Conferences related to Energy dissipation

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2023 Annual International Conference of the IEEE Engineering in Medicine & Biology Conference (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted full papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions,will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.


2021 26th IEEE International Conference on Emerging Technologies and Factory Automation (ETFA )

ETFA focus is on the latest developments and new technologies in the field of industrial and factory automation. The conference aims to exchange ideas with both industry leaders and a variety of experienced researchers, developers, and practitioners from several industries, research institutes, and academia


2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE Energy Conversion Congress and Exposition (ECCE)

IEEE-ECCE 2020 brings together practicing engineers, researchers, entrepreneurs and other professionals for interactive and multi-disciplinary discussions on the latest advances in energy conversion technologies. The Conference provides a unique platform for promoting your organization.

  • 2019 IEEE Energy Conversion Congress and Exposition (ECCE)

    IEEE-ECCE 2019 brings together practicing engineers, researchers, entrepreneurs and other professionals for interactive and multi-disciplinary discussions on the latest advances in energy conversion technologies. The Conference provides a unique platform for promoting your organization.

  • 2018 IEEE Energy Conversion Congress and Exposition (ECCE)

    The scope of ECCE 2018 includes all technical aspects of research, design, manufacture, application and marketing of devices, components, circuits and systems related to energyconversion, industrial power and power electronics.

  • 2017 IEEE Energy Conversion Congress and Exposition (ECCE)

    ECCE is the premier global conference covering topics in energy conversion from electric machines, power electronics, drives, devices and applications both existing and emergent

  • 2016 IEEE Energy Conversion Congress and Exposition (ECCE)

    The Energy Conversion Congress and Exposition (ECCE) is focused on research and industrial advancements related to our sustainable energy future. ECCE began as a collaborative effort between two societies within the IEEE: The Power Electronics Society (PELS) and the Industrial Power Conversion Systems Department (IPCSD) of the Industry Application Society (IAS) and has grown to the premier conference to discuss next generation technologies.

  • 2015 IEEE Energy Conversion Congress and Exposition

    The scope of ECCE 2015 includes all technical aspects of research, design, manufacture, application and marketing of devices, components, circuits and systems related to energy conversion, industrial power and power electronics.

  • 2014 IEEE Energy Conversion Congress and Exposition (ECCE)

    Those companies who have an interest in selling to: research engineers, application engineers, strategists, policy makers, and innovators, anyone with an interest in energy conversion systems and components.

  • 2013 IEEE Energy Conversion Congress and Exposition (ECCE)

    The scope of the congress interests include all technical aspects of the design, manufacture, application and marketing of devices, components, circuits and systems related to energy conversion, industrial power conversion and power electronics.

  • 2012 IEEE Energy Conversion Congress and Exposition (ECCE)

    The IEEE Energy Conversion Congress and Exposition (ECCE) will be held in Raleigh, the capital of North Carolina. This will provide a forum for the exchange of information among practicing professionals in the energy conversion business. This conference will bring together users and researchers and will provide technical insight as well.

  • 2011 IEEE Energy Conversion Congress and Exposition (ECCE)

    IEEE 3rd Energy Conversion Congress and Exposition follows the inagural event held in San Jose, CA in 2009 and 2nd meeting held in Atlanta, GA in 2010 as the premier conference dedicated to all aspects of energy processing in industrial, commercial, transportation and aerospace applications. ECCE2011 has a strong empahasis on renewable energy sources and power conditioning, grid interactions, power quality, storage and reliability.

  • 2010 IEEE Energy Conversion Congress and Exposition (ECCE)

    This conference covers all areas of electrical and electromechanical energy conversion. This includes power electrics, power semiconductors, electric machines and drives, components, subsystems, and applications of energy conversion systems.

  • 2009 IEEE Energy Conversion Congress and Exposition (ECCE)

    The scope of the conference include all technical aspects of the design, manufacture, application and marketing of devices, circuits, and systems related to electrical energy conversion technology


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Periodicals related to Energy dissipation

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Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Automatic Control, IEEE Transactions on

The theory, design and application of Control Systems. It shall encompass components, and the integration of these components, as are necessary for the construction of such systems. The word `systems' as used herein shall be interpreted to include physical, biological, organizational and other entities and combinations thereof, which can be represented through a mathematical symbolism. The Field of Interest: shall ...


