Conferences related to Electrothermal effects

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2021 IEEE Pulsed Power Conference (PPC)

The Pulsed Power Conference is held on a biannual basis and serves as the principal forum forthe exchange of information on pulsed power technology and engineering.


2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2020 IEEE International Conference on Plasma Science (ICOPS)

IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.


2020 IEEE International Conference on Robotics and Automation (ICRA)

The International Conference on Robotics and Automation (ICRA) is the IEEE Robotics and Automation Society’s biggest conference and one of the leading international forums for robotics researchers to present their work.


2020 IEEE International Reliability Physics Symposium (IRPS)

Meeting of academia and research professionals to discuss reliability challenges


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Periodicals related to Electrothermal effects

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Circuits and Systems I: Regular Papers, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


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Most published Xplore authors for Electrothermal effects

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Xplore Articles related to Electrothermal effects

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Experimental Determination Of The Mass Density of a Plasma Arc Armature

IEEE Conference Record - Abstracts. 1991 IEEE International Conference on Plasma Science, 1991

None


Erosion Of Plasma-exposed Surfaces In An Electrothermal Accelerator

IEEE Conference Record - Abstracts. 1991 IEEE International Conference on Plasma Science, 1991

None


High Heat Flux Measurement In An Electrothermal Launcher

IEEE Conference Record - Abstracts. 1991 IEEE International Conference on Plasma Science, 1991

None


An electrothermal model for large mass bolometric detectors

IEEE Conference on Nuclear Science Symposium and Medical Imaging, 1992

A method for modeling large mass bolometric detectors was developed. It is based on the analysis of the different pulse shapes obtained when a particle deposits its energy in the absorber or in the temperature sensor, SPICE was used for the simulation. Small and large signal analysis is carried out. The model was used for the accurate parameter extraction of ...


An electrothermal microlens scanner with low-voltage large-vertical-displacement actuation

IEEE Photonics Technology Letters, 2005

This letter reports the design, fabrication, and operation of a microlens scanner that can perform large vertical scans at low actuation voltages. Photoresist (PR) reflow technique was used to form a 210-μm-diameter PR microlens on a lens holder which is integrated with a large-vertical- displacement (LVD) microactuator. The lens holder is fabricated using a maskless deep-reactive-ion-etch complementary-metal-oxide-semiconductor microelectromechanical systems process. ...


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Educational Resources on Electrothermal effects

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IEEE.tv Videos

IMS 2012 Microapps - Integrated Electrothermal Solution Delivers Thermally Aware Circuit Simulation Rick Poore, Agilent EEsof
IMS 2011 Microapps - Memory Effects in RF Circuits: Definition, Manifestations and Fast, Accurate Simulation
IMS 2012 Microapps - Reducing Active Device Temperature Rise and RF Heating Effects with High Thermal Conductivity Low Loss Circuit Laminates
IMS 2011 Microapps - Tools for Creating FET and MMIC Thermal Profiles
IMS MicroApp: Unexpected effects of conductor profile on the propagation constant
Panel 1: Critical Modeling Aspects & Effects on System Design & Performance - Brooklyn 5G 2015
The Josephson Effect: The Observations of Josephson's Effects
Micro-Apps 2013: Rapid Simulation of Large Phased Array T/R Module Networks
IROS TV 2019- Pohang University of Science and Technology- Haptics and Virtual Reality Laboratory
BSIM Spice Model Enables FinFET and UTB IC Design
IEEE Magnetics Distinguished Lecture - Yoshichika Otani
26th Annual MTT-AP Symposium and Mini Show - Ken Kenjale
Microwave PCB Structure Selection Microstrip vs. Grounded Coplanar Waveguide: MicroApps 2015 - Rogers Corporation
IEEE Sections Congress 2011 Opening Ceremony
Penetrating Conductors - EMC Society Demo
How to Optimize the Performance of Your RF Layout: MicroApps 2015 - Keysight Technologies
Non-Volatile Memory Array Based Quantization - Wen Ma - ICRC San Mateo, 2019
Brooklyn 5G - 2015 - Chris Collins - Safety, Exposure Assessment and Dosimetry from RF to mmWave
Brooklyn 5G Summit 2014: Channel Measurements Summary by Ted Rappaport
Q&A: David Kravitz - Special Session on SIoT: WF-IoT 2016

