Conferences related to Diffusion bonding

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2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting

The joint meeting is intended to provide an international forum for the exchange of information on state of the art research in the area of antennas and propagation, electromagnetic engineering and radio science


2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.


2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE International Conference on Plasma Science (ICOPS)

IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.


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Periodicals related to Diffusion bonding

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


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Most published Xplore authors for Diffusion bonding

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Xplore Articles related to Diffusion bonding

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Dynamic NBTI characteristics of p-MOSFET with N-plasma SiON Gate Dielectric

2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings, 2006

In this paper, the dynamic negative bias temperature instability (DNBTI) characteristics of p-MOSFET with N-plasma SiON dielectric are studied. Under dynamic stress, the nearly consistent frequency dependent characteristics of threshold voltage shift (DeltaV<sub>th</sub>) and interface trap density (DeltaN<sub>it</sub>) were observed. The results show that the degradation and recovery of DNBTI are still dominated by the generation and passivation of the ...


An E-band slotted waveguide monopulse array antenna with corporate-feed using diffusion bonding of laminated plates

2016 International Symposium on Antennas and Propagation (ISAP), 2016

In this paper, we demonstrate an E-band plate-laminated 16 × 16-element slotted waveguide monopulse array antenna with corporate-feed using the diffusion bonding technology. The proposed antenna architecture combines radiating elements, a corporate-feed circuit and a comparator, which are vertically interconnected to achieve a compact size and a reduced loss. The design, characterization, and experimental results are presented.


An experiment research on transient liquid phase diffusion bonding

2016 IEEE International Vacuum Electronics Conference (IVEC), 2016

This paper experiments transient-liquid-phase (TLP) diffusion bonding to weld oxygen-free copper to oxygen-free copper in high-frequency parts. Our experiment results indicate that TLP bonding using an Au interlayer performs better than solid diffusion welding. In our TLP bonding, the welding temperature is set around the one near the formation of transient liquid phase. The diffusion-width increases with holding time. Our ...


Kinetics of splitting in the Smart-Cut/sup R/ process

1998 IEEE International SOI Conference Proceedings (Cat No.98CH36199), 1998

The Smart-Cut/sup R/ process is based on proton implantation and wafer bonding (Bruel, Electron. Lett. vol. 31, no. 14, pp. 1201-2, 1995). Proton implantation enables delamination of a thin layer from a thick substrate to be achieved, whereas the wafer bonding technique enables different multilayer structures to be achieved by transferring the delaminated layer to a second substrate. One of ...


Atom diffusion mechanism of thermo-sonic flip chip bonding interface

2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007, 2007

The TSFC (thermosonic flip chip) bonding was realized in a self-structured TSFC bonder. The atom inter-diffusion on Au-Ag bonding interface was characterized by TEM, and high-resolution TEM pictures reveales that the dislocation density in the bump increases after the acting of ultrasonic. And the interlaced dislocation slip lines were observed in the SEM pictures of bumps surface, which indicates the ...


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Educational Resources on Diffusion bonding

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IEEE-USA E-Books

  • Dynamic NBTI characteristics of p-MOSFET with N-plasma SiON Gate Dielectric

    In this paper, the dynamic negative bias temperature instability (DNBTI) characteristics of p-MOSFET with N-plasma SiON dielectric are studied. Under dynamic stress, the nearly consistent frequency dependent characteristics of threshold voltage shift (DeltaV<sub>th</sub>) and interface trap density (DeltaN<sub>it</sub>) were observed. The results show that the degradation and recovery of DNBTI are still dominated by the generation and passivation of the interfacial traps associated with Si-H bond breaking and released H species diffusion during stress phase and back diffusion of H and repassivation of broken equivSi bonds during passivation phase, which could be depicted by the so-called reaction-diffusion (R-D) model. Meanwhile, the reduced passivation effect with increased stress time was observed, which suggests that the generation and passivation of N<sub>it</sub> seems to present a fatigue effect. These observed DNBTI characteristics may relate to the nitrogen trapping effect on the diffusion of H species in SiON dielectric layer

  • An E-band slotted waveguide monopulse array antenna with corporate-feed using diffusion bonding of laminated plates

    In this paper, we demonstrate an E-band plate-laminated 16 × 16-element slotted waveguide monopulse array antenna with corporate-feed using the diffusion bonding technology. The proposed antenna architecture combines radiating elements, a corporate-feed circuit and a comparator, which are vertically interconnected to achieve a compact size and a reduced loss. The design, characterization, and experimental results are presented.

  • An experiment research on transient liquid phase diffusion bonding

    This paper experiments transient-liquid-phase (TLP) diffusion bonding to weld oxygen-free copper to oxygen-free copper in high-frequency parts. Our experiment results indicate that TLP bonding using an Au interlayer performs better than solid diffusion welding. In our TLP bonding, the welding temperature is set around the one near the formation of transient liquid phase. The diffusion-width increases with holding time. Our TLP bonding can also be used in Cu-Au diffusion bonding directly.

  • Kinetics of splitting in the Smart-Cut/sup R/ process

    The Smart-Cut/sup R/ process is based on proton implantation and wafer bonding (Bruel, Electron. Lett. vol. 31, no. 14, pp. 1201-2, 1995). Proton implantation enables delamination of a thin layer from a thick substrate to be achieved, whereas the wafer bonding technique enables different multilayer structures to be achieved by transferring the delaminated layer to a second substrate. One of the best known current applications of Smart Cut/sup R/ is the silicon on insulator structure. The Smart-Cut process is suitable for different kinds of applications and the principle of this process can be applied to various materials (Si, SiC, GaAs, etc.) (Bruel, 1995; Di Cioccio et al. ibid, vol. 32, no. 12, pp. 1144-5, 1996; Jalaguier et al. ibid, vol. 34, no. 4, pp. 408-9, 1998). In this paper, the physical mechanisms involved in the delamination process are discussed based on the study of activation energies necessary to obtain splitting.

