Conferences related to Immersion cooling

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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.


2020 IEEE Photovoltaic Specialists Conference (PVSC)

Promote science and engineering of photovoltaic materials, devices, systems and applications


2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

ASMC is the leading international technical conferences for discussing solutions that improve the collective manufacturing expertise of the semiconductor industry. Solving the challenges presented by semiconductor manufacturing has been a combined effort by device makers, equipment and materials suppliers, and academics. ASMC provides an unparalleled platform for semiconductor professionals to network and learn the latest in the practical application of advanced manufacturing strategies and methodologies. Technical presentations at ASMC highlight industry innovations with specific results.


2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic (COMCAS)Systems (IEEE COMCAS 2019)

IEEE COMCAS 2019 continues the tradition of providing a multidisciplinary forum for the exchange of ideas, research results, and industry experience in the areas of microwaves, communications, antennas, solid state circuits, electron devices, sensors, radar, bio-medical engineering and electronic systems engineering. It includes a technical program, industry exhibits, and invited talks by international experts in key topical areas.


2019 IEEE Vehicle Power and Propulsion Conference (VPPC)

Batteries; charge/discharge; ultra-capacitors; flywheels; hybrid energy storage; fuel cells; auxiliary power; SoC and SoH; solar vehicles; Converters; rectifiers; inverters; motor drives; power semiconductors; EMI/EMC; generators; integrated starter/alternators; drive trains; electro-magnetic compatibility; power architectures; 42V PowerNet; X-by-wire; electric power steering; hydraulic powertrain; Active suspension; cruise controls; remote sensing; wireless sensors; vehicular networking; cooperative driving; intelligent & autonomous vehicles; active and passive safety; embedded operation; driver assistance; virtual/digital Power split; fault tolerance; energy management;driving pattern recognition; driver modelling; shifting control; Vehicular systems/components; CAD/CAE; virtual prototyping; driving cycle design; ecodriving; life cycle analysis; EV infrastructure; V2X; on board chargers; AC & DC infrastructure; fast, superfast, wireless, smart & conductive charging; Smart Grid

  • 2018 IEEE Vehicle Power and Propulsion Conference (VPPC)

    Batteries; charge/discharge; ultra-capacitors; flywheels; hybrid energy storage; fuel cells; auxiliary power; SoC and SoH; solar vehicles; Converters; rectifiers; inverters; motor drives; power semiconductors; EMI/EMC; generators; integrated starter/alternators; drive trains; electro-magnetic compatibility; power architectures; 42V PowerNet; X-by-wire; electric power steering; hydraulic powertrain; Active suspension; cruise controls; remote sensing; wirelesssensors; vehicular networking; cooperative driving; intelligent & autonomous vehicles; active & passive safety; embedded operation; driver assistance; virtual/digital Power split; fault tolerance; energy management; driving pattern recognition; driver modelling; shifting control; Vehicular systems/components; CAD/CAE; virtual prototyping; driving cycle design; ecodriving; life cycle analysis; EV infrastructure; V2X; on board chargers; AC & DC infrastructure; fast, superfast, wireless, smart & conductive charging; Smart Grid

  • 2017 IEEE Vehicle Power and Propulsion Conference (VPPC)

    Batteries; charge/discharge; ultra-capacitors; flywheels; hybrid energy storage; fuel cells;auxiliary power; SoC and SoH; solar vehicles; Converters; rectifiers; inverters; motor drives; power semiconductors; EMI/EMC; generators; integrated starter/alternators; drive trains; electro-magnetic compatibility; power architectures; 42V PowerNet; X-by-wire; electric power steering; hydraulic powertrain; Active suspension; cruise controls; remote sensing; wireless sensors; vehicular networking; cooperative driving; intelligent & autonomous vehicles; active & passive safety; embedded operation; driver assistance; virtual/digital Power split; fault tolerance; energy management; driving pattern recognition; driver modelling; shifting control; Vehicular systems/components; CAD/CAE; virtual prototyping; driving cycle design; ecodriving; life cycle analysis; EV infrastructure; V2X; on board chargers; AC & DC infrastructure; fast, superfast, wireless, smart & conductive charging; Smart Grid