IEEE-USA E-Books

  • Experimental Determination Of The Mass Density of a Plasma Arc Armature

    None

  • Erosion Of Plasma-exposed Surfaces In An Electrothermal Accelerator

    None

  • High Heat Flux Measurement In An Electrothermal Launcher

    None

  • An electrothermal model for large mass bolometric detectors

    A method for modeling large mass bolometric detectors was developed. It is based on the analysis of the different pulse shapes obtained when a particle deposits its energy in the absorber or in the temperature sensor, SPICE was used for the simulation. Small and large signal analysis is carried out. The model was used for the accurate parameter extraction of two TeO/sub 2/ detectors of 70 g and 330 g, respectively. Results suggest a possible field- effect dependence of the electron-phonon thermal conductance and electronic heat capacity in the NTD thermistors used.<<ETX>>

  • An electrothermal microlens scanner with low-voltage large-vertical-displacement actuation

    This letter reports the design, fabrication, and operation of a microlens scanner that can perform large vertical scans at low actuation voltages. Photoresist (PR) reflow technique was used to form a 210-μm-diameter PR microlens on a lens holder which is integrated with a large-vertical- displacement (LVD) microactuator. The lens holder is fabricated using a maskless deep-reactive-ion-etch complementary-metal-oxide-semiconductor microelectromechanical systems process. A maximum static vertical displacement of 280 μm is achieved with a 700 by 320 μm LVD device at a low actuation voltage of 10 V. The microlens has a focal length of 188 μm, a numerical aperture of 0.35, and a resonant frequency of about 1 kHz.

  • Studies of confined high-pressure discharges in an electrothermal capillary

    Experimental measurements and numerical analyses for a series of capillary discharge tests are reported. The tests are conducted in a high-pressure vessel with an instrumented polyethylene-lined capillary that injects into a small, constant-volume and pressure-instrumented chamber. A sequence of tests in which the capillary radius is varied by a factor of 5 and in which the capillary power dissipation levels are varied is discussed. The results obtained show that significant radial temperature gradients can be expected at high power levels or for low flow rates from the capillary. The results show that the use of blackbody heat fluxes based on the plasma core temperature should not be used to estimate wall heat fluxes in an electrothermal chemical system.<<ETX>>

  • Electrothermal modeling and simulation with SIMPLORER

    Modern circuit simulators for power electronics have implemented electrothermal models of power semiconductors in their libraries. For successful simulation, interaction between electrical behaviour and self- heating effects cannot be neglected. SIMPLORER simulator is between the first that have implemented electrothermal models of power semiconductors at device level. In this paper validation of SIMPLORER's power MOSFET electrothermal model is performed. As a temperature sensor during measurement TEMPFET was used, resulting with good agreement of simulation and measurement results.

  • METHODIC: a new CAD for electrothermal coupling simulation in power converters

    The power dissipated in a component makes it into a real thermal generator. This changes the electrical parameters of the component and vice versa. This phenomenon is known as electrothermal coupling. Proper design of power converters requires taking this electrothermal coupling into account. In this paper, a method for optimizing thermal dimensioning of power converters is described, taking into account electrothermal coupling. It is based on experimental loss models for IGBTs and diodes. The results have been used to build a CAD (METODIC) in C++ for Windows 95. METODIC offers power electronic engineers tools to analyze quickly the effects of a range of electrical or thermal parameters on the behavior of the component.

  • A Compact Calculation Method for Dynamic Electro-thermal Behavior of IGBTs in PWM Inverters

    Power modules including IGBT (insulated gate bipolar transistor) are widely used in the applications of motor drivers. The design optimization of the modules associated with the device characteristics, the module structures and the cooling conditions has become a major issue with the increase of the current density and the demand of downsizing the modules. In this paper, we propose a compact calculation method of dynamic electrothermal behavior of IGBT PWM (pulse width modulation) inverter modules. The dynamic electro- thermal calculations are performed using familiar spreadsheet software. In this approach, the mathematical models of the temperature dependencies of the device losses and quasi one-dimensional difference equations of thermal conduction were used for the estimation of the temperature of the module. To narrow down a lot of device and module parameters, the proposed approach will be an effective tool in the initial stage of thermal design of the inverter modules.

  • Pulse and DC operation lifetimes of bent-beam electrothermal actuators

    This paper reports on lifetime studies of polysilicon and p/sup ++/ Si electrothermal actuators designed for rectilinear displacements. Measurements show that degradation patterns for displacement amplitude can be linked to design variables and operating conditions. At low power levels (which result in average operating temperatures of 300-400/spl deg/C), both types of devices provide continuous DC actuation for >1400 min. and pulse actuation for >30 million cycles without change in amplitude. A model similar to that used for fatigue in steel is used to fit pulse test data for p/sup ++/ Si actuators. The model parameters are explored as functions of operating conditions and device geometry.



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