Conferences related to Crimping

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2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


2020 IEEE 17th International Symposium on Biomedical Imaging (ISBI 2020)

The IEEE International Symposium on Biomedical Imaging (ISBI) is the premier forum for the presentation of technological advances in theoretical and applied biomedical imaging. ISBI 2020 will be the 17th meeting in this series. The previous meetings have played a leading role in facilitating interaction between researchers in medical and biological imaging. The 2020 meeting will continue this tradition of fostering cross-fertilization among different imaging communities and contributing to an integrative approach to biomedical imaging across all scales of observation.

  • 2019 IEEE 16th International Symposium on Biomedical Imaging (ISBI)

    The IEEE International Symposium on Biomedical Imaging (ISBI) is the premier forum for the presentation of technological advances in theoretical and applied biomedical imaging.ISBI 2019 will be the 16th meeting in this series. The previous meetings have played a leading role in facilitating interaction between researchers in medical and biological imaging. The 2019 meeting will continue this tradition of fostering cross fertilization among different imaging communities and contributing to an integrative approach to biomedical imaging across all scales of observation.

  • 2018 IEEE 15th International Symposium on Biomedical Imaging (ISBI 2018)

    The IEEE International Symposium on Biomedical Imaging (ISBI) is the premier forum for the presentation of technological advances in theoretical and applied biomedical imaging. ISBI 2018 will be the 15th meeting in this series. The previous meetings have played a leading role in facilitating interaction between researchers in medical and biological imaging. The 2018 meeting will continue this tradition of fostering crossfertilization among different imaging communities and contributing to an integrative approach to biomedical imaging across all scales of observation.

  • 2017 IEEE 14th International Symposium on Biomedical Imaging (ISBI 2017)

    The IEEE International Symposium on Biomedical Imaging (ISBI) is the premier forum for the presentation of technological advances in theoretical and applied biomedical imaging. ISBI 2017 will be the 14th meeting in this series. The previous meetings have played a leading role in facilitating interaction between researchers in medical and biological imaging. The 2017 meeting will continue this tradition of fostering crossfertilization among different imaging communities and contributing to an integrative approach to biomedical imaging across all scales of observation.

  • 2016 IEEE 13th International Symposium on Biomedical Imaging (ISBI 2016)

    The IEEE International Symposium on Biomedical Imaging (ISBI) is the premier forumfor the presentation of technological advances in theoretical and applied biomedical imaging. ISBI 2016 willbe the thirteenth meeting in this series. The previous meetings have played a leading role in facilitatinginteraction between researchers in medical and biological imaging. The 2016 meeting will continue thistradition of fostering crossfertilization among different imaging communities and contributing to an integrativeapproach to biomedical imaging across all scales of observation.

  • 2015 IEEE 12th International Symposium on Biomedical Imaging (ISBI 2015)

    The IEEE International Symposium on Biomedical Imaging (ISBI) is the premier forum for the presentation of technological advances in theoretical and applied biomedical imaging. ISBI 2015 will be the 12th meeting in this series. The previous meetings have played a leading role in facilitating interaction between researchers in medical and biological imaging. The 2014 meeting will continue this tradition of fostering crossfertilization among different imaging communities and contributing to an integrative approach to biomedical imaging across all scales of observation.

  • 2014 IEEE 11th International Symposium on Biomedical Imaging (ISBI 2014)

    The IEEE International Symposium on Biomedical Imaging (ISBI) is the premier forum for the presentation of technological advances in theoretical and applied biomedical imaging. ISBI 2014 will be the eleventh meeting in this series. The previous meetings have played a leading role in facilitating interaction between researchers in medical and biological imaging. The 2014 meeting will continue this tradition of fostering crossfertilization among different imaging communities and contributing to an integrative approach to biomedical imaging across all scales of observation.

  • 2013 IEEE 10th International Symposium on Biomedical Imaging (ISBI 2013)

    To serve the biological, biomedical, bioengineering, bioimaging and other technical communities through a quality program of presentations and papers on the foundation, application, development, and use of biomedical imaging.

