Conferences related to Electromagnetic Packaging

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2023 Annual International Conference of the IEEE Engineering in Medicine & Biology Conference (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted full papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions,will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.


2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting

The joint meeting is intended to provide an international forum for the exchange of information on state of the art research in the area of antennas and propagation, electromagnetic engineering and radio science


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

This symposium pertains to the field of electromagnetic compatibility.


2020 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC)

All areas of ionizing radiation detection - detectors, signal processing, analysis of results, PET development, PET results, medical imaging using ionizing radiation


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Periodicals related to Electromagnetic Packaging

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


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Most published Xplore authors for Electromagnetic Packaging

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Xplore Articles related to Electromagnetic Packaging

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Resonant Technology and Electromagnetic Packaging

2015 International Conference on Electromagnetics in Advanced Applications (ICEAA), 2015

Under the concept of the so called Resonant Technology, recently we had proposed a device that can transport a lot of different signals, all of them of similar frequencies although different recording time, packed around the resonant frequencies. With the aim to implement physically the device, we had developed an algorithm, which is inserted in a FPGA to build information ...


The gap waveguide as a metamaterial-based electromagnetic packaging technology enabling integration of MMICs and antennas up to THz

Proceedings of the 5th European Conference on Antennas and Propagation (EUCAP), 2011

This paper presents new topics that will be lectured in the short course Metamaterials for Antennas within the European School of Antennas in Spring 2012. These relates to new so-called gap waveguides that are advantageous for use above 30 GHz, because they are quasi-TEM over wide bandwidth, and do neither require dielectric material nor conductive joints between metal parts. The ...


Toward wide-band low-loss gap-waveguide-integrated grid amplifiers

2017 International Symposium on Antennas and Propagation (ISAP), 2017

A passive W-band 19-channel spatial power splitter/combiner is presented, for the applications in grid amplifiers design. The design employs a linear array of chip-to-air-filled waveguide contactless connections, and are directly integrated within a single-layer. The meta-material-based gap waveguide is used; it enables a low-loss low-profile solution. The quasi-optical beamformer gives rise to a parallel-plate planar waveguide field which excites an ...


Design of antenna feed with amplified power distribution using groove-gap waveguide technology

2017 11th European Conference on Antennas and Propagation (EUCAP), 2017

The design of an antenna feed system that includes amplification of the signal is presented. The feed includes power division (in this initial example a 1 to 2 division is shown) and the amplification section. The design is made in the groove gap waveguide technology in the X band and can be easily scaled to millimeter frequency bands. Besides the ...


Notice of Violation of IEEE Publication Principles<BR>In-line wideband contactless GrooveGap to microstrip transition with PMC packaging for MMIC integration in gap waveguide technology

2016 Loughborough Antennas & Propagation Conference (LAPC), 2016

A contactless, in-line, wideband and low-loss micro strip to GrooveGap waveguide transition operating at X-band is presented. The principle of operation is based on transforming EM fields from the SIW to the RidgeGap waveguide mode via near field electromagnetic coupling. This is advantageous, since the proposed solution avoids the use of metal contact between the SIW and one of the ...


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Educational Resources on Electromagnetic Packaging

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IEEE-USA E-Books

  • Resonant Technology and Electromagnetic Packaging

    Under the concept of the so called Resonant Technology, recently we had proposed a device that can transport a lot of different signals, all of them of similar frequencies although different recording time, packed around the resonant frequencies. With the aim to implement physically the device, we had developed an algorithm, which is inserted in a FPGA to build information packs and send it. Also, we analyze the Gap Waveguide Electromagnetic Packaging Technology, taking into account the signal integrity and the Electromagnetic Broadband Packaging Model.

