Conferences related to Epoxy resins

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2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2019 21st International Conference on Advanced Communication Technology (ICACT)

With technically co-sponsored by IEEE ComSoc(Communications Society), IEEE ComSocCISTC(Communications & Information Security Technical Community), and IEEE ComSocONTC(Optical Networking Technical Community), the ICACT(International Conference onAdvanced Communications Technology) Conference has been providing an open forum forscholars, researchers, and engineers to the extensive exchange of information on newlyemerging technologies, standards, services, and applications in the area of the advancedcommunications technology. The conference official language is English. All the presentedpapers have been published in the Conference Proceedings, and posted on the ICACT Websiteand IEEE Xplore Digital Library since 2004. The honorable ICACT Out-Standing Paper Awardlist has been posted on the IEEE Xplore Digital Library also, and all the Out-Standing papersare subjected to the invited paper of the "ICACT Transactions on the Advanced Communications Technology" Journal issue by GIRI

  • 2018 20th International Conference on Advanced Communication Technology (ICACT)

    With technically co-sponsored by IEEE ComSoc(Communications Society), IEEE ComSoc CISTC(Communications & Information Security Technical Community), and IEEE ComSoc ONTC(Optical Networking Technical Community), the ICACT(International Conference on Advanced Communications Technology) Conference has been providing an open forum for scholars, researchers, and engineers to the extensive exchange of information on newly emerging technologies, standards, services, and applications in the area of the advanced communications technology. The conference official language is English. All the presented papers have been published in the Conference Proceedings, and posted on the ICACT Website and IEEE Xplore Digital Library since 2004. The honorable ICACT Out-Standing Paper Award list has been posted on the IEEE Xplore Digital Library also, and all the Out-Standing papers are subjected to the invited paper of the "ICACT Transactions on the Advanced Communications Technology" Journal issued by GIRI

  • 2017 19th International Conference on Advanced Communication Technology (ICACT)

    With technically co-sponsored by IEEE ComSoc(Communications Society), IEEE ComSoc CISTC(Communications & Information Security Technical Community), and IEEE ComSoc ONTC(Optical Networking Technical Community), the ICACT(International Conference on Advanced Communications Technology) Conference has been providing an open forum for scholars, researchers, and engineers to the extensive exchange of information on newly emerging technologies, standards, services, and applications in the area of the advanced communications technology. The conference official language is English. All the presented papers have been published in the Conference Proceedings, and posted on the ICACT Website and IEEE Xplore Digital Library since 2004. The honorable ICACT Out-Standing Paper Award list has been posted on the IEEE Xplore Digital Library also, and all the Out-Standing papers are subjected to the invited paper of the "ICACT Transactions on the Advanced Communications Technology" Journal issued by

  • 2016 18th International Conference on Advanced Communication Technology (ICACT)

    With technically co-sponsored by IEEE ComSoc(Communications Society), IEEE ComSoc CISTC(Communications & Information Security Technical Community), and IEEE ComSoc ONTC(Optical Networking Technical Community), the ICACT(International Conference on Advanced Communications Technology) Conference has been providing an open forum for scholars, researchers, and engineers to the extensive exchange of information on newly emerging technologies, standards, services, and applications in the area of the advanced communications technology. The conference official language is English. All the presented papers have been published in the Conference Proceedings, and posted on the ICACT Website and IEEE Xplore Digital Library since 2004. The honorable ICACT Out-Standing Paper Award list has been posted on the IEEE Xplore Digital Library also, and all the Out-Standing papers are subjected to the invited paper of the "ICACT Transactions on the Advanced Communications Technology" Journal issued by GiRI.

  • 2015 17th International Conference on Advanced Communication Technology (ICACT)

    With technically co-sponsored by IEEE ComSoc(Communications Society), IEEE ComSoc CISTC(Communications & Information Security Technical Community), and IEEE ComSoc ONTC(Optical Networking Technical Community), the ICACT(International Conference on Advanced Communications Technology) Conference has been providing an open forum for scholars, researchers, and engineers to the extensive exchange of information on newly emerging technologies, standards, services, and applications in the area of the advanced communications technology. The conference official language is English. All the presented papers have been published in the Conference Proceedings, and posted on the ICACT Website and IEEE Xplore Digital Library since 2004. The honorable ICACT Out-Standing Paper Award list has been posted on the IEEE Xplore Digital Library also, and all the Out-Standing papers are subjected to the invited paper of the "ICACT Transactions on the Advanced Communications Technology" Journal issued by GiRI.