  • Atom diffusion mechanism of thermo-sonic flip chip bonding interface

    The TSFC (thermosonic flip chip) bonding was realized in a self-structured TSFC bonder. The atom inter-diffusion on Au-Ag bonding interface was characterized by TEM, and high-resolution TEM pictures reveales that the dislocation density in the bump increases after the acting of ultrasonic. And the interlaced dislocation slip lines were observed in the SEM pictures of bumps surface, which indicates the dislocations motion in the interior of bumps. A FEM model was used to simulate the stress on the bonding interface. It is noticed that the ultrasonic vibration causes high stress in the contact interface of bump and pad, which increases the dislocation density and provides short-circuit diffusion channel for Au and Ag atom inter-diffusion. Finally, a preliminary discussion about the atom diffusion, based on the atom diffusion theory, is also presented. Studies show that the stress is a significant component of atom diffusion driving force. The Gibbs free energy, chemical potential and acting force of Au and Ag atom on bonding interface are increased by the stress gradient. With the driving force caused by stress, the probability for atom to overcome the energy barrier increased, and the diffusion speed increased. And the atom diffusion depth on bonding interface is about 200-500 nm in several hundred milliseconds, which forms good bonding strength.

  • Transient liquid phase (TLP) bonding for microsystem packaging applications

    This paper explores the use of transient liquid phase bonding for microsystem packaging applications. Two types of bonds are demonstrated: a thin-film evaporated indium-gold bond and an electroplated nickel-tin bond. Both bonds are formed at 300/spl deg/C for about 1.5 hours in a conventional wafer bonder. The wafers were heated to over 400 /spl deg/C for more than an hour after bonding without any signs of bond degradation. The indium-gold bond demonstrated good electrical contact, but poor permeability performance. However, the nickel-tin bond was void free and sealed cavities with bond ring widths as little as 50 /spl mu/m. The cross section of the nickel-tin TLP bond was analyzed with EDAX software to verify the formation of intermetallic compounds.

  • Diffusion bonded Yb-YAG rectangular waveguide laser

    Summary form only given. We report laser performance of an end pumped 100 /spl mu/m Yb:YAG rectangular waveguide. This configuration offers an excellent confinement of the pump field achieved by waveguiding of the slow axis of the diode pump and nonguiding of the fast axis.

  • Effect of the interdiffusion reaction on the compatibility in PZT/PNN functionally gradient piezoelectric materials

    The interfacial diffusion reaction Pb(Ni/sub 1/3/Nb/sub 2/3/)O/sub 3/ (PNN) and Pb(Zr,Ti)O/sub 3/ in functionally gradient materials (FGM) has been investigated as a function of sintering temperature and time, respectively. The compositional distribution profiles of the interaction region were examined by electron probe microbeam analysis (EPMA). According to the diffusion model, the concentration distribution profiles were simulated by way of numerical approaches. The diffusivity and activation energy for Ni/sup 2+/, Nb/sup 5+/, Ti/sup 4+/ and Zr/sup 4+/ ions have been estimated. The results were discussed.

  • The Titanium Vacuum Chamber for the Zero Gradient Synchrotron

    An all metal, titanium alloy inner vacuum chamber has been built for the Zero Gradient Synchrotron (ZGS). This chamber has high radiation resistance, high mechanical strength, and provides mountings for pole face windings. The upper and lower surfaces of the chamber consist of 0.012" titanium skins which span the 32" aperture along the 54' length of the octant. These skins are reinforced with radial T-shaped ribs 3/8" high to withstand the design loading of 30 torr. The 20 miles of titanium ribs are diffusion bonded to the skins to provide high strength joints without welding. Eddy-current problems are minimized by using an alloy of high electrical resistivity. Pole face windings mounted in holes in the ribs will be used to correct the effects of the residual eddy currents. Many of the new techniques that were developed for aerospace applications were used to produce and test this chamber. These techniques and the results of the tests will be discussed.

  • Fabrication of a slotted waveguide array at 94GHz by diffusion bonding of laminated thin plates

    We fabricate the single-layer slotted waveguide array antenna in 94 GHz band by diffusion bonding. According to the processing conditions, the thickness of slotted plate and that of coupling windows are increased to 0.3 mm and 1.0 mm, respectively. All these effects of large thickness are precisely evaluated and taken into account during the antenna design. The radiating characteristics of resonant slots are not degenerated much. On the other hand, the frequency characteristics of power dividing and reflection become narrow-band because non-resonant coupling windows are applied in the feed circuit. The designed 18-by-18 elements antenna is trial fabricated by diffusion bonding of laminated thin plates using copper. The antenna efficiency is achieved at 60% for 31.4dBi gain at 93.7 GHz in this copper antenna. The material of stainless will provide us with stable process in the tradeoff of large conductor loss. However, the low loss material of copper is indispensable in antenna fabrication. The process of diffusion bonding using copper could result in the misalignment of the thin metal plates, which degrades the aperture efficiency. As the future work, further fabrication is planned to be carried out to enhance the aperture efficiency as well as the antenna efficiency.



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