Conferences related to Electronics cooling

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2021 IEEE Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


2021 IEEE Pulsed Power Conference (PPC)

The Pulsed Power Conference is held on a biannual basis and serves as the principal forum forthe exchange of information on pulsed power technology and engineering.


2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.


2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


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Periodicals related to Electronics cooling

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Consumer Electronics, IEEE Transactions on

The design and manufacture of consumer electronics products, components, and related activities, particularly those used for entertainment, leisure, and educational purposes


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Electron Device Letters, IEEE

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronic devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


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Most published Xplore authors for Electronics cooling

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Xplore Articles related to Electronics cooling

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A system level view of avionics/vetronics cooling options for harsh environment two-level maintenance systems - [Not available for publication]

The 23rd Digital Avionics Systems Conference (IEEE Cat. No.04CH37576), 2004

None


Study of Evaporation Phenomena in Micro Channels

2006 1st IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2006

Two-phase convective flow in micro channels has numerous promising applications such as electronic cooling. This study investigates evaporation phenomena and capillary-driven heat in a rectangular micro channels structure with hydraulic diameters of 100 ~ 250nm and length of 75mm. The micro channels made of (110)-orientated silicon is fabricated by bulk micromachining. The temperature distributions in micro channels chip structure, as ...


Implementation of the Deutsch-Josza algorithm on an ion trap quantum computer

2003 European Quantum Electronics Conference. EQEC 2003 (IEEE Cat No.03TH8665), 2003

We present the experimental implementation of the Deutsch-Josza algorithm using the electronic and motional states of a single, cooled and trapped /sup 40/Ca/sup +/ ion as qubits.


Thermal characterization of pulsating heat pipes

Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006., 2006

Experimental studies were carried out to understand the heat transfer characteristics of pulsating heat pipes. Two heat pipes with different working fluids of HFC-134a and butane are evaluated. Both heat pipes are made of aluminum plate and have the same width of 50 mm and thickness of 1.9 mm. The effects of heat flux, heat pipe orientation, length of cooling ...


Exposure testing of dielectric liquids for aircraft EHD heat exchanger applications

1998 Annual Report Conference on Electrical Insulation and Dielectric Phenomena (Cat. No.98CH36257), 1998

An eight-week test evaluated long-term exposure effects of pulsed high voltage electric fields on fluid properties. Two electronics cooling fluids suitable for aviation use were tested: FC-72, a perfluorocarbon, and PAO, or polyalphaolefin, a dielectric cooling oil. These fluids were exposed to approximately 10,000 on-off cycles and tested for changes in fluid physical and electrical properties and chemical composition. Test ...


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Educational Resources on Electronics cooling

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IEEE-USA E-Books

  • A system level view of avionics/vetronics cooling options for harsh environment two-level maintenance systems - [Not available for publication]

    None

  • Study of Evaporation Phenomena in Micro Channels

    Two-phase convective flow in micro channels has numerous promising applications such as electronic cooling. This study investigates evaporation phenomena and capillary-driven heat in a rectangular micro channels structure with hydraulic diameters of 100 ~ 250nm and length of 75mm. The micro channels made of (110)-orientated silicon is fabricated by bulk micromachining. The temperature distributions in micro channels chip structure, as well as the induced evaporation mass flow rate of water, were measured under different heat flux and inclination angle. Thermal resistances were calculated to evaluate the chip cooling performance. The experimental results show that with an increase of the imposed heat flux, the evaporation mass flow rate increases and thermal resistance decreases. The effect of channel sizes and inclination angle on the heat transfer characteristics are also examined

  • Implementation of the Deutsch-Josza algorithm on an ion trap quantum computer

    We present the experimental implementation of the Deutsch-Josza algorithm using the electronic and motional states of a single, cooled and trapped /sup 40/Ca/sup +/ ion as qubits.

