Conferences related to Electronic packaging thermal management

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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.


2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE Applied Power Electronics Conference and Exposition (APEC)

APEC focuses on the practical and applied aspects of the power electronics business. Not just a power designer’s conference, APEC has something of interest for anyone involved in power electronics including:- Equipment OEMs that use power supplies and converters in their equipment- Designers of power supplies, dc-dc converters, motor drives, uninterruptable power supplies, inverters and any other power electronic circuits, equipments and systems- Manufacturers and suppliers of components and assemblies used in power electronics- Manufacturing, quality and test engineers involved with power electronics equipment- Marketing, sales and anyone involved in the business of power electronic- Compliance engineers testing and qualifying power electronics equipment or equipment that uses power electronics


2020 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.


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Periodicals related to Electronic packaging thermal management

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Electron Device Letters, IEEE

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronic devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


Electronics Packaging Manufacturing, IEEE Transactions on

Design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally-friendly processing, and computer-integrated manufacturing for the production of electronic assemblies, products, and systems.


Industry Applications, IEEE Transactions on

The development and application of electric systems, apparatus, devices, and controls to the processes and equipment of industry and commerce; the promotion of safe, reliable, and economic installations; the encouragement of energy conservation; the creation of voluntary engineering standards and recommended practices.


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Most published Xplore authors for Electronic packaging thermal management

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Xplore Articles related to Electronic packaging thermal management

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Thermal challenges in the next generation of computer, telecommunication, and military electronic equipment

The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543), 2004

The electronic design community is facing a new phase of thermal challenges in the present and future electronic and optical packaging. It is very common to have localized high-heat-flux components located within the system in direct proximity to other components, which are very sensitive to temperature. This is especially true when the system contains both optical and electronic devices. The ...


Plastic encapsulated components for cars

IEEE Instrumentation & Measurement Magazine, 2001

Thermal management in electronics packaging is important. Thermal stress greatly affects reliability and aging of electronic circuits. Our group developed a thermal simulation tool named TRESCOM for investigating thermal problems in electronic packaging. We used this tool for steady-state and dynamic analyses of the thermal qualities of PLCC and CLCC components. Our investigation demonstrated the surprising result that the thermal ...


A new breed of ball grid array package

Workshop on MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994

Overmolded PBGA(Plastic Ball Grid Array) package has been favorably introduced because of its advantages over fine-pitch PQFP(Plastic Quad Flat Package), such as smaUer footprint, better electrical and thermal performance, superior surface mountability, etc. From the viewpoint of thermal performance, two types of BGA packages, which show better thermal management capability than the overmolded PBGA package, have been developed. One is ...


Best papers from ITherm 2002

The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543), 2004

None


Best papers from ITherm 2002

The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543), 2004

None


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Educational Resources on Electronic packaging thermal management

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IEEE-USA E-Books

  • Thermal challenges in the next generation of computer, telecommunication, and military electronic equipment

    The electronic design community is facing a new phase of thermal challenges in the present and future electronic and optical packaging. It is very common to have localized high-heat-flux components located within the system in direct proximity to other components, which are very sensitive to temperature. This is especially true when the system contains both optical and electronic devices. The current trend of using system-on-chip packaging often results in high-heat-flux devices within the system. On the other hand, the present and next generation of civilian and military electronic equipment needs to be able to accommodate high- heat-fluxes in the same given physical space as equipment developed in the 1990s. Appropriate thermal management techniques need to be introduced, which will satisfy the reliability, maintainability, and availability of the system. In addition, these techniques must be economically acceptable. This panel will address the limitations of the air-cooling, the extension of the air-cooling limits through unique air-cooling technologies, refrigeration cooling, liquid cooling, liquid immersion cooling, and two-phase cooling.

  • Plastic encapsulated components for cars

    Thermal management in electronics packaging is important. Thermal stress greatly affects reliability and aging of electronic circuits. Our group developed a thermal simulation tool named TRESCOM for investigating thermal problems in electronic packaging. We used this tool for steady-state and dynamic analyses of the thermal qualities of PLCC and CLCC components. Our investigation demonstrated the surprising result that the thermal performance of the plastic encapsulated components is superior to hermetically sealed ceramic components. We conclude that plastic packages are reliable and can compete with ceramic packages at the elevated temperatures that are found in automotive applications.

