Conferences related to Embossing

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2021 IEEE International Conference on Mechatronics (ICM)

CM focuses on recent developments and future prospects related to the synergetic integration of mechanics, electronics, and information processing.


2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting

The joint meeting is intended to provide an international forum for the exchange of information on state of the art research in the area of antennas and propagation, electromagnetic engineering and radio science


2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE Photovoltaic Specialists Conference (PVSC)

Promote science and engineering of photovoltaic materials, devices, systems and applications


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Periodicals related to Embossing

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Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Display Technology, Journal of

This publication covers the theory, design, fabrication, manufacturing and application of information displays and aspects of display technology that emphasize the progress in device engineering, device design, materials, electronics, physics and reliabilityaspects of displays and the application of displays.


Education, IEEE Transactions on

Educational methods, technology, and programs; history of technology; impact of evolving research on education.


Electronics Packaging Manufacturing, IEEE Transactions on

Design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally-friendly processing, and computer-integrated manufacturing for the production of electronic assemblies, products, and systems.


Lightwave Technology, Journal of

All aspects of optical guided-wave science, technology, and engineering in the areas of fiber and cable technologies; active and passive guided-wave componentry (light sources, detectors, repeaters, switches, fiber sensors, etc.); integrated optics and optoelectronics; systems and subsystems; new applications; and unique field trials.


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Xplore Articles related to Embossing

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Illumination invariant face recognition

SMC'98 Conference Proceedings. 1998 IEEE International Conference on Systems, Man, and Cybernetics (Cat. No.98CH36218), 1998

Few of the face recognition methods reported in the literature are capable of recognising faces under varying illumination conditions. The paper discusses a method which can achieve a higher recognition rate than those obtained for existing methods. The novelty of this new method is the use of an embossing technique to process a face image before presenting it to a ...


Position detection with micro whistles

2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013

This paper describes the design and detection of mechanically actuated micro whistles not equipped with any electronics. When actuated, the micro whistle generates an ultrasonic tone above the audible range. A set of 3 or more microphones in the near record this tone and the position of the whistle is calculated from the time differences of the arrivals of the ...


Process Challenges for Realization of High Quality Roller Embossing for Patterning Large Area Green Ceramic Substrates

2008 10th Electronics Packaging Technology Conference, 2008

This paper presents our latest achievements in addressing the process challenges in developing large area patterning of green ceramic substrates using hot roller embossing. Micro roller embossing on large area ceramic green substrates was successfully demonstrated by using an electroplated film mold and feeding the sandwiched structure (mold-substrate-supporting plate) through a micro embosser, which consists of top and bottom rollers. ...


Sub-50nm featured polymer stamp fabrication for UV nanoimprint lithography

2007 Digest of papers Microprocesses and Nanotechnology, 2007

Using hot embossing lithography, 8-inch sized sub-50 nm featured flexible polymer template was clearly fabricated. UV-NIL process was taken on Si substrate with the polymer stamp and sub-50 nm pattern was successfully fabricated on Si substrate.


The Process of Automatically Fabricating Polymer Microfluidic Chips

2006 6th World Congress on Intelligent Control and Automation, 2006

The key techniques for fabrication of polymer microfluidic chips are outlined, including hot-embossing processing technique, fabrication of metal mold-insert with micro structures. The manufacturing process and process control towards the batch production of polymer microfluidic chips are discussed. The developed hot-embossing machines and the prototype automatic fabrication system for plastic microfluidic chips are introduced, some problems for automatic fabrication were ...


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  • Illumination invariant face recognition

    Few of the face recognition methods reported in the literature are capable of recognising faces under varying illumination conditions. The paper discusses a method which can achieve a higher recognition rate than those obtained for existing methods. The novelty of this new method is the use of an embossing technique to process a face image before presenting it to a standard face recognition system. Using a large database of face images, the performance of the proposed method is evaluated by comparing it against the performances of three existing methods. The experimental results demonstrate the successfulness of the proposed method.

  • Position detection with micro whistles

    This paper describes the design and detection of mechanically actuated micro whistles not equipped with any electronics. When actuated, the micro whistle generates an ultrasonic tone above the audible range. A set of 3 or more microphones in the near record this tone and the position of the whistle is calculated from the time differences of the arrivals of the acoustic signals at the different microphones. Theoretically it is possible to get an accuracy of one wave length (1.7 cm). The micro whistles are fabricated by ultrasonic hot embossing of thermoplastic foils at low-cost and their overall size is approximately 1 cm. In experiments the positions of whistles up to now were measured in a 2 m × 2 m area with an accuracy of less than 10 cm.

