Electrochemical machining

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Electrochemical machining (ECM) is a method of removing metal by an electrochemical process. (Wikipedia.org)






Conferences related to Electrochemical machining

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2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting

The joint meeting is intended to provide an international forum for the exchange of information on state of the art research in the area of antennas and propagation, electromagnetic engineering and radio science


2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


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Periodicals related to Electrochemical machining

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Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Biomedical Engineering, IEEE Reviews in

The IEEE Reviews in Biomedical Engineering will review the state-of-the-art and trends in the emerging field of biomedical engineering. This includes scholarly works, ranging from historic and modern development in biomedical engineering to the life sciences and medicine enabled by technologies covered by the various IEEE societies.


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


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Most published Xplore authors for Electrochemical machining

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Xplore Articles related to Electrochemical machining

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Study on house affordability of urban households in China

2009 16th International Conference on Industrial Engineering and Engineering Management, 2009

As theory suggested, urban residents' income should maintain a stable ratio with house price. The recent years, however, the growth of house price is much higher than the growth of income in China, resulting in house affordability problem. This paper, based on China's quarterly time-series data from 1994 to 2006 and applying methods of co-integration test, Granger causality test and ...


Image compression in medical image databases using set redundancy

Proceedings DCC '97. Data Compression Conference, 1997

Summary form only given. Image compression is achieved by eliminating various types of redundancy that exist in the pixel values. Individual gray-scale images contain interpixel, psychovisual, and coding redundancy. However, sets of similar images contain an additional type of redundancy: the set redundancy. Set redundancy is the inter-image redundancy that results from the common information found in more than one ...


Tissue Architecture based on Robotics Manipulation and Functional Artificial Extracellular Matrix

2007 International Symposium on Micro-NanoMechatronics and Human Science, 2007

Ex vivo fabrication of functional tissue composed of cells and extracellular matrix (ECMs) needs precise region-specific positioning of these biological substances. To this end, we utilized two technologies; one is a cell-dispenser robot which enables to place cells at a given position and at a given depth of ECM gel. The other is artificial ECMs which are soluble in aqueous ...


Application of the RIDF's to the Evaluation of Monopulse Errors Under Saturating ECM Enviroments

1991 21st European Microwave Conference, 1991

It is usually supposed that monopulse systems are immune to noise- jamming ECM's because of its internal ellimination of external amplitude and phase modulations. In the paper is proved that this is not true under saturating conditions and an analysis scheme based on the RIDF's (Random Input Describing Functions) is proposed. The main advantage of this method is its numeric ...


EHV line sleet melting

CCECE 2003 - Canadian Conference on Electrical and Computer Engineering. Toward a Caring and Humane Technology (Cat. No.03CH37436), 2003

Techniques which had been employed for melting ice from medium - voltage power transmission lines have been deemed inapplicable to the bundled conductor lines of extra-high-voltage (EHV) systems. Other strategic approaches are being devised and applied instead. The present paper is an exploration of an alternative conductor - loading method which, if successful, should permit EHV lines to ride through ...


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Educational Resources on Electrochemical machining

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IEEE-USA E-Books

  • Study on house affordability of urban households in China

    As theory suggested, urban residents' income should maintain a stable ratio with house price. The recent years, however, the growth of house price is much higher than the growth of income in China, resulting in house affordability problem. This paper, based on China's quarterly time-series data from 1994 to 2006 and applying methods of co-integration test, Granger causality test and error correction model (ECM), makes an empirical analysis of the long-run equilibrium relationship between house price and income. It is shown from the results of the empirical analysis that there is the evidence of long-run equilibrium relationship, meaning that the deviation of these two series could be temporary.

  • Image compression in medical image databases using set redundancy

    Summary form only given. Image compression is achieved by eliminating various types of redundancy that exist in the pixel values. Individual gray-scale images contain interpixel, psychovisual, and coding redundancy. However, sets of similar images contain an additional type of redundancy: the set redundancy. Set redundancy is the inter-image redundancy that results from the common information found in more than one image in the set. Set redundancy can be used to improve compression. Medical imaging is one of the best application areas for the enhanced compression model (ECM) and the set redundancy compression (SRC) methods. Medical images classified by modality and type of exam are very similar to one another, because of the standard procedures used in radiology. Therefore, medical image databases contain large amounts of set redundancy, which the ECM can efficiently reduce. Tests performed on a test database of CT brain scans showed significant compression improvement when the images were pre-processed with SRC methods to reduce set redundancy. The images were obtained from a random population of patients, and the tests were performed with the standard compression techniques used in radiology: Huffman encoding, arithmetic coding, and Lempel-Ziv compression. The best improvement resulted from combining the min-max predictive method with Huffman compression. In our tests we used genetic algorithms to identify the sets of similar images in the image database.