  • A new breed of ball grid array package

    Overmolded PBGA(Plastic Ball Grid Array) package has been favorably introduced because of its advantages over fine-pitch PQFP(Plastic Quad Flat Package), such as smaUer footprint, better electrical and thermal performance, superior surface mountability, etc. From the viewpoint of thermal performance, two types of BGA packages, which show better thermal management capability than the overmolded PBGA package, have been developed. One is the PBGA package with cavity-down structure, which is not easy to manufacture, and the other is the ceramic BGA package. However, because both of them are fairly expensive to fabricate, a concept of BGA package With new configuration was developed to get the improved thermal performance at relatively low assembly cost.

  • Best papers from ITherm 2002

    None

  • Best papers from ITherm 2002

    None

  • Delamination in Thermohyperelastic Plastic IC Packaging Material Due to Thermal Load and Moisture

    Lamination failure as ldquopopcornrdquo form of plastic electronic packages under thermal stress induced by heat mismatch and vapor pressure induced by the moisture during the solder-reflow process is studied. When plastic electronic packages are made of thermohyperelastic materials, using the theory of cavity formation and unstable void growth in incompressible hyper-elastic material, we gained a analytical relationship between void growth and the sum of the vapor pressure and thermal stress. Numerical analyses show that plastic electronic packages will produce popcorn failure when the vapor pressure maintains saturation state during the solder-reflow process on condition that plastic electronic packages absorb a lot of moisture; popcorn failure wonpsilat occur when the moisture in voids is in single vapor phase during the solder-reflow process on condition that plastic electronic packages absorb little moisture.

  • Recent advances in bipolar power amplifiers for the 3-GHz-5 GHz frequency range

    Improvements in heat dissipation capability and better control of parasitics in carrier-mounted transistors to increase power output and reduce droop for long pulses, will be described. Single-transistor pellets have delivered 7-W CW power at 3.5 GHz and 4.5 W at 5 GHz.

  • Theta /sub JC/ characterization of chip packages-justification, limitations, and future

    A discussion is presented of thermal figures-of-merit (FOMs) for chip package thermal resistance, for use in evaluating competing thermal designs, and analysis techniques, for use in determining operating temperature profiles. The junction-to-case thermal resistance, Theta /sub JC/, as well as the junction-to-fluid thermal resistance, have been used in both of these roles for first-level packaging. The use of a modified Theta /sub JC/ is proposed. Experimental data indicate that the relations developed are capable not only of accurately describing the chip temperature for a variety of thermal management strategies, but also of highlighting the impact of specific thermal design features.<<ETX>>

  • Thermal simulation of high-lead count packages

    An efficient thermal management in electronic components is essential to minimize the influence of thermomechanically induced stress and thermal load. To reduce the effort caused by measuring the thermal behavior of semiconductor components frequently thermal simulation is applied. However, using commercially available software packages high effort is necessary for maintenance and for generating the thermal models. In addition the limitation of the node number does not allow spatial discretization sufficiently fine for high lead count packages. In this paper a new thermal simulation tool is presented which allows to establish models in a very efficient way. The developed and implemented solver based on the alternating direction implicit method (ADI-method) is efficiently processing the required high node number. Moreover, in this paper the developed thermal simulation tool is applied for the thermal characterization of a 176 lead QFP-Package using a discretization with 320.000 nodes. Steady-state and transient thermal qualities of the package are investigated.

  • A national course on thermal design of electronic products: recent experiences and a proposal

    The concept of a national course on thermal design of electronic products was presented by the authors at the last ECTC. Since that time, additional experience has been gained on this topic through student feedback and continuing advancements in instructional technologies. The focus of the present paper is on an Internet based approach, supplemented with live interactions for the development of a series of learning modules. Advances in Internet based instructional technology and satellite tele-conferencing offer unprecedented opportunities to provide high quality learning where and when it is needed. A high degree of reconfigurability is possible, which makes lifelong learning a real possibility. The concept of a national course and its basic elements are first summarized. Examples of modules and suggested implementation methodologies are then presented. Also discussed are methods for the assessment of the effectiveness of these modules.



Standards related to Electronic packaging thermal management

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