Conferences related to Curing

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2023 Annual International Conference of the IEEE Engineering in Medicine & Biology Conference (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted full papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions,will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.


2021 IEEE Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


GLOBECOM 2020 - 2020 IEEE Global Communications Conference

IEEE Global Communications Conference (GLOBECOM) is one of the IEEE Communications Society’s two flagship conferences dedicated to driving innovation in nearly every aspect of communications. Each year, more than 2,900 scientific researchers and their management submit proposals for program sessions to be held at the annual conference. After extensive peer review, the best of the proposals are selected for the conference program, which includes technical papers, tutorials, workshops and industry sessions designed specifically to advance technologies, systems and infrastructure that are continuing to reshape the world and provide all users with access to an unprecedented spectrum of high-speed, seamless and cost-effective global telecommunications services.


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Periodicals related to Curing

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


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Most published Xplore authors for Curing

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Xplore Articles related to Curing

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An Acoustic Temperature Sensor to Monitor Variable Frequency Microwave Curing of Polymer Dielectrics

SENSORS, 2007 IEEE, 2007

While conventional thermal curing can take several hours, variable frequency microwave (VFM) curing can perform the same steps in minutes, without compromising intrinsic material properties. VFM processing is a viable alternative to conventional thermal techniques because of advantages like rapid heating selective heating of materials, and the capability to process metals. However, current limitations include uncertain process characterization methods and ...


Plasma resistance and behavior of polybenzoxazine polymer

Digest of Papers Microprocesses and Nanotechnology 2003. 2003 International Microprocesses and Nanotechnology Conference, 2003

The structure of B-a type polybenzoxazine(PBZZ) is similar to phenolic resin through thermal self-curing of the heterocyclic ring opening reaction that neither requires catalyst nor releases any condensation byproduct. These PBZZ resins are found to possess several outstanding properties such as near no shrinkage after curing, high thermal stability and low water absorption. Furthermore, the PBZZ has high glass transition ...


Development of low-loss mica paper insulating materials for rotating apparatus

1979 EIC 14th Electrical/Electronics Insulation Conference, 1979

Some techniques used in the development of insulation materials for form-wound coils are described. A method of determining compatibility of various bonding and impregnating resins for mica paper composites is discussed.


Effect of molecular weight of PVA on the reactivity and stability behavior of adhesive

2017 International Conference on Electronics Packaging (ICEP), 2017

All kinds of poly (urea-urethane) microcapsules containing hardener derivatives as a core material were prepared by an interfacial polymerization process in order to investigate the reactivity and stability behavior for application of adhesive. The results show that the prepared microcapsules were smooth and compact; in addition, average diameters were 1-20 μm. When they mix with epoxy resin as adhesive, the ...


Microwave treatment technology for oil contaminated drill cuttings

2015 IEEE International Vacuum Electronics Conference (IVEC), 2015

This paper introduces the microwave treatment method for the oil contaminated drill cuttings. The method could lead the oil content to reduce to less than 1%, and the oil recovery rate could reach 51.53%. A large amount of oil and water mixed vapor are separated from the cuttings when they are heated to 125°C. Therefore, the oil in the cuttings ...


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Educational Resources on Curing

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IEEE.tv Videos

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IEEE-USA E-Books

  • An Acoustic Temperature Sensor to Monitor Variable Frequency Microwave Curing of Polymer Dielectrics

    While conventional thermal curing can take several hours, variable frequency microwave (VFM) curing can perform the same steps in minutes, without compromising intrinsic material properties. VFM processing is a viable alternative to conventional thermal techniques because of advantages like rapid heating selective heating of materials, and the capability to process metals. However, current limitations include uncertain process characterization methods and a lack of reliable temperature measuring techniques. Prior research has utilized statistical experimental design, neural networks, and genetic algorithms to model and optimize VFM process parameters. Current research focuses on developing a reliable temperature measuring system using acoustic techniques to monitor polymer dielectrics cured in a VFM The acoustic sensor exhibits the capability to measure temperatures from 20 to 200 degC with an accuracy of plusmn2 degrees.

  • Plasma resistance and behavior of polybenzoxazine polymer

    The structure of B-a type polybenzoxazine(PBZZ) is similar to phenolic resin through thermal self-curing of the heterocyclic ring opening reaction that neither requires catalyst nor releases any condensation byproduct. These PBZZ resins are found to possess several outstanding properties such as near no shrinkage after curing, high thermal stability and low water absorption. Furthermore, the PBZZ has high glass transition temperature even though it has relatively low cross linking density. Hence, the PBZZ polymer is a candidate material for IC manufacturing. The plasma treatment of this polymer is reported here.

  • Development of low-loss mica paper insulating materials for rotating apparatus

    Some techniques used in the development of insulation materials for form-wound coils are described. A method of determining compatibility of various bonding and impregnating resins for mica paper composites is discussed.

