showcase 2017
ISEC 2013 Special Gordon Donaldson Session: Remembering Gordon Donaldson - 3 of 7 - MEG and ULF-MRI
Multi-Level Optimization for Large Fan-In Optical Logic Circuits - Takumi Egawa - ICRC 2018
A 12-b, 1-GS/s 6.1mW Current-Steering DAC in 14nm FinFET with 80dB SFDR for 2G/3G/4G Cellular Application: RFIC Industry Showcase 2017

IEEE-USA E-Books

  • Comments on "Potential equations for anisotropic inhomogeneous media"

    None

  • Microwave logarithmic amplifiers using hybrid-integrated-circuits

    A new approach for logarithmic IF amplifiers with ultra-wide logging bandwidths and center frequencies up to the microwave region will be described.

  • Design of a high-power wide-band balun for the high-frequency region

    A balun is a device for matching an unbalanced line to a balanced load. Described here is a balun with a cw (continuous wave) rating, with matched load, of 67.5 kva (kilovolt-amperes) over the frequency range from 2 to 30 mc (megacycles). A transmission-line-type design along with a newly developed ferrite core material and special cooling techniques have been used to achieve this wide bandwidth and high-power capabilities in a small size. A description of the unit and performance test results are included.

  • Application of GaAs Schottky-gate FETs in microwave amplifiers

    Wideband input and output coupling networks for microwave amplifier stages incorporating GaAs MESFETs with 1-μm Schottky-gate will be described. Third-order intermodulation distortion of the transistors will also be discussed.

  • Minimum package parasitics for microwave devices

    As the operation of microwave devices is pushed to higher powers and frequencies, the mechanical and electrical interface between device and circuit becomes increasingly more important. Traditional wirebonding technology will be compared to alternate, more promising methods.

  • Methods of study of WPT systems

    This course reviews the different methods that can be used to study wireless power transfer systems, including equivalent circuit method, two-port network theory, S-parameter analysis with the help of a network analyzer, and numerical methods. Topics covered include: Analytical method approach: equivalent circuit analysis; Two port networks; S-Parameter analysis; Transmission efficiency and Impedance matching.

  • Double-Tuned Impedance Matching

    In the 1940s, Harold Wheeler developed the principles of double-tuned impedance matching in a simple form. These relationships are not well known. They are very useful for the antenna designer in providing a structured approach to obtain near-maximum bandwidth for narrowband and moderate-band antennas with a specified VSWR limit, using a practical arrangement of tuning elements. Wheeler first developed relationships for single-tuned impedance matching, which relate the fractional bandwidth to the antenna's Q and the maximum-permissible reflection-coefficient magnitude (or VSWR). He used the results of single-tuned impedance matching to derive the relationship for double-tuned impedance matching. Wheeler's double-tuned impedance-matching relationship is the best overall measure of the achievable fractional bandwidth for an antenna. Double tuning is practical, and provides more than double the fractional bandwidth of single-tuned impedance matching. One example of double-tuned impedance matching is presented. A comparison to recently published results for single-tuned impedance matching verifies that double tuning more than doubles the fractional bandwidth of single-tuned impedance matching.

  • Planar Impedance Conservation and PML Boundary Value Solutions

    This paper shows that a straightforward way to evaluate planar impedance conservation boundary values of arbitrary boundary operators and orientations is to copy the construction directly from the well-understood 1-D Robin impedance matching solution and then let the boundary rotate freely. Copying from this classical solution hence requires no use of split-field and any of its stretched coordinate reformulations. In fact it actually gives the complete general superposition solution which also explains that existing PML considers only a rational boundary operator and solves only a coordinately aligned example. The construction thus embraces both general order polynomial and nonpolynomial boundary operators, and non-coordinately aligned boundary solutions to be put on top of the PML orthogonal terminations. A constructive source-field energy coupling relation is also introduced to simplify the impedance conservation analysis to read as the triple product identity. Evident by the various forms of Maxwell equations, we explicitly elaborate at length that boundary value equations can also be written in various equivalent and endless redundant forms.

  • MMSE equalizers for multitone systems without guard time

    Recently the concept of multitone modulation or OFDM has received much attention. For such a modulation, the dispersiveness of the channel is classically solved by the technique of guard time. In the present paper we investigate the performance of OFDM without guard time but with MIMO equalization. Linear and decision-feedback structures structures are derived for an MMSE criterion and their performance is assessed by means of their steady-state behavior. Symbol rate equalizers following channel matched filters are derived and investigated. It is shown that equalized OFDM outperforms OFDM with guard time.

  • A 4-GHz 12-W transistor amplifier utilizing a self-aligned bipolar structure

    None



Standards related to Impedance matching

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(Replaced) IEEE Standard VHDL Language Reference Manual

his standard revises and enhances the VHDL language reference manual (LRM) by including a standard C language interface specification; specifications from previously separate, but related, standards IEEE Std 1164 -1993,1 IEEE Std 1076.2 -1996, and IEEE Std 1076.3-1997; and general language enhancements in the areas of design and verification of electronic systems.



Jobs related to Impedance matching

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