Conferences related to Design for quality

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2023 Annual International Conference of the IEEE Engineering in Medicine & Biology Conference (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted full papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions,will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.


2021 IEEE Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2020 IEEE 16th International Workshop on Advanced Motion Control (AMC)

AMC2020 is the 16th in a series of biennial international workshops on Advanced Motion Control which aims to bring together researchers from both academia and industry and to promote omnipresent motion control technologies and applications.


2020 IEEE Frontiers in Education Conference (FIE)

The Frontiers in Education (FIE) Conference is a major international conference focusing on educational innovations and research in engineering and computing education. FIE 2019 continues a long tradition of disseminating results in engineering and computing education. It is an ideal forum for sharing ideas, learning about developments and interacting with colleagues inthese fields.


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Periodicals related to Design for quality

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Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Audio, Speech, and Language Processing, IEEE Transactions on

Speech analysis, synthesis, coding speech recognition, speaker recognition, language modeling, speech production and perception, speech enhancement. In audio, transducers, room acoustics, active sound control, human audition, analysis/synthesis/coding of music, and consumer audio. (8) (IEEE Guide for Authors) The scope for the proposed transactions includes SPEECH PROCESSING - Transmission and storage of Speech signals; speech coding; speech enhancement and noise reduction; ...


Automation Science and Engineering, IEEE Transactions on

The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


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Most published Xplore authors for Design for quality

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Xplore Articles related to Design for quality

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From design for test to concurrent engineering

IEEE Conference on Systems Readiness Technology, 'Advancing Mission Accomplishment'., 1990

It is argued that design for testability will not be enough by itself in the 1990s and that the entire design philosophy must change from a serial approach to a parallel one of concurrent engineering. An outline of previous approaches is presented, exploring what has and has not worked and what is still not working. The author identifies the fundamental ...


Recent developments in N/sub 2/O- and NO-based oxynitride dielectrics for cmos ulsi applications

International Electron Devices and Materials Symposium, 1994

This paper reviews recent developments in N/sub 2/O- and NO based oxynitride gate dielectrics for CMOS ULSI applications. These dielectrics are extremely attractive due to their process simplicity, thickness controllability, excellent reliability and hot-carrier immunity. In this paper, several issues like growth kinetics, chemical composition, electrical properties and hot- carrier immunity of these dielectrics are discussed. EEPROM applications and thickness ...


Electrical properties of thin SiO2 films nitrided in N2O by rapid thermal processing

ESSDERC '92: 22nd European Solid State Device Research conference, 1992

Charge trapping and dielectric wear-out properties of 8 and 30 nm SiO2 layers nitrided in the N2O gas using a Rapid Thermal System are evaluated injecting charge at either low (by avalanche technique) or high (by Fowler-Nordheim technique) electric fields. In the experimental conditions studied, the results have pointed out that, compared to a standard silicon dioxide layer, a SiO2 ...


Evaluation of the radiation integral in terms of end-point contributions

IEEE Transactions on Antennas and Propagation, 1975

Evaluation of the Kirchhoff integral which arises in the far-field computation of radiation from large aperture antennas frequently causes computational difficulty. This communication illustrates the utility of evaluating the integral in terms of end-point contributions. The special case of a pyramidal horn-reflector antenna is considered.


Investigation of gate oxide quality as a function of downstream plasma exposure during flash memory fabrication

2003 8th International Symposium Plasma- and Process-Induced Damage., 2003

Gate oxide is the most critical oxidation step in the flash memory fabrication sequence. Surfaces free of contaminants are required to grow high quality gate oxides. A correlation between oxide quality and resist removal techniques has been highlighted at the R8 STMicroelectronics production fab, comparing Axcelis FusionGemini ES asher results with those of full wet techniques.