  • Process Challenges for Realization of High Quality Roller Embossing for Patterning Large Area Green Ceramic Substrates

    This paper presents our latest achievements in addressing the process challenges in developing large area patterning of green ceramic substrates using hot roller embossing. Micro roller embossing on large area ceramic green substrates was successfully demonstrated by using an electroplated film mold and feeding the sandwiched structure (mold-substrate-supporting plate) through a micro embosser, which consists of top and bottom rollers. Formation of micro patterns on ceramic green substrates over an effective panel size of 150 mm × 150 mm was performed; and micro patterns such as inductors, channels with smallest line width of 50 ¿m were embossed on the ceramic green substrates. This paper also addresses the important process issues for improving embossing fidelity within a pattern unit, as well as the uniformity of unit-to-unit patterns. At lower embossing temperatures, the embossed depth at the center of a pattern unit was found to be lower than that at the edge of the pattern unit. By increasing the embossing temperature, both the embossed depth and the uniformity within a pattern unit were enhanced. The effect of the thickness of green substrates was investigated by increasing the green tapers from 4 layers to 6 layers. The dimensions and locations of the embossed patterns were characterized before and after co-firing, the variations of pattern dimensions and locations were compared with the designed values on the nickel mold. These results will be used as a guideline for actual device design.

  • Sub-50nm featured polymer stamp fabrication for UV nanoimprint lithography

    Using hot embossing lithography, 8-inch sized sub-50 nm featured flexible polymer template was clearly fabricated. UV-NIL process was taken on Si substrate with the polymer stamp and sub-50 nm pattern was successfully fabricated on Si substrate.

  • The Process of Automatically Fabricating Polymer Microfluidic Chips

    The key techniques for fabrication of polymer microfluidic chips are outlined, including hot-embossing processing technique, fabrication of metal mold-insert with micro structures. The manufacturing process and process control towards the batch production of polymer microfluidic chips are discussed. The developed hot-embossing machines and the prototype automatic fabrication system for plastic microfluidic chips are introduced, some problems for automatic fabrication were solved, and solutions are given

  • Nanorheology of squeezed polymer films

    We present investigations of submicrometer quasi-two dimensional flow mechanics of squeezed thin polymer films in the context of nanoimprint lithography. The polymer films were indented by patterned spherical indenters above and below the glass transition region in a temperature controlled nanoindenter. Static and dynamical mechanical characteristics of the contact were monitored during the printing process. We demonstrate the relation of substrate deformation in the cold embossing technique and residual stress relaxation during hot embossing to the overall pattern transfer fidelity during isothermal stamping.

  • Dynamic characteristics analysis of a reflection type photopolymer

    Refractive-index changes in photopolymers are caused by exposure-related polymerization as well as by consequential diffusion of monomers. The authors perform experiments using the following procedures: The experiments are performed with equal input intensities of 1 mW for the two beams whose diameter is 1 cm. As a first step, the diffraction efficiency as a function of the exposure energy is measured. Also, the dependence of the incident angles is measured. One beam is fixed at 0/spl deg/ to the normal of the surface of the recording material and the angle of the other beam is changed. The diffraction efficiency curve as a function of the incident angle is determined.

  • Hot embossing characteristics of PEEK compared to PC and PMMA

    Development of low cost manufacturing processes for the MEMS and the MOEMS is important for their commercialization. A micro hot embossing process is used to make optical and Bio devices with Polycarbonate (PC) and Polymethylmetacrylate (PMMA) materials. In this paper, outline of an optical switch with 8/spl times/8 mirrors is introduced and the optical switch used Polyetheretherketone (PEEK) sheet, which has high mechanical properties, high chemical resistance and high hydrolysis resistance at elevated temperature, is embossed with a developed micro hot embossing machine by using a mould made by electroforming. Embossing force and temperature have been changed up to 10 kN and 600 K respectively. After the embossing, the minimum thickness of the PEEK has changed from 300 um to 100 um. The shapes and sizes of replicated mirrors are evaluated and compared with the PC and the PMMA. Glass transition temperature (Tg) of the PEEK (416 K) is almost same as the PC (423 K) and higher than the PMMA (378 K). However, the mechanical strength of the PEEK at the elevated temperature is higher than the PC and the PMMA. Therefore the PEEK needs higher embossing force and temperature compared to the PC and the PMMA. But the PEEK is very easy to remove from the mould due to coefficient of linear thermal expansion at elevated temperature is higher than the PC and the PMMA.

  • Fabrication of the polymer diffuser with surface microstructures by using the extrusion roller embossing process

    Abstract-This paper reports a new kind of extrusion roller embossing microstructure process, which enables the fabrication of diffusers with surface microstructures. Established extrusion roller embossing system consists of polymer plate extrusion institution and roller embossing agency. The metal roller microstructure roller for embossing is fabricated by coating the slab mould. During the roller embossing process, the surface temperature of polypropylene (PP) sheet is still close to its melting point, which is suitable for extrusion roller embossing microstructure process. Under the proper processing parameters, the polymer diffusers have been successfully fabricated with uniform distribution micro-lens arrays. The diffuser with surface microstructures can scatter the light uniformly and diffuse the light effectively. The haze of this diffuser increases with its transmittance declining.

  • Fabrication of polymer microneedle array based on tungsten mold and optimized replication method

    Fabrication of high performance tungsten microneedle array (MNA) which has tunable height and diameter is reported for the first time. Further, stable replication of cycloolefine copolymer (COC) MNA is achieved using novel vacuum isostatic hot embossing followed by PDMS casting with tungsten MNA mold. Radius of needlepoint is less than 1pm while microneedle height reaches as high as 100μm. High hardness of tungsten ensures reliability of mold which offers commercial potential for this method.



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