  • 2014 16th International Conference on Advanced Communication Technology (ICACT)

    Technology, service, architecture, strategy, and policy in newly emerging system, standard, service, and variety of application on the area of telecommunications. ICACT 2014 provides an open forum for scholar, researcher, engineer, policy maker, network planner, and service provider in the advanced communication technologies.

  • 2013 15th International Conference on Advanced Communication Technology (ICACT)

    Technology, standard, service, architecture, strategy, and policy in newly emerging systems and a variety of applications in the area of communications. ICACT2013 provides an open forum for scholar, researcher, engineer, policy maker, network planner, and service provider in the advanced communications technologies.

  • 2012 14th International Conference on Advanced Communication Technology (ICACT)

    Technology, service, architecture, strategy, and policy in newly emerging systems, standards, service, and a variety of applications in the area of telecommunicatons. ICACT 2012 provides an open forum for scholars, researchers, engineers, policy makers, network planners, and service providers in the advanced communication technologies.

  • 2011 13th International Conference on Advanced Communication Technology (ICACT)

    International Conference on Advanced Communication Technology (ICACT) provides an open forum for researchers, engineers, policy, network planners, and service providers in the advanced communication technologies. Extensive exchange of information will be provided on newly emerging systems, standards, services, and variety of applications on the area of telecommunications.

  • 2010 12th International Conference on Advanced Communication Technology (ICACT)

    ICACT is an annual conference providing an open forum for researchers, engineers, network planners, and service providers in telecommunications. Extensive exchange of information will be provided on newly emerging systems, standards, services, and variety of applications in the area of telecommunications.

  • 2009 11th International Conference on Advanced Communication Technology (ICACT)

    ICACT is an annual conference providing an open forum for researchers, engineers, network planners, and service providers in telecommunications. Extensive exchange of information will be provided on newly emerging systems, standards, services, and variety of applications in the area of telecommunications.

  • 2008 10th International Conference Advanced Communication Technology (ICACT)

  • 2007 9th International Conference Advanced Communication Technology (ICACT)

  • 2006 8th International Conference Advanced Communication Technology (ICACT)

  • 2005 7th International Conference Advanced Communication Technology (ICACT)

  • 2004 6th International Conference Advanced Communication Technology (ICACT)


2019 IEEE 20th International Conference on Dielectric Liquids (ICDL)

IEEE International Conference on Dielectric Liquids (ICDL) is a research oriented conference focused on the exchange and discussion of ideas, results and practical experiences of properties, dielectric phenomena and applications of insulating liquids. It addresses physicists, chemists, material scientists and electrical engineers who are engaged in the research and practical applications of such materials and apparatus. ICDL provides a forum for presenting innovative ideas and applications such as the use of natural and synthetic esters in power transformers, SF6 alternative gasses having much less greenhouse impact and electrodynamics in emerging applications.This Conference is the 20th in a series held every two years, and is fully sponsored by the IEEE Dielectrics and Electrical Insulation Society (DEIS).


2019 IEEE Electrical Insulation Conference (EIC)

Electrical Materials, Equipment, Testing, Nanotechnologies, Power Systems, Motors, Generators, Transformers, Switchgear


2018 12th International Conference on the Properties and Applications of Dielectric Materials (ICPADM)

1. Ageing and life expectancy of HV insulation;2. Bio-dielectrics;3. Conduction and breakdown in dielectrics;4. Dielectric materials for electronics and photonics;5.Dielectric phenomena and applications;6.Dielectrics for superconducting applications;7.Eco-friendly dielectric materials;8.Electrical insulation in high voltage power equipment and cables;9.Electrical and water tree development and surface tracking;10.Gaseous electrical breakdown and discharges;11.HVDC insulation systems;12. Nano-technology and nano-dielectrics;13. New functional dielectrics for electrical systems;14. Partial discharges;15.Space charge and its effects;16. Surface and interfacial phenomena.


