Conferences related to Elastic recovery

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2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2020 American Control Conference (ACC)

The ACC is the annual conference of the American Automatic Control Council (AACC, the U.S. national member organization of the International Federation for Automatic Control (IFAC)). The ACC is internationally recognized as a premier scientific and engineering conference dedicated to the advancement of control theory and practice. The ACC brings together an international community of researchers and practitioners to discuss the latest findings in automatic control. The 2020 ACC technical program will

  • 2019 American Control Conference (ACC)

    Technical topics include biological systems, vehicle dynamics and control, adaptive control, consensus control, cooperative control, control of communication networks, control of networked systems, control of distributed parameter systems, decentralized control, delay systems, discrete-event systems, fault detection, fault-tolerant systems, flexible structures, flight control, formation flying, fuzzy systems, hybrid systems, system identification, iterative learning control, model predictive control, linear parameter-varying systems, linear matrix inequalities, machine learning, manufacturing systems, robotics, multi-agent systems, neural networks, nonlinear control, observers, optimal control, optimization, path planning, navigation, robust control, sensor fusion, sliding mode control, stochastic systems, switched systems, uncertain systems, game theory.

  • 2018 Annual American Control Conference (ACC)

    Technical topics include biological systems, vehicle dynamics and control, adaptive control, consensus control, cooperative control, control of communication networks, control of networked systems, control of distributed parameter systems, decentralized control, delay systems, discrete-event systems, fault detection, fault-tolerant systems, flexible structures, flight control, formation flying, fuzzy systems, hybrid systems, system identification, iterative learning control, model predictive control, linear parameter-varying systems, linear matrix inequalities, machine learning, manufacturing systems, robotics, multi-agent systems, neural networks, nonlinear control, observers, optimal control, optimization, path planning, navigation, robust control, sensor fusion, sliding mode control, stochastic systems, switched systems, uncertain systems, game theory.

  • 2017 American Control Conference (ACC)

    Technical topics include biological systems, vehicle dynamics and control, adaptive control, consensus control, cooperative control, control of communication networks, control of networked systems, control of distributed parameter systems, decentralized control, delay systems, discrete-event systems, fault detection, fault-tolerant systems, flexible structures, flight control, formation flying, fuzzy systems, hybrid systems, system identification, iterative learning control, model predictive control, linear parameter-varying systems, linear matrix inequalities, machine learning, manufacturing systems, robotics, multi-agent systems, neural networks, nonlinear control, observers, optimal control, optimization, path planning, navigation, robust control, sensor fusion, sliding mode control, stochastic systems, switched systems, uncertain systems, game theory.

  • 2016 American Control Conference (ACC)

    Control systems theory and practice. Conference topics include biological systems, vehicle dynamics and control, consensus control, cooperative control, control of communication networks, control of networked systems, control of distributed parameter systems, decentralized control, delay systems, discrete-event systems, fault detection, fault-tolerant systems, flexible structures, flight control, formation flying, fuzzy systems, hybrid systems, system identification, iterative learning control, model predictive control, linear parameter-varying systems, linear matrix inequalities, machine learning, manufacturing systems, robotics, multi-agent systems, neural networks, nonlinear control, observers, optimal control, optimization, path planning, navigation, robust control, sensor fusion, sliding mode control, stochastic systems, switched systems, uncertain systems, game theory.

  • 2015 American Control Conference (ACC)

    control theory, technology, and practice

  • 2014 American Control Conference - ACC 2014

    All areas of the theory and practice of automatic control, including but not limited to network control systems, model predictive control, systems analysis in biology and medicine, hybrid and switched systems, aerospace systems, power and energy systems and control of nano- and micro-systems.

  • 2013 American Control Conference (ACC)

    Control systems theory and practice. Conference themes on sustainability, societal challenges for control, smart healthcare systems. Conference topics include biological systems, vehicle dynamics and control, consensus control, cooperative control, control of communication networks, control of networked systems, control of distributed parameter systems, decentralized control, delay systems, discrete-event systems, fault detection, fault-tolerant systems, flexible structures, flight control, formation flying, fuzzy systems, hybrid systems, system identification, iterative learning control, model predictive control, linear parameter-varying systems, linear matrix inequalities, machine learning, manufacturing systems, robotics, multi-agent systems, neural networks, nonlinear control, observers, optimal control, optimization, path planning, navigation, robust control, sensor fusion, sliding mode control, stochastic systems, switched systems, uncertain systems, game theory.

