Conferences related to Electronic equipment

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2023 Annual International Conference of the IEEE Engineering in Medicine & Biology Conference (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted full papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions,will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.


2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting

The joint meeting is intended to provide an international forum for the exchange of information on state of the art research in the area of antennas and propagation, electromagnetic engineering and radio science


2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.


2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2020 IEEE 16th International Workshop on Advanced Motion Control (AMC)

AMC2020 is the 16th in a series of biennial international workshops on Advanced Motion Control which aims to bring together researchers from both academia and industry and to promote omnipresent motion control technologies and applications.


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Periodicals related to Electronic equipment

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Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Communications Letters, IEEE

Covers topics in the scope of IEEE Transactions on Communications but in the form of very brief publication (maximum of 6column lengths, including all diagrams and tables.)


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Most published Xplore authors for Electronic equipment

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Xplore Articles related to Electronic equipment

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The Shoemaker's Child-No Longer Unshod?

Proceedings of the IRE, 1954

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The nuclear electromagnetic pulse program: Evolution and impact on technology

1982 Antennas and Propagation Society International Symposium, 1982

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A new prediction-methodology on avionics embedded electronics: why? how?

Annual Reliability and Maintainability. Symposium. 1999 Proceedings (Cat. No.99CH36283), 1999

Systematic embedded equipment follow-up shows a great difference between reliability prediction and the field reliability. The authors study another reliability prediction method, based on the reliability tests performed by the parts manufacturers. The proposed methodology is applied to avionics embedded electronics equipment and the results are compared to field return data. A very good accordance between these predictive reliability data ...


Electrodeposited tin properties & their effect on component finish reliability

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809), 2004

Electrodeposited pure tin finishes on electronic components are a leading contender to replace the industry standard tin-lead. Since the electrodeposited finish directly influences the critical reliability characteristics of the component itself, the nature of the Pb-free component finish must be well characterized and understood. Only through a thorough examination of the attributes of the electroplated tin deposit can critical decisions ...


Electronic Controller-dc Brushless Motor System Simulator For Teaching Purposes

Proceedings of the 6th International Conference on Optimization of Electrical and Electronic Equipments, 1998

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Educational Resources on Electronic equipment

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IEEE-USA E-Books

  • The Shoemaker's Child-No Longer Unshod?

    None

  • The nuclear electromagnetic pulse program: Evolution and impact on technology

    None

  • A new prediction-methodology on avionics embedded electronics: why? how?

    Systematic embedded equipment follow-up shows a great difference between reliability prediction and the field reliability. The authors study another reliability prediction method, based on the reliability tests performed by the parts manufacturers. The proposed methodology is applied to avionics embedded electronics equipment and the results are compared to field return data. A very good accordance between these predictive reliability data and field data is shown. The limitations of this methodology are also analyzed.

  • Electrodeposited tin properties & their effect on component finish reliability

    Electrodeposited pure tin finishes on electronic components are a leading contender to replace the industry standard tin-lead. Since the electrodeposited finish directly influences the critical reliability characteristics of the component itself, the nature of the Pb-free component finish must be well characterized and understood. Only through a thorough examination of the attributes of the electroplated tin deposit can critical decisions be made regarding component finish reliability. This paper investigates the properties of electrodeposited tin that may have an effect on component reliability, namely, grain structure (size and shape), oxide formation, tin whisker formation, and solderability. Data is presented from laboratory and production settings, with the objective being to enable manufacturers to draw their own conclusions regarding previously established perceptions and misconceptions about electrodeposited tin properties.

  • Electronic Controller-dc Brushless Motor System Simulator For Teaching Purposes

    None

  • Applications for a single cell discharge/recharge test set for battery plant capacity determination

    Recent technical results are described from a study of a single-cell discharge/recharge test of lead acid batteries. The test has been developed to meet the telecommunication industry's need for a means of accurately and efficiently determining if a battery string is still usable past its cells' expected life. The testing procedure and the equipment used are described, results and field experience are discussed, and the benefits of the procedure are outlined.<<ETX>>

  • Application of ferrite chip EMI suppressors to EMS

    This paper describes the application of ferrite chip EMI suppressors to EMS (electromagnetic susceptibility). Based on the test results of a basic logic IC on a printed circuit board (PCB) and actual electronic equipment, we recognizes that ferrite chip EMI suppressors have a characteristics of EMS countermeasure components.