Circuits and Systems I: Regular Papers, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


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Most published Xplore authors for Energy dissipation

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Xplore Articles related to Energy dissipation

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Magnetic Field Evolution, Flux Penetration And energy dissipation due to the Hall field in the plasma opening switch configuration

IEEE Conference Record - Abstracts. 1992 IEEE International Conference on Plasma, 1993

None


Simulation and implementation of an 8-bit carry look-ahead adder using adiabatic quantum-flux-parametron

2013 IEEE 14th International Superconductive Electronics Conference (ISEC), 2013

We have been studying ultra-low-power logic circuits using adiabatic quantum- flux-parametron (AQFP) logic, whose power consumption can be decreased significantly by changing their potential energies adiabatically using AC exciting currents. In this study, we designed an 8-bit carry look-ahead adder (CLA) using an AQFP cell library based on the AIST Nb 2.5 kA/cm2standard process (STP2) and evaluated its circuit properties. ...


Study of Beam Energy Saturation in Laser Wake Field Accelerators

2007 IEEE 34th International Conference on Plasma Science (ICOPS), 2007

Summary form only given. Saturation of electron beam energy has been observed experimentally in a laser wakefield accelerator [C. -T. Hsieh et al., Phys. Rev. Lett. 96, 095001 (2006)]. In the study, a two dimensional particle-in- cell simulation was performed to ascertain the physical reason for the energy saturation. Numerical results show that faster laser energy dissipation induced by transverse ...


Experimental evaluation of a control system for an absolute angle measuring micromachined gyroscope

SENSORS, 2005 IEEE, 2005

This work presents the experimental implementation and evaluation of a feedback control system for compensation of energy dissipation and suppression of anisoelasticity based errors in a micromachined absolute angle measuring gyroscope. The control system was implemented with a high speed, real time DSP board using MATLAB Simulink code downloaded onto the board. A single crystal silicon prototype was fabricated and ...


Low-power Capacitor Arrays for Charge Redistribution SAR A-D Converter in 65nm CMOS

2009 Pacific-Asia Conference on Circuits, Communications and Systems, 2009

Through the research on charge redistribution SAR A/D converter, three energy- efficient capacitor arrays are discussed in this paper. The switching energy of the traditional architecture, charge sharing architecture, capacitor splitting architecture and two-step architecture capacitor arrays is derived and analyzed. Based on SMIC 65 nm CMOS process, 10-bit SAR A/D converters of all these architectures are designed to validate ...


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Educational Resources on Energy dissipation

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IEEE-USA E-Books

  • Magnetic Field Evolution, Flux Penetration And energy dissipation due to the Hall field in the plasma opening switch configuration

    None

  • Simulation and implementation of an 8-bit carry look-ahead adder using adiabatic quantum-flux-parametron

    We have been studying ultra-low-power logic circuits using adiabatic quantum- flux-parametron (AQFP) logic, whose power consumption can be decreased significantly by changing their potential energies adiabatically using AC exciting currents. In this study, we designed an 8-bit carry look-ahead adder (CLA) using an AQFP cell library based on the AIST Nb 2.5 kA/cm2standard process (STP2) and evaluated its circuit properties. The CLA is composed of 1224 critically-dumped 50-μA Josephson junctions, which occupy the area of 1.74 × 0.99 mm2. Simulation results show that the CLA has a wide bias margin of ±29.5%, and the energy dissipation is 16.4 aJ per clock cycle at 5-GHz operation.

  • Study of Beam Energy Saturation in Laser Wake Field Accelerators

    Summary form only given. Saturation of electron beam energy has been observed experimentally in a laser wakefield accelerator [C. -T. Hsieh et al., Phys. Rev. Lett. 96, 095001 (2006)]. In the study, a two dimensional particle-in- cell simulation was performed to ascertain the physical reason for the energy saturation. Numerical results show that faster laser energy dissipation induced by transverse self-modulation of the laser pulse stops the electron beam to enter the deceleration phase, which is principally responsible for the beam energy saturation. The effect of the plasma density and laser intensity on the mechanism of energy saturation was also studied and will be presented in the paper.

  • Experimental evaluation of a control system for an absolute angle measuring micromachined gyroscope

    This work presents the experimental implementation and evaluation of a feedback control system for compensation of energy dissipation and suppression of anisoelasticity based errors in a micromachined absolute angle measuring gyroscope. The control system was implemented with a high speed, real time DSP board using MATLAB Simulink code downloaded onto the board. A single crystal silicon prototype was fabricated and used as a test bed. Experimental results demonstrated that the control system maintains the gyroscope motion at a defined energy level with some steady state error while simultaneously reducing anisoelasticity induced angular momentum by 31%

  • Low-power Capacitor Arrays for Charge Redistribution SAR A-D Converter in 65nm CMOS

    Through the research on charge redistribution SAR A/D converter, three energy- efficient capacitor arrays are discussed in this paper. The switching energy of the traditional architecture, charge sharing architecture, capacitor splitting architecture and two-step architecture capacitor arrays is derived and analyzed. Based on SMIC 65 nm CMOS process, 10-bit SAR A/D converters of all these architectures are designed to validate these concepts. The energy dissipation from Hspice simulation is discussed. At the smallest output code, charge sharing architecture and capacitor splitting architecture consume respectively 65.5% and 44.8% of the energy conventional architecture dissipates. At the smallest and largest output codes, two-step architecture just consumes respectively 10.4% and 23.1% of the traditional architecturepsilas dissipation.