  • 2016 IEEE Vehicle Power and Propulsion Conference (VPPC)

    Batteries; charge/discharge; ultra-capacitors; flywheels; hybrid energy storage; fuel cells;auxiliary power; SoC and SoH; solar vehiclesConverters; rectifiers; inverters; motor drives; power semiconductors; EMI/EMC; generators;integrated starter/alternators; drive trains; electro-magnetic compatibility; power architectures;42V PowerNet; X-by-wire; electric power steering; hydraulic powertrainActive suspension; cruise controls; remote sensing; wireless sensors; vehicular networking;cooperative driving; intelligent & autonomous vehicles; active & passive safety; embeddedoperation; driver assistance; virtual/digital Power split; fault tolerance; energy management; driving pattern recognition; driver modelling;shifting control; Vehicular systems/components; CAD/CAE; virtual prototyping; driving cycledesign; ecodriving; life cycle analysis; EV infrastructure; V2X; on board chargers; AC & DCinfrastructure; fast, superfast, wireless, smart & conductive charging; Smart Grid

  • 2015 IEEE Vehicle Power and Propulsion Conference (VPPC)

    Batteries; charge/discharge; ultra-capacitors; flywheels; hybrid energy storage; fuel cells; auxiliary power; SoC and SoH; solar vehicles; Converters; rectifiers; inverters; motor drives; power semiconductors; EMI/EMC; generators; integrated starter/alternators; drive trains; electro-magnetic compatibility; power architectures; 42V PowerNet; X-by-wire; electric power steering; hydraulic powertrain; Active suspension; cruise controls; remote sensing; wireless sensors; vehicular networking; cooperative driving; intelligent & autonomous vehicles; active & passive safety; embedded operation; driver assistance; virtual/digital; Power split; fault tolerance; energy management; driving pattern recognition; driver modelling; shifting control; Vehicular systems/components; CAD/CAE; virtual prototyping; driving cycle design; ecodriving; life cycle analysis; EV infrastructure; V2X; on board chargers; AC & DC infrastructure; fast, superfast, wireless, smart & conductive charging; Smart Grid

  • 2014 IEEE Vehicle Power and Propulsion Conference (VPPC)

    Vehicular Electric Power Systems and Loads Vehicular Power Electronics and Motor Drives Advanced Vehicles Energy Storage Components / Systems Vehicular Electronics Modeling, Analysis, Dynamics and Control Intelligent Transportation SystemsElectric VehiclesHybrid Electric VehiclesFuel Cell VehiclesMULTIPHASE DRIVESADVANCED BATTERY TECHNOLOGIES FOR TRACTION APPLICATIONSDESIGN HEV POWER TRAINSFUEL CELL VEHICLESINTELLIGENT VEHICLE TECHNOLOGIES and ITSSMART GRIDS and EVs

  • 2013 IEEE Vehicle Power and Propulsion Conference (VPPC)

    VGreen Car - Electric Propelled System 1. HEV, Plug-In HEV, BEV System Design 2. Fuel Cell and FCEV/FCHEV System Design 3. Electronic Actuator and Electric Machinery for Vehicle Applications 4. Power Electronics and Converter for Vehicle Applications 5. Motor Drives for Vehicle Applications 6. Battery, Energy Storage System and their Management Systems for xEVs 7. Renewable Energy and Auxiliary Power Unit (APU) 8. Advanced Powertrain Controls for xEVs 9. Charging System including Interface Couplers 10. Smart Grid and Electrical Infrastructure for xEVs 11. Other Applications Intelligent Car 12. Intelligent Vehicle for Safety (included V2V) 13. Telematics (included V2I) 14. Network and Imbedded System for Vehicle 15. Electromagnetic Compatibility (EMC) in xEVs 16. Other Applications High Efficiency Transportation 17. Conventional Vehicle System Design 18. Advanced Automotive Power and Propulsion 19. Railway, Ship, Air, and Space Vehicles 20. Mechanical, Hydraulic