  • 2012 American Control Conference - ACC 2012

    All areas of control engineering and science.

  • 2011 American Control Conference - ACC 2011

    ACC provides a forum for bringing industry and academia together to discuss the latest developments in the area of Automatic Control Systems, from new control theories, to the advances in sensors and actuator technologies, and to new applications areas for automation.

  • 2010 American Control Conference - ACC 2010

    Theory and practice of automatic control

  • 2009 American Control Conference - ACC 2009

    The 2009 ACC technical program will cover new developments related to theory, application, and education in control science and engineering. In addition to regular technical sessions the program will also feature interactive and tutorial sessions and preconference workshops.

  • 2008 American Control Conference - ACC 2008

  • 2007 American Control Conference - ACC 2007

  • 2006 American Control Conference - ACC 2006 (Silver Anniversary)

  • 2005 American Control Conference - ACC 2005

  • 2004 American Control Conference - ACC 2004

  • 2003 American Control Conference - ACC 2003

  • 2002 American Control Conference - ACC 2002

  • 2001 American Control Conference - ACC 2001

  • 2000 American Control Conference - ACC 2000

  • 1999 American Control Conference - ACC '99

  • 1998 American Control Conference - ACC '98

  • 1997 American Control Conference - ACC '97

  • 1996 13th Triennial World Congress of the International Federation of Automatic Control (IFAC)


2020 IEEE Haptics Symposium (HAPTICS)

Held since 1992, the IEEE Haptics Symposium (HAPTICS) is a vibrant interdisciplinary forum where psychophysicists, engineers, and designers come together to share advances, spark new collaborations, and envision a future that benefits from rich physical interactions between humans and computers, generated through haptic (force and tactile) devices.

  • 2018 IEEE Haptics Symposium (HAPTICS)

    Held since 1992, the IEEE Haptics Symposium (HAPTICS) is a vibrant interdisciplinary forum where psychophysicists, engineers, and designers come together to share advances, spark new collaborations, and envision a future that benefits from rich physical interactions between humans and computers, generated through haptic (force and tactile) devices.

  • 2016 IEEE Haptics Symposium (HAPTICS)

    Held since 1992, the IEEE Haptics Symposium (HAPTICS) is a vibrant interdisciplinary forum where psychophysicists, engineers, and designers come together to share advances, spark new collaborations, and envision a future that benefits from rich physical interactions between humans and computers, generated through haptic (force and tactile) devices. In 2016, this conference will be held in central Philadelphia, one of the most historic and beautiful cities in North America. HAPTICS 2016 will be a four-day conference with a full day of tutorials and workshops and three days of conference activities including technical paper presentations and hands-on demonstrations.Features:ExhibitsWorkshops and TutorialsHands-on Demonstrations

  • 2014 IEEE Haptics Symposium (HAPTICS)

    This conference brings together researchers in diverse engineering and human science disciplines who are interested in the design, analysis, and evaluation of systems that display haptic (force and touch) information to human operators, and the study of the human systems involved in haptic interacti

  • 2012 IEEE Haptics Symposium (HAPTICS)

    This conference brings together researchers in diverse engineering and human science disciplines who are interested in the design, analysis, and evaluation of systems that display haptic (force and touch) information to human operators, and the study of the human systems involved in haptic interaction.

  • 2010 IEEE Haptics Symposium (Formerly known as Symposium on Haptic Interfaces for Virtual Environment and Teleoperator Systems)

    The Haptics Symposium is a bi-annual, single-track conference that brings together researchers who are advancing the human science, technology and design processes underlying haptic (force and tactile) interaction systems. Our community spans the disciplines of biomechanics, psychology, neurophysiology, engineering, human-computer interaction and computer science.

  • 2008 16th Symposium on Haptic Interfaces for Virtual Environment and Teleoperator Systems (Haptics 2008)

    The Haptics Symposium is an annual, single-track conference that brings together researchers in diverse engineering and human science disciplines who are interested in the design, analysis, and evaluation of systems that display haptic (force and touch) information to human operators.