  • E-scrap exportation: challenges and considerations

    This paper describes the widespread exportation of electronic scrap (e-scrap) from the United States for purposes of recycling and the challenges this poses for both manufacturers and consumers of electronic equipment and the recyclers that service their disposition needs. Most industry experts conclude that export markets are critical for bringing new life to viable equipment that becomes obsolete by US. standards. For the purposes of this paper, viable, salable equipment is not included in what is described as e-scrap. E-scrap includes units and components that have only residual scrap value.

  • Case study: Orchestrating RoHS implementation of TI~s E&amp;amp;PS global products

    summary form only given. With the advent of the European Union directive 2002/95/CE, restriction of hazardous substances in January 2003 manufactures of electrical and electronic equipment was faced with technical, administrative and logistical challenges. This case study compiles the lessons learned from the RoHS compliance transition of Texas Instruments' E&amp;PS products (commonly know as the calculator division) into an operational model, which can be used world wide for future product transitions. This presentation covers several phases that comprise this operational model. The initial phase is identification of requirements that require some level of change to the products. As with any legislation, there are various interpretations of the regulation and means of implementation. The challenge is to understand the regulation as it applies to existing business, engineering, manufacturing, and logistical practices. Second, is obtaining the buy-in of affected stakeholders (engineering, sales, logistics, and suppliers). The product stewardship manager and the original analysis team understands the magnitude of changes. The other 99% of the organization must buy-in to the changes. They are the ones who develops and implements the transition plans. Suppliers must be deeply integrated into this process. Third is the development of the transition plan. The entire organization must understand the challenges associated with these changes and establish acceptable and measurable milestones. All levels of the organization's management team must have this transition as part of their key objectives, ensure resources are available, and hold the organization (including suppliers) accountable for meeting the established milestones. The last phase is implementation. This includes transitional monitoring (auditing) as product moves through the logistics organization and distribution to worldwide markets. This operational model provides the organization leadership with a guide to managing the transition of products in a global market, whither driven by regional regulations or customer specific requirements. The number of environmental regulations in the area of hazardous materials, energy efficiency, e-waste, packaging, and recycling is ever increasing. As an environmentally responsible company, the building of green products from the onset, keep products on or close to the leading edge of the green product regulation curve and reduce the need for redesign. Build Green

  • VHDL Model Of High-Speed Single-Port RAM (Synchronous Type)

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Standards related to Electronic equipment

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IEEE Recommended Practice for the Measurement of Radio Frequency Emission from Industrial, Scientific, and Medical (ISM) Equipment Installed on User's Premises

This document describes equipment inspection and radio frequency (rf) electromagnetic field measurement procedures for evaluation of rf industrial, scientific, and medical (ISM) equipment installed in the user's facility. The term, モISM equipment,ヤ as used here, includes equipment that generates rf energy for purposes other than radio communications, to cause physical, chemical, or biological changes; for example, industrial heaters (dielectric and ...


IEEE Standard Methods and Equipment for Measuring the Transmission Characteristics of Pulse-Code Modulation (PCM) Telecommunications Circuits and Systems


Standard for Test Methods and Performance of Low-Voltage (1000 V rms or less, 48-62 Hz) Surge Protective Devices (Secondary Arresters)

This standard applies to surge protective devices designed for application on the low-voltage supply mains (1000 V rms and less, frequency between 48 and 62 Hz) and intended to be connected at locations between, and including, the secondary terminals of the distribution transformer and the line side of the service entrance panel. Such surge protective devices are also known as ...



Jobs related to Electronic equipment

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