  • 2012 IEEE 9th International Symposium on Biomedical Imaging (ISBI 2012)

    To serve the biological, biomedical, bioengineering, bioimaging, and other technical communities through a quality program of presentations and papers on the foundation, application, development, and use of biomedical imaging.

  • 2011 IEEE 8th International Symposium on Biomedical Imaging (ISBI 2011)

    To serve the biological, biomedical, bioengineering, bioimaging, and other technical communities through a quality program of presentations and papers on the foundation, application, development, and use of biomedical imaging.

  • 2010 IEEE 7th International Symposium on Biomedical Imaging (ISBI 2010)

    To serve the biological, biomedical, bioengineering, bioimaging, and other technical communities through a quality program of presentations and papers on the foundation, application, development, and use of biomedical imaging.

  • 2009 IEEE 6th International Symposium on Biomedical Imaging (ISBI 2009)

    Algorithmic, mathematical and computational aspects of biomedical imaging, from nano- to macroscale. Topics of interest include image formation and reconstruction, computational and statistical image processing and analysis, dynamic imaging, visualization, image quality assessment, and physical, biological and statistical modeling. Molecular, cellular, anatomical and functional imaging modalities and applications.

  • 2008 IEEE 5th International Symposium on Biomedical Imaging (ISBI 2008)

    Algorithmic, mathematical and computational aspects of biomedical imaging, from nano- to macroscale. Topics of interest include image formation and reconstruction, computational and statistical image processing and analysis, dynamic imaging, visualization, image quality assessment, and physical, biological and statistical modeling. Molecular, cellular, anatomical and functional imaging modalities and applications.

  • 2007 IEEE 4th International Symposium on Biomedical Imaging: Macro to Nano (ISBI 2007)

  • 2006 IEEE 3rd International Symposium on Biomedical Imaging: Macro to Nano (ISBI 2006)

  • 2004 2nd IEEE International Symposium on Biomedical Imaging: Macro to Nano (ISBI 2004)

  • 2002 1st IEEE International Symposium on Biomedical Imaging: Macro to Nano (ISBI 2002)


2020 IEEE IAS Petroleum and Chemical Industry Committee (PCIC)

The PCIC provides an international forum for the exchange of electrical applications technology related to the petroleum and chemical industry. The PCIC annual conference is rotated across North American locations of industry strength to attract national and international participation. User, manufacturer, consultant, and contractor participation is encouraged to strengthen the conference technical base. Success of the PCIC is built upon high quality papers, individual recognition, valued standards activities, mentoring, tutorials, networking and conference sites that appeal to all.


2020 IEEE Industry Applications Society Annual Meeting

The Annual Meeting is a gathering of experts who work and conduct research in the industrial applications of electrical systems.


2020 IEEE International Conference on Robotics and Automation (ICRA)

The International Conference on Robotics and Automation (ICRA) is the IEEE Robotics and Automation Society’s biggest conference and one of the leading international forums for robotics researchers to present their work.


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Periodicals related to Crimping

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Automation Science and Engineering, IEEE Transactions on

The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


Industry Applications, IEEE Transactions on

The development and application of electric systems, apparatus, devices, and controls to the processes and equipment of industry and commerce; the promotion of safe, reliable, and economic installations; the encouragement of energy conservation; the creation of voluntary engineering standards and recommended practices.


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Most published Xplore authors for Crimping

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Xplore Articles related to Crimping

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How to Establish and Insure a 40-Year Qualified Life for Pre-Insulated Connectors

IEEE Transactions on Nuclear Science, 1981

This paper describes the following methods used to insure a 40-year Qualified Life for Burndy's preinsulated connectors: A) Design and development of connectors B) Qualification testing C) Quality Control of the manufactured connectors and tools D) Documentation creation E) Two way communication of requirements


Inverse Scattering from Bodies with Impedance Boundary

Proceedings of XIth International Seminar/Workshop on Direct and Inverse Problems of Electromagnetic Acoustic Wave Theory, 2006

A plane wave falls onto the body with an impedance boundary. Magnitude of the back-scattered spherical wave is compared with that of the wave scattered from the body of the same shape, having zero impedance. The impedance (in general, variable over the boundary) can be created such that the back scattering will be noticeably smaller than that from the smooth ...