  • 2006 14th Symposium on Haptic Interfaces for Virtual Environment and Teleoperator Systems


2020 IEEE International Conference on Plasma Science (ICOPS)

IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.


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Periodicals related to Elastic recovery

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Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Communications Letters, IEEE

Covers topics in the scope of IEEE Transactions on Communications but in the form of very brief publication (maximum of 6column lengths, including all diagrams and tables.)


Communications Magazine, IEEE

IEEE Communications Magazine was the number three most-cited journal in telecommunications and the number eighteen cited journal in electrical and electronics engineering in 2004, according to the annual Journal Citation Report (2004 edition) published by the Institute for Scientific Information. Read more at http://www.ieee.org/products/citations.html. This magazine covers all areas of communications such as lightwave telecommunications, high-speed data communications, personal communications ...


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Control Systems Magazine, IEEE

The magazine covers theory, analysis, design (computer-aided design), and practical implementation of circuits, and the application of circuit theoretic techniques to systems and to signal processing. Content is written for the spectrum of activities from basic scientific theory to industrial applications.


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Most published Xplore authors for Elastic recovery

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Xplore Articles related to Elastic recovery

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A Study on Effect of Residual Stress on Crack Growth of Aluminum Plate

2006 International Forum on Strategic Technology, 2006

One technique used to enhance the fatigue strength of a fastener hole is to introduce a compressive residual stress field around the hole. An applied load must overcome this residual stress before the crack can grow, thus leading to a longer fatigue life. The cold expansion of the holes is largely employed to obtain improvement in fatigue performance of structures ...


Control Method of the Spring Back in Bending Micro and Precise Stamping Parts

2009 International Conference on Measuring Technology and Mechatronics Automation, 2009

The nature reason and the decisive factors of the spring back in bending process are studied in this paper. The analysis shows that opposite stress directions in the inner and outer fibers of the sheet material in the bending deformation region essentially contribute to the spring back, and controlling the bending moment created by this different stress directions is the ...


Model of micro-cutting and analysis of micro cutting force

2009 International Conference on Mechatronics and Automation, 2009

The forces acting on the rake and flank face are analyzed in details, through investigating the mechanism of the cutting surface formation according to the characteristics of micro-cutting. The relationship of rounded edge radius and cutting force is presented. The model of micro-cutting is established and the relationship between the cutting forces and the main parameters are obtained. The mechanism ...


Low voltage, high speed RF switch with high switching capacitance ratio

SENSORS, 2005 IEEE, 2005

In this paper the principle, design and fabrication process of low-voltage, high speed RF switch is presented. The aluminium as the electrodes and the PECVD silicon carbide were selected as electrodes and shield materials, respectively. The operating voltage as low as 0.8 volt and high switching capacitance ratio of 180 is reported


Study of the technical performance on the domestic TPS high viscosity modified asphalt

2011 International Conference on Remote Sensing, Environment and Transportation Engineering, 2011

This paper investigates the technical performance of the high viscosity modified asphalt added the domestic TBS high viscosity modifier under different content. Test results indicate that all indexes of the high viscosity asphalt which added 15% domestic TPS are best, through the tests such as penetration test, softening point test, toughness test, tenacity test, 60°C dynamic viscosity test, 135°C rotational ...


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Educational Resources on Elastic recovery

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IEEE.tv Videos

The Fundamentals of Compressive Sensing, Part III: Sparse Signal Recovery
Envelope Tracking and Energy Recovery Concepts for RF Switch-mode Power Amplifiers
EMBC 2011-Course-Virtual Reality and Robotics in Neurorehabilitation-William Zev Rymer
Group on Earth Observations (GEOSS)
Phase Retrieval with Application to Optical Imaging
Christoph Guger: Neuroscience & Brain Panel - The Future of Non-invasive Brain-computer Interfaces - TTM 2018
Magnetics + Mechanics + Nanoscale = Electromagnetics Future - Greg P. Carman: IEEE Magnetics Distinguished Lecture 2016
The Design of Wearable Robots for Lower-Extremity Human Augmentation
Connecting Startups and Industry: How Sections Can Help - Simay Akar - Ignite: Sections Congress 2017
Low-Power and Secure Lightweight Cryptography Via TFET-Based Energy Recovery Circuits: IEEE Rebooting Computing 2017
Compressed Sensing: An Overview
GEOSS Forest Fire Awareness and Assessment
NIKSUN World Wide Security & Mobility Conference 2011 - Michael Chertoff
Reversible Computing as a Path Towards Unbounded Energy Efficiency - Michael Frank - ICRC 2018
PES Scholarship Initiative Plus - Patricia Hoffman Presentation
Lew Tucker, IEEE GLOBECOM'13 Keynote Address - Lew Tucker, CTO, Cisco Systems
Lunar Industrialization: The First Step to the Solar System
A 200um x 200um x 100um, 63nW, 2.4GHz Injectable Fully-Monolithic Wireless BioSensing System: RFIC Industry Showcase 2017
ISEC 2013 Special Gordon Donaldson Session: Remembering Gordon Donaldson - 4 of 7 - MRI at 130 Microtesla
Experience ICRA 2015: Robot Challenges