  • Thermal characterization of pulsating heat pipes

    Experimental studies were carried out to understand the heat transfer characteristics of pulsating heat pipes. Two heat pipes with different working fluids of HFC-134a and butane are evaluated. Both heat pipes are made of aluminum plate and have the same width of 50 mm and thickness of 1.9 mm. The effects of heat flux, heat pipe orientation, length of cooling section, heating surface area, cooling mode (natural air convection vs. forced liquid cooling) and working fluid are examined. High thermal performance of 0.05degC/W was demonstrated for the heat pipe using HFC-134a

  • Exposure testing of dielectric liquids for aircraft EHD heat exchanger applications

    An eight-week test evaluated long-term exposure effects of pulsed high voltage electric fields on fluid properties. Two electronics cooling fluids suitable for aviation use were tested: FC-72, a perfluorocarbon, and PAO, or polyalphaolefin, a dielectric cooling oil. These fluids were exposed to approximately 10,000 on-off cycles and tested for changes in fluid physical and electrical properties and chemical composition. Test results showed no significant changes in FC-72 properties, but a substantial reduction in the dielectric strength and increase in electrical conductivity of PAO. Further testing is required to isolate the cause of these changes.

  • New generation of S band T/R module

    This paper describes a new S band T/R module which has been developed to equip the MASTER radar, an air defense radar. The particularity of this module is its very high power in a wide frequency band (more than 1.2 kW peak power in S band) with very long pulses (up to 200 /spl mu/s) and high duty cycle (15%). The very good pulse to pulse stability figure is the result of a deep study which has been made taking into account the thermal phenomena and the power supply fluctuations. The main parameters for the reception path is a very low noise figure (2 dB typical including the duplexer and the limiter losses), the amplitude/phase control with a very high accuracy. The design of the module was made to ensure a very high reliability (it was designed to ensure a MTBF better than 33000 hours): the junction temperature of the component is very low in order to increase their MTBF. This very high MTBF is achieved by an appropriate cooling of each component with an efficient cooling plate.

  • Highly compact and efficient JTRS radios using superconductor microelectronics - a quantum leap in performance: the cryopackage

    Superconductor microelectronics (SME) are rapidly redefining the state-of-the- art in wireless RF performance. SME-based digital RF subsystems, enabled by compact cryocoolers, have the potential to achieve all JTRS objective requirements (not just the thresholds) for performance, SWaP, and Cost as an Independent Variable (CAIV) targets for clusters 1, 3 and 4. Compact cryo- packaging is the key to deploying SME-based digital RF subsystems in JTRS and other wireless radio systems. A compact cryocooler provides the cryogenic environment for the superconductor multi-chip modules (MCM). The cryo-package (comprising the MCM and compact cryocooler) includes the mechanical and electrical interfaces to the JTRS radio. For example, a single SME-based digital RF subsystem provides a 10-channel full-duplex transceiver in less than 500 in/sup 3/, 30 lbs, and 150 watts; and an availability (up time) on the order of 99.998%. This paper discusses all aspects of cryopackaging, which include compact closed-cycle refrigerators or cryocoolers, methods of building and cooling superconductor multi-chip modules, managing thermal loads of input-output leads between warm ambient temperature electronics and cold superconductor electronics, and electromagnetic shielding.

  • All silicon multi chip module with a fully integrated cooling system

    This paper proposes a novel silicon-on-silicon multichip module with an integrated thermal management system. Our module offers a new packaging approach, which allows great densification of the number of electronic circuits on a common substrate that is almost equivalent to wafer scale integration, yet uses discrete chips. Wet anisotropic etching is used for the separation of silicon integrated circuits as well as for the fabrication of the chip-receiving cavities in the MCM substrate. The etching exposes Si{111} planes in both chip and receiving surface, assuring a virtually perfect mating of the assemblage. The system is complemented with an integrated cooling channel which allows the removal of heat fluxes up to 300 Wcm/sup -2/.

  • Design Of Compact Heat Exchangers For The Thermal Management Of Battery Compartments Of Outdoor Telecommunication Cabinets

    None

  • Performance of a MEMS based micro capillary pumped loop for chip-level temperature control

    To provide direct cooling to electronics and microelectromechanical systems, a three port micro-capillary pumped loop (CPL) was designed, fabricated and tested using current MEMS technology. The two wafer design consists of a silicon and a borofloat glass wafer. An evaporator, condenser, reservoir, and liquid and vapor lines were etched into the silicon wafer, while the glass wafer serves as a cover plate into which grooves were etched for capillary pumping. The geometry of the components of the device were determined via an analytical study. A finished device was run near steady state using laser spot heating and water as the working fluid. It was determined that a 1 mm/spl times/2 mm evaporator operates at a constant 100 /spl deg/C until wick dry-out at a laser power of 7.5 W (+/-2 W). Furthermore, with the same laser power the micro-CPL resulted in a backside cooling of at least 7 degrees C.



Standards related to Electronics cooling

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