  • Energy-conscious HW/SW-partitioning of embedded systems: a case study on an MPEG-2 encoder

    Energy dissipation is a hot topic in the design of- especially mobile-embedded systems. This is because applications like digital video cameras, cellular phones etc. draw their current from batteries that spend a limited amount of energy only. In this paper we show that energy-conscious HW/SW-partitioning can lead to drastic reductions of energy dissipation of a whole embedded system. Subject of investigation is an MPEG-2 encoder. Therefore, we introduce our framework for estimating and optimizing system energy as well as all conducted design steps. The obtained results show energy savings up 59% while the performance remains approximately the same or becomes even slightly higher. As a main result, energy-conscious HW/SW-partitioning is a promising method to be deployed in addition to classical energy and/or power reduction methods.

  • A 100-fJ/cycle sub-V<inf>T</inf>decimation filter chain in 65 nm CMOS

    Measurements of a sub-threshold (sub-VT) decimation filter, composed of four half band digital (HBD) filters in 65 nm CMOS are presented. Different unfolded architectures are analyzed and implemented to combat speed degradation. The architectures are analyzed for throughput and energy efficiency over several threshold options. Reliability in the sub-VTdomain is analyzed by Monte-Carlo simulations. The simulation results are validated by measurements and demonstrate that low-power standard threshold logic (LP-SVT) and different architectural flavours are suitable for a low-power implementation. Silicon measurements prove functionality down to 350mV supply, with a maximum clock frequency of 500 kHz, having an energy dissipation of 102 fJ/cycle.

  • Radiation-induced magnetoresistance oscillations in two-dimensional electron systems

    We carry out a systematic theoretical analysis on radiation induced magnetoresistance oscillations (RI-MOs) in high-mobility two-dimensional electron systems (2DESs), based on the balance-equation approach to magnetotransport developed for high-carrier-density systems. The time- dependent drift velocity v(i) and electron temperature Te serve as the basic parameters, which enter the frictional force, energy absorption and energy dissipation rates and are determined through the force and energy balance equations when the incident radiation field is given. The model covers regimes of inter-and intra-Landau level processes, takes account of multiphoton- assisted electron transitions as well as radiation-induced change of the electron distribution, and naturally includes electrodynamic damping. Electron scatterings by impurities, transverse and longitudinal acoustic phonons as well as polar optic phonons are considered simultaneously.

  • A Method of Multi-Sinks Query in Wireless Sensor Networks

    Distributed wireless sensor networks will play an important role in the future. In wireless sensor networks, observers are interested in spatio- temporal information monitored by sensors. It is crucial to design and employ energy-efficient query processing since nodes are battery-powered, and thus their lifetimes are limited. This paper proposed a query source sharing approach to optimizing query processing in multi-sinks sensor network. Firstly, basic query conception is defined. All region queries can be linearly expressed by basic queries. Secondly, a data transfer routing establish method was designed. Energy dissipation can be reduced by sharing same query data in multi-sinks sensor network. Simulation results shows that energy cost can be 25% reduced.

  • Energy Efficient Wireless Sensor MAC Protocol for Collision Avoidance

    In sensor networks communication by broadcast method involves many hazards, especially collision. Several MAC layer protocols have been proposed to resolve the problem of collision namely ARBP, where the best achieved success rate is 90%. We hereby propose a MAC protocol which achieves a greater success rate (Success rate is defined as the percentage of delivered packets at the source reaching the destination successfully) by reducing the number of collisions, but by trading off the average propagation delay of transmission. Our proposed protocols are also shown to be more energy efficient in terms of energy dissipation per message delivery, compared to the currently existing protocol.



Standards related to Energy dissipation

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IEEE Guide for Diagnostic Field Testing of Electric Power Apparatus - Part 1: Oil Filled Power Transformers, Regulators, and Reactors


Standard Requirements, Terminology, and Test Code for Bushings for DC Applications Rated 110 kV BIL and Above

This standard applies to outdoor and indoor power apparatus dc bushings of condenser type that have basic impulse insulation levels of 110 kV and above for use as components of oil-filled converter transformers and smoothing reactors, as well as air-to-air dc bushings. This standard does not apply to the following: a) High-voltage cable terminations (potheads) b) Bushings for instrument transformers ...



Jobs related to Energy dissipation

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