IEEE-USA E-Books

  • A Study on Effect of Residual Stress on Crack Growth of Aluminum Plate

    One technique used to enhance the fatigue strength of a fastener hole is to introduce a compressive residual stress field around the hole. An applied load must overcome this residual stress before the crack can grow, thus leading to a longer fatigue life. The cold expansion of the holes is largely employed to obtain improvement in fatigue performance of structures with initially uncracked holes. In this research, considered is a fatigue crack growth from a hole under the influence of residual stress. The entire cold working processing- including hole expansion, elastic recovery, and finish reaming of two aluminum alloys 2024-T351 and 7075-T6 is simulated. This method of fatigue life prediction is compared with a superposition technique and experimental data. The crack closure level is computed from a finite element simulation and a fatigue life is predicted. The conclusions obtained here are beneficial to the understanding of the phenomenon of fatigue crack initiation and growth at the perimeter of cold worked holes.

  • Control Method of the Spring Back in Bending Micro and Precise Stamping Parts

    The nature reason and the decisive factors of the spring back in bending process are studied in this paper. The analysis shows that opposite stress directions in the inner and outer fibers of the sheet material in the bending deformation region essentially contribute to the spring back, and controlling the bending moment created by this different stress directions is the essential method to control the spring back in bending process. The stress state in inner and outer fibers of the sheet material when the coining process is applied in the bending process is analyzed and compared with that when the coining process is not applied. Both the inner and outer fibers of the sheet material in bending process are subjected to the tensile stress after applying the coining process and the bending moment of the sheet is decreased greatly. By selecting reasonable coining depth and width, the coining process is applied to control the spring back in bending some micro and precision stamping part. The production result shows that the coining controlling method of the spring back has mighty high precision, simple mechanism structure, and is suitable very much for controlling the spring back in bending micro and precision stamping parts.

  • Model of micro-cutting and analysis of micro cutting force

    The forces acting on the rake and flank face are analyzed in details, through investigating the mechanism of the cutting surface formation according to the characteristics of micro-cutting. The relationship of rounded edge radius and cutting force is presented. The model of micro-cutting is established and the relationship between the cutting forces and the main parameters are obtained. The mechanism of microcutting is exploded theoretically, which is significant in cutting tools material choosing and cutting tools edge improving.

  • Low voltage, high speed RF switch with high switching capacitance ratio

    In this paper the principle, design and fabrication process of low-voltage, high speed RF switch is presented. The aluminium as the electrodes and the PECVD silicon carbide were selected as electrodes and shield materials, respectively. The operating voltage as low as 0.8 volt and high switching capacitance ratio of 180 is reported

  • Study of the technical performance on the domestic TPS high viscosity modified asphalt

    This paper investigates the technical performance of the high viscosity modified asphalt added the domestic TBS high viscosity modifier under different content. Test results indicate that all indexes of the high viscosity asphalt which added 15% domestic TPS are best, through the tests such as penetration test, softening point test, toughness test, tenacity test, 60°C dynamic viscosity test, 135°C rotational viscosity, elastic recovery test. The author also takes a series of tests such as binder drainage test, Cantanbro stripping test, wheel tracking test, the flexural bending beam test and moisture susceptibility test on the porous asphalt mixture which added 15% domestic TPS, test results indicate that the modified asphalt has perfect characters such as high temperature stability, low temperature crack resistance, moisture damage, anti-caking.