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Periodicals related to Epoxy resins

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Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Broadcasting, IEEE Transactions on

Broadcast technology, including devices, equipment, techniques, and systems related to broadcast technology, including the production, distribution, transmission, and propagation aspects.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


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Most published Xplore authors for Epoxy resins

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Xplore Articles related to Epoxy resins

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Superconducting Synchrotron Development: Notes on Recent Work at the Rutherford Laboratory

IEEE Transactions on Nuclear Science, 1971

None


Investigation of ageing phenomena on epoxy resin insulation materials

Proceedings of 1994 4th International Conference on Properties and Applications of Dielectric Materials (ICPADM), 1994

Different types of epoxy resin current and voltage transformers were tested in order to determine the insulation degradation caused by partial discharges and their ageing characteristics. The deterioration process was regularly controlled by measuring the amount of partial discharge, the capacity and loss angle. Dangerous degradation of insulation was detected. The dielectric strength of different types and different composition of ...


Vacuum System for the NAL Booster Synchrotron

IEEE Transactions on Nuclear Science, 1971

The 96 combined function magnets in the Booster Synchrotron at NAL are arranged in a 500 ft diameter ring. There are 24 periods in the magnet lattice, each containing four magnets and one 6-meter long straight section. The long straight sections provide space for rf accelerating cavities, injection, extraction, and beam detectors.


PD performance of dielectric insulations in presence of low frequency conducted disturbances: a life model approach

2001 Annual Report Conference on Electrical Insulation and Dielectric Phenomena (Cat. No.01CH37225), 2001

The problem of how 50 Hz power supply voltage distortions affect PD activity and the lifetime of epoxy resin insulation systems, is addressed. In this aim, harmonics up to the 5/sup th/ were summed up to the voltage fundamental component changing the waveform from the sinusoidal into its peaked or flattened resulting shape. In a previous paper, life tests were ...


Effect of molecular weight of PVA on the reactivity and stability behavior of adhesive

2017 International Conference on Electronics Packaging (ICEP), 2017

All kinds of poly (urea-urethane) microcapsules containing hardener derivatives as a core material were prepared by an interfacial polymerization process in order to investigate the reactivity and stability behavior for application of adhesive. The results show that the prepared microcapsules were smooth and compact; in addition, average diameters were 1-20 μm. When they mix with epoxy resin as adhesive, the ...


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IEEE.tv Videos

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IEEE-USA E-Books

  • Superconducting Synchrotron Development: Notes on Recent Work at the Rutherford Laboratory

    None

  • Investigation of ageing phenomena on epoxy resin insulation materials

    Different types of epoxy resin current and voltage transformers were tested in order to determine the insulation degradation caused by partial discharges and their ageing characteristics. The deterioration process was regularly controlled by measuring the amount of partial discharge, the capacity and loss angle. Dangerous degradation of insulation was detected. The dielectric strength of different types and different composition of epoxy resin components was determined. The evaluation of tests was carried out by using mathematical statistical methods.<<ETX>>

  • Vacuum System for the NAL Booster Synchrotron

    The 96 combined function magnets in the Booster Synchrotron at NAL are arranged in a 500 ft diameter ring. There are 24 periods in the magnet lattice, each containing four magnets and one 6-meter long straight section. The long straight sections provide space for rf accelerating cavities, injection, extraction, and beam detectors.

  • PD performance of dielectric insulations in presence of low frequency conducted disturbances: a life model approach

    The problem of how 50 Hz power supply voltage distortions affect PD activity and the lifetime of epoxy resin insulation systems, is addressed. In this aim, harmonics up to the 5/sup th/ were summed up to the voltage fundamental component changing the waveform from the sinusoidal into its peaked or flattened resulting shape. In a previous paper, life tests were performed using a sphere-plane electrode configuration; now the experimental research has been carried out, and an analysis of the PD aging phenomena was performed in both sinusoidal and non-sinusoidal life tests by a digital PD system. A good agreement has been:found between the physical phenomena involved during the aging and the obtained new related lifetimes. Finally, a life model is proposed to establish a functional relationship between the shape characteristics of the applied voltage and the failure times, thus providing a useful tool to evaluate the epoxy life changes due to the presence of voltage harmonics with respect to the sinusoidal supply.