3-Dimensional Numerical Simulation of Open-Barrel Crimping Process

2008 Proceedings of the 54th IEEE Holm Conference on Electrical Contacts, 2008

A study of an open-barrel crimping process of 7-stranded wire has been conducted using a full 3-dimensional non-linear explicit dynamic finite element model. 3D dynamic simulation of the crimping process allowed capturing parameters not available in commonly used 2D models, such as barrel and wire extrusion, effect of serrations, and effect of crimper geometry. The model was validated using experimental ...


The automation synergy

ISIE '97 Proceeding of the IEEE International Symposium on Industrial Electronics, 1997

A new automatic equipment could be the opportunity to implement transformations such as the profits going beyond those foreseen in machine investment. The work described in this paper was developed in Leonische Portugal Lda, an electric cable supplier for the automobile industry. The staff has decided to buy a sophisticated machine (ARA) that would improve the cutting and crimping operations. ...


Technological solution for increasing the quality of crimped connections

2015 IEEE 1st International Forum on Research and Technologies for Society and Industry Leveraging a better tomorrow (RTSI), 2015

In this paper we propose a new technological solution for crimping, to increase the quality of crimped connections by reducing the contact resistance and increasing the connection reliability. The method use two adjacent crimp indents in opposite sides. To evaluate the quality of crimped connections we make experimental determinations of contact resistance corresponding to two crimp method: the first method ...


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Educational Resources on Crimping

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IEEE.tv Videos

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IEEE-USA E-Books

  • How to Establish and Insure a 40-Year Qualified Life for Pre-Insulated Connectors

    This paper describes the following methods used to insure a 40-year Qualified Life for Burndy's preinsulated connectors: A) Design and development of connectors B) Qualification testing C) Quality Control of the manufactured connectors and tools D) Documentation creation E) Two way communication of requirements

  • Inverse Scattering from Bodies with Impedance Boundary

    A plane wave falls onto the body with an impedance boundary. Magnitude of the back-scattered spherical wave is compared with that of the wave scattered from the body of the same shape, having zero impedance. The impedance (in general, variable over the boundary) can be created such that the back scattering will be noticeably smaller than that from the smooth metallic body. This can be made, e. g., by cutting a set of channels on the boundary, i.e., by crimping. Such a way of the radar protection can be applied also near the edges and vertices where usage of the absorbing coating is not effective enough

  • 3-Dimensional Numerical Simulation of Open-Barrel Crimping Process

    A study of an open-barrel crimping process of 7-stranded wire has been conducted using a full 3-dimensional non-linear explicit dynamic finite element model. 3D dynamic simulation of the crimping process allowed capturing parameters not available in commonly used 2D models, such as barrel and wire extrusion, effect of serrations, and effect of crimper geometry. The model was validated using experimental results. Numerical results indicate that elastic springback of the crimp, upon release of the tool pressure after crimping, is an essential design parameter engineered into a reliable crimped termination. The springback behavior was confirmed experimentally using metallurgical cross sections of terminals treated to reduce adhesion between the wire and the terminal.

  • The automation synergy

    A new automatic equipment could be the opportunity to implement transformations such as the profits going beyond those foreseen in machine investment. The work described in this paper was developed in Leonische Portugal Lda, an electric cable supplier for the automobile industry. The staff has decided to buy a sophisticated machine (ARA) that would improve the cutting and crimping operations. On the other hand, the cutting section, where the machine would be installed, presented some problems: a complicated material routing, a problematic material follow-up and an informal quality control system. The solution suggested and implemented in the cutting section has the following characteristics: (1) a new layout with two goals: introduction of new equipment and reduce the material handling; (2) a computer based production planning that increases the system possibilities; (3) a new bar codes based identification system that allows the on-line control of production orders status; (4) a local operator based quality control system with the advantage of problems identifications in premature phase.