  • 2012 IEEE Vehicle Power and Propulsion Conference (VPPC)

    Topic 1: HEV, BEV, FCEV and Plug-In EV System Design. Topic 2: Automotive Actuator and Electric Machinery Topic 3: Power Converter for Automotive Applications Topic 4: Motor Drives for Vehicle Applications Topic 5: Energy and Power Management for xEVs Topic 6: Charging System including Interface Couplers Topic 7: Smart Grid and Electrical Infrastructure Topic 8: Intelligent Vehicle for Safety (included V2V) Topic 9: Telematics (included V2I) Topic 10: Imbedded System for Vehicle Topic 11: Electromagnetic Compatibility (EMC) in xEVs Topic 12: Conventional Vehicle System Design Topic 13: Advanced Automotive Power and Propulsion Topic 14: Railway, Ship, Air, and Space Vehicles Topic 15: Mechanical, Hydraulic and Pneumatic Systems Topic 16: Modeling, Simulation, Emissions and Control

  • 2011 IEEE Vehicle Power and Propulsion Conference (VPPC)

    Vehicular Power Electronics, Motor Drives, and Electric Machines; Electric and Hybrid Electric Vehicles; Plug-in Hybrid Electric Vehicles, Smart Grid, and Electrical Infrastructure; Energy Storage; Fuel Cell and Fuel Cell Hybrid Vehicles; Land Vehicles; Sea, Undersea, Air, and Space Vehicles; Mechanical, Hydraulic, and Pneumatic Systems; Modeling, Simulation, Emissions, and Control.

  • 2010 IEEE Vehicle Power and Propulsion Conference (VPPC)

    Power Electronics, Electric Drives, Electric Vehicles, Hybrid vehicles, motion control, transportation systems

  • 2009 IEEE Vehicle Power and Propulsion Conference (VPPC)

    The 2009 IEEE Vehicle Power and Propulsion Conference (VPPC09) will be held in Dearborn, Michigan, USA. The conference is co-sponsored by IEEE Power Electronics Society (PELS) and IEEE Vehicular Technology (VT). This year the conference will feature the theme of Sustainability: hybrid, plug-in, fuel cell and battery technology. The conference also features keynote speakers from top executives from the major automotive companies, and a banquet at the Henry Ford Museum.

  • 2008 IEEE Vehicle Power and Propulsion Conference (VPPC)

    The IEEE Vehicle Power and Propulsion Conference (VPPC) is a top-level international conference in the field of electric/hybrid vehicles, co-sponsored by IEEE Power Electronics Society and IEEE Vehicular Technology Society. It addresses the state-of-the-art and recent achievements in vehicular power and propulsion systems, automotive energy storage systems, electric/hybrid vehicles, and vehicular electronics.

  • 2007 IEEE Vehicle Power and Propulsion Conference (VPPC)

  • 2006 IEEE Vehicle Power and Propulsion Conference (VPPC)

  • 2005 IEEE Vehicle Power and Propulsion Conference (VPPC)


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Periodicals related to Immersion cooling

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Computer

Computer, the flagship publication of the IEEE Computer Society, publishes peer-reviewed technical content that covers all aspects of computer science, computer engineering, technology, and applications. Computer is a resource that practitioners, researchers, and managers can rely on to provide timely information about current research developments, trends, best practices, and changes in the profession.


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Most published Xplore authors for Immersion cooling

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Xplore Articles related to Immersion cooling

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IEEE Draft Guide for Interpretation of Gases Generated in Natural Ester and Synthetic Ester Immersed Transformers

IEEE PC57.155/D6 April 2014, 2014

This guide application is for Natural and Synthetic Ester-immersed transformers. This guide addresses the following: *The theory of combustible gas generation in a natural and synthetic ester filled transformer *Interpretation of the dissolved gas analysis results *Recommended actions based on the interpretation of dissolved gas analysis results. *A bibliography of related literature.


