Conferences related to Dielectric losses

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2020 Joint Conference of the IEEE International Frequency Control Symposium and International Symposium on Applications of Ferroelectrics (IFCS-ISAF)

Ferroelectric materials and applications


2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE International Conference on Plasma Science (ICOPS)

IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.


2020 IEEE 21st International Conference on Vacuum Electronics (IVEC)

Technical presentations will range from the fundamental physics of electron emission and modulated electron beams to the design and operation of devices at UHF to THz frequencies, theory and computational tool development, active and passive components, systems, and supporting technologies.System developers will find that IVEC provides a unique snapshot of the current state-of-the-art in vacuum electron devices. These devices continue to provide unmatched power and performance for advanced electromagnetic systems, particularly in the challenging frequency regimes of millimeter-wave and THz electronics.Plenary talks will provide insights into the history, the broad spectrum of fundamental physics, the scientific issues, and the technological applications driving the current directions in vacuum electronics research.



Periodicals related to Dielectric losses

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.



Most published Xplore authors for Dielectric losses

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Xplore Articles related to Dielectric losses

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Polyarylsulfones as electrical insulation

1977 EIC 13th Electrical/Electronics Insulation Conference, 1977

The polyarylsulfones are a unique class among thermoplastic dielectric materials in that their electrical and mechanical properties are very stable over the temperature range −100°C to over 150°C and even after extended periods at the maximum temperature. Continuous use at 150°C is UL rated for polysulfone and 180°C is reasonable for polyphenyl-sulfone. Data is presented to show the effects of ...


N Umerical Modeling Of Harn40nic Auto-resonance Peniotron (HARP)

IEEE Conference Record - Abstracts. 1991 IEEE International Conference on Plasma Science, 1991

None


Uniqueness of complex permittivity reconstruction in a parallel-plane waveguide

Radio Science, 2007

The paper presents a statement and a proof of uniqueness of solution to the inverse problem of determination of permittivity of a lossy dielectric inclusion in a parallel-plane waveguide from the reflection and transmission characteristics. The approach is based on the analysis of asymptotic representations of a solution to the direct problem of diffraction of a transverse electric wave and ...


Stratospheric Ozone Conservation By Electron Attachment

IEEE Conference Record - Abstracts. 1991 IEEE International Conference on Plasma Science, 1991

None


Losses in transformers

Proceedings of the American Institute of Electrical Engineers, 1913

It is proposed in the paper to divide transformer losses into no-load and load losses, the former including core and dielectric losses, and the latter resistance and stray losses. The magnitude of the stray loss is shown in a large number of commercial transformers and in a few experimental machines. The relation between the impedance watts and the load losses ...



Educational Resources on Dielectric losses

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IEEE-USA E-Books

  • Polyarylsulfones as electrical insulation

    The polyarylsulfones are a unique class among thermoplastic dielectric materials in that their electrical and mechanical properties are very stable over the temperature range −100°C to over 150°C and even after extended periods at the maximum temperature. Continuous use at 150°C is UL rated for polysulfone and 180°C is reasonable for polyphenyl-sulfone. Data is presented to show the effects of time and temperature upon the dielectric strength, dielectric loss, and mechanical properties of these polyarylsulf ones. The frequency and temperature dispersions of dielectric properties are presented. The high oxidation state of the normal polymer is suggested as an explanation of very great resistance to failure by electrical treeing and for the good flammability ratings.

  • N Umerical Modeling Of Harn40nic Auto-resonance Peniotron (HARP)

    None

  • Uniqueness of complex permittivity reconstruction in a parallel-plane waveguide

    The paper presents a statement and a proof of uniqueness of solution to the inverse problem of determination of permittivity of a lossy dielectric inclusion in a parallel-plane waveguide from the reflection and transmission characteristics. The approach is based on the analysis of asymptotic representations of a solution to the direct problem of diffraction of a transverse electric wave and employs a generalization of the notion of partial far-field patterns applied for a guide.

  • Stratospheric Ozone Conservation By Electron Attachment

    None

  • Losses in transformers

    It is proposed in the paper to divide transformer losses into no-load and load losses, the former including core and dielectric losses, and the latter resistance and stray losses. The magnitude of the stray loss is shown in a large number of commercial transformers and in a few experimental machines. The relation between the impedance watts and the load losses is discussed, and the conclusion reached that they are practically equal. Results of tests are given, showing the magnitude of the dielectric losses in high-voltage transformers. It is recommended that Sections 156 to 159 of the Standardization Rules be amended to define transformer losses as no-load losses, including core and dielectric losses, and load losses, including resistance and stray losses. It is further recommended that all losses be measured at the operating temperature.

  • Temperature Rise of Submarine Cable on Riser Poles

    None

  • The TAD integrated crosspoint array

    A 5 × 9 telephone crosspoint array with DIP packaging will be described. Cost, control, space, insertion loss, isolation, power consumption and comparative reliability advantages will be assessed.

  • Superconductive resonant circuits

    None

  • A new ultra-low impedance transmission line

    None

  • Boundary elements method computations of 3D transient scattering from lossy dielectric objects

    None



Standards related to Dielectric losses

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IEEE Recommended Practice for Determining the Peak Spatial-Average Specific Absorption Rate (SAR) in the Human Head from Wireless Communications Devices: Measurement Techniques

To specify protocols for the measurement of the peak spatial-average specific absorption rate (SAR) in a simplified model of the head of users of hand-held radio transceivers used for personal wireless communications services and intended to be operated while held next to the ear. It applies to contemporary and future devices with the same or similar operational characteristics as contemporary ...


IEEE Recommended Practice for Measurements and Computations of Radio Frequency Electromagnetic Fields With Respect to Human Exposure to Such Fields, 100 kHz-300 GHz

Revise and develop specifications for preferred methods for measuring and computing external radiofrequency electromagnetic fields to which persons may be exposed. In addition, the document will specify preferred methods for the measurement and computation of the resulting fields and currents that are induced in bodies of humans exposed to these fields over the frequency range of 100 kHz to 300 ...


IEEE Standard for Metal-Enclosed Bus

This standard covers assemblies of metal-enclosed conductors along with associated interconnections, enclosures, and supporting structures. When switches and disconnecting links are included, they shall conform to this standard. This standard is concerned with performance characteristics of enclosed, rather than open, indoor and outdoor conductor assemblies with rated maximum operating voltages through 38 kV. While this standard does cover 600 volt ...


Recommended Practice for Measurements and Computation of Electric, Magnetic and Electromagnetic Fields With Respect to Human Exposure to Such Fields, 0 - 100 kHz

This recommended practice describes 1) methods for measuring external electric and magnetic fields and contact currents to which persons may be exposed, 2) instrument characteristics and the methods for calibrating such instruments, and 3) methods for computation and the measurement of the resulting fields and currents that are induced in bodies of humans exposed to these fields. This recommended practice ...


Standard Test Code for Liquid-Immersed Distribution, Power, and Regulating Transformers

This standard describes methods for performing tests specified in IEEE Std C57.12.00TM and other standards applicable to liquid-immersed distribution, power, and regulating transformers. It is intended for use as a basis for performance and proper testing of such transformers. This standard applies to all liquid-immersed transformers, except instrument transformers, step-voltage and induction voltage regulators, arc furnace transformers, rectifier transformers, specialty ...