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Educational Resources on Design for quality

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IEEE-USA E-Books

  • From design for test to concurrent engineering

    It is argued that design for testability will not be enough by itself in the 1990s and that the entire design philosophy must change from a serial approach to a parallel one of concurrent engineering. An outline of previous approaches is presented, exploring what has and has not worked and what is still not working. The author identifies the fundamental changes that must occur in systems engineering and the impact that design for testability, design for quality, design for manufacturability, and design for serviceability will have on the acceptance by the services of new systems designs. The concurrent engineering environment and some of the computer-aided engineering tools needed to successfully implement it are described. Some examples of the impact concurrent engineering on development times, production costs, and overall life-cycle costs are examined.<<ETX>>

  • Recent developments in N/sub 2/O- and NO-based oxynitride dielectrics for cmos ulsi applications

    This paper reviews recent developments in N/sub 2/O- and NO based oxynitride gate dielectrics for CMOS ULSI applications. These dielectrics are extremely attractive due to their process simplicity, thickness controllability, excellent reliability and hot-carrier immunity. In this paper, several issues like growth kinetics, chemical composition, electrical properties and hot- carrier immunity of these dielectrics are discussed. EEPROM applications and thickness scaling issues related to these dielectrics are also discussed.

  • Electrical properties of thin SiO2 films nitrided in N2O by rapid thermal processing

    Charge trapping and dielectric wear-out properties of 8 and 30 nm SiO2 layers nitrided in the N2O gas using a Rapid Thermal System are evaluated injecting charge at either low (by avalanche technique) or high (by Fowler-Nordheim technique) electric fields. In the experimental conditions studied, the results have pointed out that, compared to a standard silicon dioxide layer, a SiO2 film nitrided in the N2O gas exhibits a reduced electron/hole trapping efficiency and, independently of the injection polarity, an improved charge- to-breakdown (QBD) characteristics.

  • Evaluation of the radiation integral in terms of end-point contributions

    Evaluation of the Kirchhoff integral which arises in the far-field computation of radiation from large aperture antennas frequently causes computational difficulty. This communication illustrates the utility of evaluating the integral in terms of end-point contributions. The special case of a pyramidal horn-reflector antenna is considered.

  • Investigation of gate oxide quality as a function of downstream plasma exposure during flash memory fabrication

    Gate oxide is the most critical oxidation step in the flash memory fabrication sequence. Surfaces free of contaminants are required to grow high quality gate oxides. A correlation between oxide quality and resist removal techniques has been highlighted at the R8 STMicroelectronics production fab, comparing Axcelis FusionGemini ES asher results with those of full wet techniques.

  • 33 nm ultra-shallow junction technology by oxygen-free and point-defect reduction process

    This paper investigates the effect of I/I point-defect and the impact of surface-oxide during RTA, and proposes a novel junction formation process for realizing ultra-shallow junctions. In this technology, SD-extensions are fabricated using 0.5 keV ultra-low energy single-B I/I without gate-sidewall spacers nor screen-oxide, followed by high temperature (1000/spl deg/C) RTA in pure-N/sub 2/ ambient without cover-oxide. These conditions realize shallow extensions (33 nm) with low sheet-resistance (660 /spl Omega//sq) and low off- current for PMOS-FETs. Ge pre-amorphization (5 keV) technology is applied to the deep-SD fabrication by 2 keV B implantation. This Ge pre-amorphization technique decreases the point-defects caused by the deep-SD implantation; resulting in the reduction of transient enhanced diffusion of SD-extension regions. These conditions for both the SD-extensions and deep-SDs are essential to achieve deep sub-quarter micron MOS-FETs by implantation technology.

  • Critical area extraction of extra material soft faults

    A method of extracting the extra material critical area of soft faults from an integrated circuit layout is presented. This has been implemented in the EYE tool allowing efficient extraction of the critical area from arbitrary mask layout. Results comparing defect sensitivity of a routing network modified to reduce defect sensitivity are reported. The application to defect related reliability is explored.

  • Quality of Gate Oxides Grown on State of the Art Simox and Zmr Soi Substrates

    None

  • Accelerating the engineering to manufacturing transition

    With today's ever increasing pressures for bringing new products to market in ever shorter periods of time, companies may neglect to consider some of the key product design attributes-often called the "-ilities"-that affect the manufacturing process. When this happens, time to market is often extended because of the need for product redesign in order to improve manufacturing yields and quality or to lower product costs. One of the ways to reduce the number of product design iterations, or post-prototype engineering changes, is to design both the product and the manufacturing processes simultaneously. This requires involving all of the organization's pertinent engineering disciplines, in addition to marketing and support functions, right from the start of the project. This type of team development activity is usually referred to as concurrent engineering (CE) or integrated product development (IPD).<<ETX>>

  • Quality by Design

    None



Standards related to Design for quality

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No standards are currently tagged "Design for quality"