Development of the high efficiency cooling structure of the liquid immersion cooling SR motor

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 2017

Immersion cooling system is introduced. In this new cooling system, the coil is immersed with insulation cooling liquid and lower the temperature by using the mechanism of boiling heat transfer. However, It is necessary to abate and condense the bubbles generated by boiling. Therefore a pump-les cooling circulation mechanism, which utilize generated bubbles, is devised. To the principle and the ...


Immersion Cooling for High-Density Packaging

IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987

New cooling techniques using direct immersion cooling for high-density packaging are discussed, focussing on a) the treatment of bubbles produced by nucleate boiling and b) the control of coolant composition to prevent "temperature overshoot" occurring at the boiling point as thermal hysteresis. Maintaining subcool boiling (the initial stage of nucleate boiling) until maximum power application is a useful cooling technique ...


IEEE Standard Tests for Determining Compatibility of Cable-Pulling Lubricants with Wire and Cable - Corrigendum 1

IEEE Std 1210-2004/Cor 1-2014 (Corrigendum to IEEE Std 1210-2004), 2014

Criteria and test methods for determining the compatibility of cable-pulling lubricants (compounds) with cable jacket or other exterior cable covering are described in this standard. Cable-pulling lubricants are used to lower the friction on cable as it is pulled into conduit, duct, or directionally bored holes. Compatibility is important because lubricants should not negatively interact with the cables they lubricate. ...


Test results from the comparison of three liquid cooling methods for high-power processors

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016

This study compares three different liquid cooling technologies to determine which of the three methods is able to cool the highest power density processor chips. The first method consists of pumping a liquid coolant through a cold plate mounted over a 25.4 mm square heat source. The second method is two- phase immersion cooling of the 25.4 mm square heat ...


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Educational Resources on Immersion cooling

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IEEE-USA E-Books

  • IEEE Draft Guide for Interpretation of Gases Generated in Natural Ester and Synthetic Ester Immersed Transformers

    This guide application is for Natural and Synthetic Ester-immersed transformers. This guide addresses the following: *The theory of combustible gas generation in a natural and synthetic ester filled transformer *Interpretation of the dissolved gas analysis results *Recommended actions based on the interpretation of dissolved gas analysis results. *A bibliography of related literature.

  • Development of the high efficiency cooling structure of the liquid immersion cooling SR motor

    Immersion cooling system is introduced. In this new cooling system, the coil is immersed with insulation cooling liquid and lower the temperature by using the mechanism of boiling heat transfer. However, It is necessary to abate and condense the bubbles generated by boiling. Therefore a pump-les cooling circulation mechanism, which utilize generated bubbles, is devised. To the principle and the performance is explicated to develop, thermal fluid analysis was introduced. As a result of experiment, the immersion cooling system using aluminum coil case has 70% reduction of thermal resistance from the existing system. From the results of the thermohydrodynamic analysis, the cooling performance was improved by using the proposed system. From the above, the influence on cooling performance of the new system cope with the increase in heat generation of the motor was clarified. Moreover, the thermal resistance between the heat source and the housing was reduced by filling liquid around the coil was verified from the experiment, also the effectiveness of the immersion cooling system was demonstrated.

  • Immersion Cooling for High-Density Packaging

    New cooling techniques using direct immersion cooling for high-density packaging are discussed, focussing on a) the treatment of bubbles produced by nucleate boiling and b) the control of coolant composition to prevent "temperature overshoot" occurring at the boiling point as thermal hysteresis. Maintaining subcool boiling (the initial stage of nucleate boiling) until maximum power application is a useful cooling technique in high-density packaging of computers because this technique produces fewer troubles than saturated boiling. The module model, which incorporated subcool boiling, showed a high cooling capability of 10 W/cm<sup>2</sup>at the chips, and 1.0 kW for the 900-cm<sup>3</sup>module volume. Controlling coolant composition produces azeotropic boiling which, in turn, prevents temperature overshoot.