  • Effect of molecular weight of PVA on the reactivity and stability behavior of adhesive

    All kinds of poly (urea-urethane) microcapsules containing hardener derivatives as a core material were prepared by an interfacial polymerization process in order to investigate the reactivity and stability behavior for application of adhesive. The results show that the prepared microcapsules were smooth and compact; in addition, average diameters were 1-20 μm. When they mix with epoxy resin as adhesive, the exothermal peaks of the curing reaction were under 110°C and reaction heat were above 400J/g; furthermore, the variation of reaction heat decreased less than 10% when the formulas stored in room temperature for 30 days. The results indicate the latent hardener shows great heat reactivity and storage stability for electronics packaging.

  • Wide band electromagnetic wave absorber with thin magnetic layers

    This paper presents the design and the trially made examples of the wideband thin electromagnetic absorber with multiple layers of magnetic materials, which will be useful for the walls in houses and office buildings for protection from thee radiated waves from wireless LANs and electronic equipment.. We achieved an absorbing performance of more than 80% at 1.9 GHz, 2.45 GHz and 19 GHz by using a 0.5 mm layer of the epoxy resin containing a carbonyl iron powder and another 2.5 mm layer of epoxy resin containing a ferrite powder.<<ETX>>

  • Space charge distribution in XLPE and epoxy resin under different temperature

    Under high DC voltages, the space charge distribution can greatly distort the electric field and may cause premature failure of the insulation material. The development of space charge in the material is affected by several factors like electrical field, temperature and electrode materials. In this work, the pulsed electroacoustic (PEA) technique was used to measure the space charge distribution in epoxy resin and cross-linked polyethylene. Heterocharge accumulation near the anode and homocharge accumulation near the cathode could be observed in cross-linked polyethylene at room temperature, while only homocharge near the anode could be observed in epoxy resin under the same condition. The polarity of charge accumulation near the cathode and in the center will change in cross-linked polyethylene with the increase of the temperature. The shape of space charge distribution in epoxy resin won't change with the increase of the temperature, while the charge density decreases.

  • Evaluation of Dielectric Strength of Tricyclopentadiene / Silica Microcomposites

    Hydrocarbon-based thermosetting resins have properties such as low viscosity, low dielectric constant and high heat resistance as compared with epoxy resins and are expected to be applied to electric devices in the future. However, hydrocarbon-based thermosetting resins have not been put into practice as an electrically insulating material yet. Therefore, it is necessary to understand the electrical characteristics. Generally, when organic polymeric material is used as an insulator for high voltage equipment, a large amount of loading of inorganic fillers is needed so as to decrease linear expansion coefficient. Therefore, it is crucial to investigate the effect of inorganic filler loading on the various properties such as mechanical, thermal, and electrical properties for higher voltage and longer term operation of high-voltage equipment. From the viewpoints, this paper deals with electrical insulation properties of the hydrocarbon-based thermosetting resin with loaded micro silica particles. As a result, breakdown strength of hydrocarbon-based thermosetting resin is equal or higher than that of the epoxy resin. As a result, it can be said that the hydrocarbon-based thermosetting resin with lower viscosity and lower dielectric constant than the epoxy resin is promising as an insulating material for the next generation high voltage equipment.

  • Several Experimental Results Indicating Filler/Polymer Interactions in Polymer Nanocomposites

    As a reason for superior insulation performance of polymer nanocomposites, interactions at the filler/polymer interfaces are widely believed. However, their evidence has been scarcely reported. In this paper, several experimental results obtained by the authors, which provide evidence of direct influences of the addition of fillers on the properties inherent to host polymers, are presented.

  • Class H insulation system for railway traction motor

    To raise power per unit weight and improve reliability of DC motors for rolling-stock, we have developed a new insulation system with high thermal endurance by adopting a solventless thermosetting resin for coil impregnation which consists of polyfunctional epoxides and heterocyclic compounds. Evaluation tests have revealed that the insulation system has excellent thermal endurance classified into class C and high reliability against the cyclic thermal stress. The newly developed insulation system can be applied to the class H insulation system for traction motors.



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