  • Effect of molecular weight of PVA on the reactivity and stability behavior of adhesive

    All kinds of poly (urea-urethane) microcapsules containing hardener derivatives as a core material were prepared by an interfacial polymerization process in order to investigate the reactivity and stability behavior for application of adhesive. The results show that the prepared microcapsules were smooth and compact; in addition, average diameters were 1-20 μm. When they mix with epoxy resin as adhesive, the exothermal peaks of the curing reaction were under 110°C and reaction heat were above 400J/g; furthermore, the variation of reaction heat decreased less than 10% when the formulas stored in room temperature for 30 days. The results indicate the latent hardener shows great heat reactivity and storage stability for electronics packaging.

  • Microwave treatment technology for oil contaminated drill cuttings

    This paper introduces the microwave treatment method for the oil contaminated drill cuttings. The method could lead the oil content to reduce to less than 1%, and the oil recovery rate could reach 51.53%. A large amount of oil and water mixed vapor are separated from the cuttings when they are heated to 125°C. Therefore, the oil in the cuttings is carried over by water steam and removed at lower temperatures.

  • A study of radiation heating during the curing process of head gimbal assembly

    Thermal radiation characteristics of materials associated with their interactions in the electromagnetic (EM) curing process of head gimbal assembly (HGA) are studied to identify process factors involving a random soft electrostatic discharge (ESD) of a read sensor that is located on a slider. The oven temperature measurement with K-type grounded thermocouples that are also used regularly as real-time and non-contact slider temperature measuring tools, show relatively higher temperature in the center of the carrier than its both ends. It is then shown from the two-dimensional (2D) model that the center slider temperatures are apparently different when different types of thermocouples are used. The center slider's peak temperature increases steadily with a decrease in the suspension's thickness and width, and, in some cases, is higher than ones measured by the thermocouple.

  • A novel solution for porous low-k dual damascene post etch stripping/clean with supercritical CO/sub 2/ technology for 65nm and beyond applications

    Supercritical C0/sub 2/ technology for single and dual damascene post etch stripping and clean was successfully demonstrated on 65nm technology node. Both bulk film composition analysis and electrical performance on 300mm have been investigated in the present work. With superior compatibility for porous low-k materials, complete removal of photo resist and residue with better leakage and RC delay performance was achieved for the first time.

  • Heat Treatment of Polymer Composite Materials Using Microwave Radiation

    The results of the microwave radiation influence of the electromagnetic field oscillation frequency of 2450 MHz on the process of curing thermosetting epoxy resins, which are used as a binder in the production of polymer composite materials based on basalt, glass and carbon fibers, are presented. It is shown that the density of the cured thermosetting epoxy resin using microwave radiation becomes higher compared to traditional methods. The maximum density of thermosetting epoxy resins is achieved by uniform microwave heating.

  • Developing a novel environmental friendly polyester-imide impregnating resin

    In this article, a novel environmental friendly polyester-imide impregnating resin was developed by combining polyester-imide, novel active cross-linking monomer and effective initiator-inhibitor system. The new resin has excellent processing abilities, suitable for usual dipping, VPI, and dip-rolling machines. The comprehensive performance of this new resin was investigated systematically, including curing reaction, volatile material content, bond strength, volume shrinkage rate, heat resistance, storage stability, application performance of impregnating mica tape, acute toxicity, and skin irritation. The results indicate that the new resin has many excellent characteristics, such as fast curing at low-temperature, very low volatile material content, low volume shrinkage rate, excellent bond strength and heat resistance above Class H temperature, excellent storage stability without cold storage, and good electrical insulation properties with mica tape as main wall insulation. The new resin can be used for both low and medium voltage rotating machines and transformers. It is an excellent substitution to common unsaturated polyester impregnating resins by complying with the global environmental policy, and has a significant effect on upgrading insulating impregnating resin products and environmental improvement of insulation impregnating in the areas of motors and electrical equipment industry.

  • Stress analysis of "Micro-Bump Bonding" structure for "Chip on glass" packaging

    Micro-Bump Bonding (MBB) method makes possible the micro-order direct bonding between IC electrode and circuit substrate electrode. The technology consists of three elements: an IC chip with bumps, a circuit substrate, and a bonding adhesive. The binding forces of the applied adhesive accomplish electrical connection between the bumps on the IC chip and the electrodes on the substrate. Stress analysis is made to estimate the contact force that the adhesive imposes to drag together the bumps of the IC and the electrodes of the substrate. An elastic model is assumed herein to determine the stress characteristic of the MBB structure. The stresses of the structures with gold bumps and compliant bumps are compared at various temperatures. Such a stress analysis is helpful in determining which kind of bumps is more suitable for a given MBB structure.



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