  • IEEE Standard Tests for Determining Compatibility of Cable-Pulling Lubricants with Wire and Cable - Corrigendum 1

    Criteria and test methods for determining the compatibility of cable-pulling lubricants (compounds) with cable jacket or other exterior cable covering are described in this standard. Cable-pulling lubricants are used to lower the friction on cable as it is pulled into conduit, duct, or directionally bored holes. Compatibility is important because lubricants should not negatively interact with the cables they lubricate. Compatibility of lubricants with a variety of common cable coverings is considered.

  • Test results from the comparison of three liquid cooling methods for high-power processors

    This study compares three different liquid cooling technologies to determine which of the three methods is able to cool the highest power density processor chips. The first method consists of pumping a liquid coolant through a cold plate mounted over a 25.4 mm square heat source. The second method is two- phase immersion cooling of the 25.4 mm square heat source in a bath of 3M Novec® 649 liquid with a boiling point of 49°C. The third method of cooling consists of single-phase immersion cooling of the 25.4 mm square heat source using mineral oil as the coolant. This method was tested under both natural convection and forced convection conditions. An experimental setup, consisting of a heater module with attachment to the cooling solution was designed and built. The apparatus was used to determine the maximum power dissipation that can be supported in a 25.4 mm x 25.4 mm area for each of the three cooling solutions. Note that uniform power dissipation is assumed over the die surface. The measured temperature is assumed to be equivalent to the temperature of a die with the same surface area. The maximum die temperature was set to 100 °C and the power required to reach that temperature was recorded for each of the cooling methods.

  • IEEE Standard Test Code for Liquid-Immersed Distribution, Power, and Regulating Transformers Corrigendum 1:Editorial and Technical Corrections

    The definition of constant k in Equation 2 (in 8.3) and line terminal rated voltage in the last paragraph of 10.8.2 are corrected in this corrigendum.

  • IEEE Standard Test Code for Liquid-Immersed Distribution, Power, and Regulating Transformers Corrigendum 1:Editorial and Technical Corrections

    The definition of constant k in Equation 2 (in 8.3) and line terminal rated voltage in the last paragraph of 10.8.2 are corrected in this corrigendum.

  • IEEE Draft Guide for Installation and Maintenance of Liquid-Immersed Power Transformers

    This guide provides guidance and recommended practices on the installation and maintenance of liquid-immersed power transformers rated 501 kVA and above with secondary voltages of 1000 V and above. This guide covers the entire range of power transformers, including extra high-voltage (EHV) transformers. This guide does not cover special transformers such as furnace transformers, rectifier transformers, etc. Distinctions are made as required for various MVA ratings, voltage ratings, and types of liquid insulation.

  • IEEE Draft Standard Requirements, Terminology, and Test Code for Shunt Reactors Rated Over 500 kVA

    All liquid-immersed or dry-type, single-phase or three-phase, outdoor or indoor shunt reactors rated over 500 kVA are covered. Terminology and general requirements are stated, and the basis for rating shunt reactors is set forth. Routine, design, and other tests are described, and methods for performing them are given. Losses and impedance, temperature rise, dielectric tests, and insulation levels are covered. Construction requirements for liquid-immersed reactors and construction and installation requirements for dry-type reactors are presented. This standard also covers thyristor-controlled shunt reactors used in static var compensators.

  • Advanced cooling technology for leading-edge computer products

    Cooling technology has been a vital prerequisite for the rapid and continued advancement of computer products, ranging from lap-tops to supercomputers. This paper provides a review of the recent development of cooling technology for computers. Both air cooling and liquid cooling are included. Air cooling is discussed in terms of the advantages of impinging flow. An example of module internal conduction enhancement is given. Liquid cooling is discussed in terms of indirect liquid cooling with water coupled with enhanced conduction, and direct immersion cooling with dielectric coolants. Special cooling technology is included in terms of the application of heat pipes and the possibility of using liquid metal flow to cool electronic packages.



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