  • Numerical simulation of cold rolling involute spline forming

    Using explicit central difference algorithm, the numerical simulation of cold rolling involute spline is accomplished by finite element method. The metal flowing law and the stress and strain field of involute spline are presented. Comparing and contrasting simulation results with experimental results, some conclusions can be obtained as follow. Metal flowing accords to minimal damp law in the process of cold rolling. To improve formation precision, the dentiform errors of spline caused by elastic deformation should be corrected. And the correcting method is presented in this paper by enlarging the outer diameter of workpiece designed with the experiential method. It is helpful for improving cold rolling system design and studying ulteriorly the forming mechanism of cold rolling involute spline in quantitative analysis.

  • RWER TCP Throughput Enhancement-Based on a GE-PON System

    Many diverse high bandwidth consumers of different quality of service (QoS) requirements can currently be well supported by the last mile candidate—gigabit Ethernet passive optical network (GE-PON) system. Through modeling the performance of TCP over GE-PON in terms of fairness among multiple optical network units (ONUs) and multiple transmission protocols, the results indicate that TCP flows will suffer from restraining windows when competing with other TCP or other protocol flows, such as UDP protocol flows. Therefore, this paper proposes an adaptable approach to promote the throughput of restraining TCP flows to achieve TCP fairness. This paper focuses on the potential benefits of such a recovery modification process for TCP flows. TCP flows are always considered as the low -priority services and suffer from best-effort delivery. The comparison in both experiments and simulations shows that restraining window elastic recovery (RWER) can improve inter-protocol fairness and achieve the TCP throughput enhancement.

  • Process Design and Elastic Performance Study of Semi-molding Jacquard Female High Elastic Skirt Waist

    Through researching three different factors and levels of weave structure design, weft arrangement, spandex backed float on the impact of elastic shrinkage of high elastic female skirt waist, establishing orthogonal test design, making results analyses, and the optimal design scheme of high elastic female skirt waist is got. It provides certain theoretical basis for the further development of the semi-molding jacquard high elastic female skirt waist products.

  • Damage and fracture prediction during L-bending processes

    Sheet metal bending processes is one of the most frequently used manufacturing operations in industry. The development and optimization of bending processes is connected with time consuming and costly experiments. Therefore, the finite clement simulation of the process could be a helpful tool for the designer and quality assurance of the products. The mechanical quality of a part produced by bending is determined by the material properties variation in the domain of the bending arc such as the hardening and damage states as a result of the increase in strain toward the inner and outer surfaces in the bending arc. The accuracy of the damage contour into the sheet is directly related to accuracy of the damage law modeling. After bending, springback occurs upon the removal of the tool. The amount of the elastic recovery depends on the stress level and the modulus of elasticity E of the material. The variations in mechanical sheet properties and sheet thickness after bending present problems as regards the calculation of the required punch displacement and the springback prediction of the bent part. As a result, bend angles arc often not accurate enough to meet today's high tolerance requirements. In order to improve the accuracy of the air bending process, the material properties variation during and after bending must be predicted especially the damage contour within the sheet. The paper describes a finite element model for L-bending process allowing for the prediction of the elastic springback.

  • The fine pitch direct bonding technology for chip interconnection

    We have developed new direct bonding technology using anisotropic conductive film (ACF) connections between two chips. We applied this bonding technology in ultra fine pitch interconnections at 40 /spl mu/m between an LED array and a driver IC, and realized a minimized LED print head. The key point of direct bonding technology is assurance of connection reliability which can be improved by two important factors. One is the elastic recovery quantity of conductive particles between the connection electrodes, and the other is the adhesive strength of the chip bonding area. As a result of analysis with particular attention paid to these factors, we found two further features: (1) an elastic recovery quantity usually obtained by using soft conductive particles which was included in ACF, in the case of electrodes with variable form and hardness; (2) adhesive strength increased when accompanied with a rise in the curing temperature. We tested this technology by interconnection of 192 connection pads lined in 40 /spl mu/m pitch, and achieved good bonding reliability in temperature and relative humidity cycling tests. This new bonding technology is effective in ultra-fine pitch direct bonding, so that this technology can be widely applied to various types of device chip. In this paper, the details of the technology and the connection reliability are reported.



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