  • The gap waveguide as a metamaterial-based electromagnetic packaging technology enabling integration of MMICs and antennas up to THz

    This paper presents new topics that will be lectured in the short course Metamaterials for Antennas within the European School of Antennas in Spring 2012. These relates to new so-called gap waveguides that are advantageous for use above 30 GHz, because they are quasi-TEM over wide bandwidth, and do neither require dielectric material nor conductive joints between metal parts. The gap waveguides originate from research on soft and hard surfaces that also are forerunners for EBG surfaces (acting as isotropic soft surfaces) and metamaterial cloaks (realized first by hard surfaces). The course will contain material related to all these topics, and in addition an overview of the last years research on the gap waveguides including experimental demonstration of principles as well as working hardware components. In this presentation special emphasis will be given to electromagnetic (EM) packaging, the principle of PMC packaging and integration of MMICs.

  • Toward wide-band low-loss gap-waveguide-integrated grid amplifiers

    A passive W-band 19-channel spatial power splitter/combiner is presented, for the applications in grid amplifiers design. The design employs a linear array of chip-to-air-filled waveguide contactless connections, and are directly integrated within a single-layer. The meta-material-based gap waveguide is used; it enables a low-loss low-profile solution. The quasi-optical beamformer gives rise to a parallel-plate planar waveguide field which excites an array of contactless chip-to-waveguide transitions via step-tapered ridge gap waveguides. The other beamformer restores the field distribution (after amplification) and excites a wave going towards the waveguide output. Furthermore, the gap waveguide technology isolates the amplifiers from one another and provides a packaging solution in a single unit. The simulated return loss of the back-to-back structure is larger than 12 dB, while the insertion loss is smaller than 1.2 dB over the entire W-band (75-110 GHz).

  • Design of antenna feed with amplified power distribution using groove-gap waveguide technology

    The design of an antenna feed system that includes amplification of the signal is presented. The feed includes power division (in this initial example a 1 to 2 division is shown) and the amplification section. The design is made in the groove gap waveguide technology in the X band and can be easily scaled to millimeter frequency bands. Besides the manufacturing advantages of groove gap waveguide when compared to conventional rectangular waveguide, this design includes the packaging of the MMIC amplifier by using the same gap waveguide technology, thus providing a robust solution.

  • Notice of Violation of IEEE Publication Principles<BR>In-line wideband contactless GrooveGap to microstrip transition with PMC packaging for MMIC integration in gap waveguide technology

    A contactless, in-line, wideband and low-loss micro strip to GrooveGap waveguide transition operating at X-band is presented. The principle of operation is based on transforming EM fields from the SIW to the RidgeGap waveguide mode via near field electromagnetic coupling. This is advantageous, since the proposed solution avoids the use of metal contact between the SIW and one of the waveguide parts. Furthermore, metamaterial-based gap waveguide technology provides a resonance-free packaging solution for the integrated MMIC amplifier. It is the first time a transition that also provides the packaging of the active component is designed. Our device works on X-band due to present test equipment limitations, but it can be scaled to mm-wave frequencies and beyond.

  • An electromagnetic technique for packaging problem analysis

    A new three-dimensional electromagnetic packaging analysis is developed for shielded configurations containing arbitrarily shaped, homogeneous, isotropic regions. Computer implementation uses and extends routines from a computational engine for electromagnetic scattering. The packaging analysis is validated using rectangular waveguide configurations. Preliminary analysis is performed on a filtering structure.

  • Fredholm and Maxwell equations in the confinement of electromagnetic field

    We recall some results about the confinement of electromagnetic field from the Fredholm's equations properties perspective. Then we review some relations between the Maxwell equations and the generalized Fredholm's equations and show the equivalence between these two points of view when we analyze the change in the broadcasting conditions from confined electromagnetic field to travelling waves, underlying limiting range situations. We propose some general suggestions in order to diminish the waste of power and information when it is necessary some kind of electromagnetic packaging.



Standards related to Electromagnetic Packaging

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Standard for High Frequency Characterization for Low Temperature Co-Fired Ceramic (LTCC)Materials

This standard develops standard test methods to characterize and control Low Temperature Co-Fired Ceramic (LTCC) materials systems. The test methods are independentant of the type of LTCC materials system. The test methods will be usable by all vendors of LTCC to characterize and measure LTCC materials systems in frequencies up to 110GHz.



Jobs related to Electromagnetic Packaging

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