  • Technological solution for increasing the quality of crimped connections

    In this paper we propose a new technological solution for crimping, to increase the quality of crimped connections by reducing the contact resistance and increasing the connection reliability. The method use two adjacent crimp indents in opposite sides. To evaluate the quality of crimped connections we make experimental determinations of contact resistance corresponding to two crimp method: the first method uses one crimp indents and the second is a proposed method with two crimp indents. All the used samples are with 8 copper wires 7.1 × 3 mm2. After we measure the contact resistance, we compare the obtained values for the two crimp method and present the conclusions.

  • AC loss characteristics of layered insulated low AC resistive conductor

    In this paper, a round tight pressure conductor with large cross-section based on layered insulating structure is proposed. Compared to the existing common conductors, the 1800mm2new conductor with the same cross section can reduce the AC / DC resistance ratio 15% and meet the conductor appearance requirements, without changing the interface state and conductor shielded conductor. Insulated conductor of connection terminal crimping treatment effect on AC loss characteristics of the layered paint on the envelope of actual trial results showed that: 1) new conductor has a lower temperature in the final stable stage than the ordinary one and reduce the percentage of 3.75%; 2) removing the film of paint can effectively reduce the additional loss and heat caused by the uneven current at the crimping and connecting terminals, cut the temperature of conductor by 28% and connection terminal by 57%; 3) two different ways of removing paint including baking and solvent depainting were adopted to reduce the effect of contact resistance in two ways, but the first way is suggested considering the actual maneuverability of the field cable installation.

  • Solderless terminals

    Donald L. Moran (nonmember; lieutenant, Air Technical Service Command, Wright Field, Dayton, Ohio): Wells and Balsbaugh present the background of the need for and a description of tests conducted on a crimp-type solderless terminal.

  • Fresh on the market - tools, appartus, and resources

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  • Quantification of the influence of varying electrode shapes and materials on the thermo-crimping process of standardized tubular cable lugs

    The main joining task in the field of electric drives production is to connect bundles of insulated copper wires with standardized tubular cable lugs, as this connection alternative is widely used in all types of different electrical stator varieties. Implementing this process in industrial production facilities, the thermo-crimping technology is widely used. Within this technique, the insulation is thermally destroyed, while coincidently, the tubular cable lug and the inlying skinned copper wires are deformed plastically, which generates a force fit crimp-connection. The thermo-crimping process features strong production-related benefits such as short tact times, high process reliabilities as well as an easy process handling. The severe disadvantage however has to be seen within the electrode wearing, as the crimping tools are simultaneously exposed to high pressures and temperatures of at least 600 C reducing an electrode's number of possible crimping routines to at most 1500. As a consequence, especially in serial production, excessive maintenance efforts have to be taken into account, strongly reducing the production efficiency. For this purpose, the institute FAPS focuses its research on the reduction of tool wearing. Beginning with a theoretical process analysis, different tool shapes and materials are compared experimentally considering both, the joint quality and the electrode wearing. Subsequently, regression models are introduced predicting static quality properties such as tensile forces and transition resistances. Finally, the proposed model is validated by applying the found formula to different cable lug sizes.

  • Explosively driven blast shutter for diagnostic protection

    Summary form only given. Phillips Laboratory has developed a fast closing shutter designed to protect diagnostics or other devices from damage due to plasma and solid debris subsequent to exposure to high energy transient events such as PL's solid liner working fluid compression geometry. The device uses a cartridge brass (alloy C26000) tube with a 0.8 cm diameter biconic orifice which is crimped shut in 15 /spl mu/s after a 60 /spl mu/s delay. The crimping is accomplished by the simultaneous impact of two opposing 3 g Titanium slugs each propelled by a Reynolds, Inc. RPI Electronic Bridge Wire detonator. The crimp forms a high vacuum seal with a leak rate with an established upper bound of 10/sup -9/ l/s STP air. The assembly is contained by a reusable 14 cm by 14 cm by 5 cm heat treated chrome molybdenum steel casing. The only expendables are the tube, the RP1's, and two 2 g steel disks which buffer the Ti slugs from the RP1's with a total cost of about $400.



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