  • Tissue Architecture based on Robotics Manipulation and Functional Artificial Extracellular Matrix

    Ex vivo fabrication of functional tissue composed of cells and extracellular matrix (ECMs) needs precise region-specific positioning of these biological substances. To this end, we utilized two technologies; one is a cell-dispenser robot which enables to place cells at a given position and at a given depth of ECM gel. The other is artificial ECMs which are soluble in aqueous solutions but are gelled upon photochemical crosslinking or thermal phase transition. Using these techniques, endothelial cell aggregates, which are capillary-like network, are formed on and in photocured gelatinous gels. Three prototype models are presented.

  • Application of the RIDF's to the Evaluation of Monopulse Errors Under Saturating ECM Enviroments

    It is usually supposed that monopulse systems are immune to noise- jamming ECM's because of its internal ellimination of external amplitude and phase modulations. In the paper is proved that this is not true under saturating conditions and an analysis scheme based on the RIDF's (Random Input Describing Functions) is proposed. The main advantage of this method is its numeric efficiency which allows subsystem's saturation behaviour be included in dynamic simulators.

  • EHV line sleet melting

    Techniques which had been employed for melting ice from medium - voltage power transmission lines have been deemed inapplicable to the bundled conductor lines of extra-high-voltage (EHV) systems. Other strategic approaches are being devised and applied instead. The present paper is an exploration of an alternative conductor - loading method which, if successful, should permit EHV lines to ride through ice storms without interruption of service.

  • Gas turbine engine fault isolation based fuzzy inference logic with ECM trend plot report

    A fuzzy inference logic system is proposed for gas turbine engine fault isolation. The gas path measurements used for fault isolation are exhaust gas temperature, low and high rotor speed, and fuel flow. The fuzzy inference logic uses rules developed from a model of performance influence coefficients to isolate engine faults while accounting for uncertainty in gas path measurements. Inputs to the fuzzy inference logic system are measurement deviations of gas path parameters which are transferred directly from the ECM (Engine Control Monitoring) program and outputs are engine module faults. The proposed fuzzy inference logic system is tested using simulated data developed from the ECM trend plot reports and the results show that the proposed fuzzy inference logic system isolates module faults with high accuracy rate in the environment of high level of uncertainty.

  • IEEE Trial Use Standard for Electrical Safety Practices in Electrolytic Cell Line Working Zones

    This standard covers means of safeguarding personnel while operating equipment located in electrolytic cell line working zones. Included are related requirements for equipment and electrical conductor installations. The general types of DC electrolytic cells covered include, but are not limited to, the cells used in the production of aluminum, cadmium, chlorate, chlorine, copper, fluorine, hydrogen peroxide, magnesium, sodium, and zinc. This standard does not cover: electroplating and anodizing facilities; AC cells or furnaces; electrothermal process furnaces; arc furnaces; melting or heat treating facilities; Any electrical equipment that is neither part of the electrolytic process equipment nor installed or used in the cell line working zone Items referred to in are not covered by this standard and shall be installed in accordance with NFPA 70-1975, National Electrical Code (ANSI C1-1975), or the latest revision thereof.

  • ECODESIGN Online: the new Internet tool for environmentally conscious product design

    The idea of ECODESIGN Online is to encourage an increasing awareness of sustainable product development and to give concrete support in product design. One can find there a systematic way to evaluate an existing product and come up with target oriented ecodesign improvements options for a specific product. Checklists are available to support the decision making process in product development towards environmentally sound products.

  • Two Years of Experience with the PETRA Control System

    PETRA control system experience after March '79 is reported. We discuss system structure influence on reliability , flexibility , maintainability , and the development of correlated functions , task allocation , and intertask communication. Operational aspects of man-machine communication , man-machine interface as well as interactive language approaches are presented.

  • DOCTOR: An Integrate Software Fault Injection environrnent - an Extended Abstract

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