Conferences related to Corrosion inhibitors

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2020 IEEE Power & Energy Society General Meeting (PESGM)

The Annual IEEE PES General Meeting will bring together over 2900 attendees for technical sessions, administrative sessions, super sessions, poster sessions, student programs, awards ceremonies, committee meetings, tutorials and more


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.


2020 IEEE International Magnetic Conference (INTERMAG)

INTERMAG is the premier conference on all aspects of applied magnetism and provides a range of oral and poster presentations, invited talks and symposia, a tutorial session, and exhibits reviewing the latest developments in magnetism.


2019 IEEE Aerospace Conference

The international IEEE Aerospace Conference is organized to promote interdisciplinaryunderstanding of aerospace systems, their underlying science, and technology



Periodicals related to Corrosion inhibitors

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Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


Electronics Packaging Manufacturing, IEEE Transactions on

Design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally-friendly processing, and computer-integrated manufacturing for the production of electronic assemblies, products, and systems.


Instrumentation and Measurement, IEEE Transactions on

Measurements and instrumentation utilizing electrical and electronic techniques.


Magnetics, IEEE Transactions on

Science and technology related to the basic physics and engineering of magnetism, magnetic materials, applied magnetics, magnetic devices, and magnetic data storage. The Transactions publishes scholarly articles of archival value as well as tutorial expositions and critical reviews of classical subjects and topics of current interest.



Most published Xplore authors for Corrosion inhibitors

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Xplore Articles related to Corrosion inhibitors

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A good close look at corrosion mechanisms

IEEE Spectrum, 1965

None


Adsorption Mechanism of Benzotriazole on Copper Surface in CMP Based Slurries Containing Peroxide and Glycine

ICPT 2012 - International Conference on Planarization/CMP Technology, 2012

During the process of chemical mechanical planarization (CMP) of copper interconnection of ultra large scale integration (ULSI), benzotriazole (BTA) is the most commonly used inhibitor in the slurry. In this paper, the adsorption mechanisms of BTA were studied by weight loss measurements. The inhibition efficiency increases with an increase in the concentration of BTA. The adsorption of BTA was found ...


An environmentally friendly photoresist and ashing residue remover for Cu/low-k devices

2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203), 2001

Developed an effective removal solvent for photoresist and its ashing residue for use in copper wire/low-dielectric interlayer devices that significantly lowers the risk of harming the environment. The inhibition of Cu corrosion is very important in these devices, and benzotriazole (BTA, C/sub 6/H/sub 5/N/sub 3/) is usually used as the corrosion inhibitor. However, BTA creates mutagenicity and biodegrades poorly. We ...


Grey analysis of corrosion on the overhead condensing system

2009 IEEE International Conference on Grey Systems and Intelligent Services (GSIS 2009), 2009

Corrosion is a serious problem in atmospheric distillation unit when the plant refines high-acid crude oil from Shengli Oil Field. How to measure and predict the corrosion and related factors is a significant task in refinery. The GM (1, 1) model can only predict the sequence of exponential law, scribe the monotonic change event. We take acid values as a ...


Development of the post-chemical mechanical polishing cleaner suppressing galvanic corrosion between copper and the Co barrier metal

Proceedings of International Conference on Planarization/CMP Technology 2014, 2014

To develop the post Cu-CMP cleaner, we investigate galvanic corrosion of Co as used barrier metal by electrochemical measurements. To elucidate relationship between cleaner composition and galvanic corrosion, corrosion potential is investigated by Tafel plot and corrosion current is measured by Liner Sweep Voltammetry (LSV). As results, LSV indicates variation of galvanic corrosion caused by chelator and inhibitor. Furthermore, result ...



Educational Resources on Corrosion inhibitors

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IEEE-USA E-Books

  • A good close look at corrosion mechanisms

    None

  • Adsorption Mechanism of Benzotriazole on Copper Surface in CMP Based Slurries Containing Peroxide and Glycine

    During the process of chemical mechanical planarization (CMP) of copper interconnection of ultra large scale integration (ULSI), benzotriazole (BTA) is the most commonly used inhibitor in the slurry. In this paper, the adsorption mechanisms of BTA were studied by weight loss measurements. The inhibition efficiency increases with an increase in the concentration of BTA. The adsorption of BTA was found to occur on the copper surface according to the Temkin isotherm in the acidic slurries and Langmuir isotherm in the alkaline slurries. The values of Gibbs energy of adsorption suggest the both physisorption and chemisorption of BTA on copper surface in both acidic and alkaline slurries. The results provide further insight into the material removal mechanism during CMP process. Keywords: CMP, Adsorption mechanism, BTA

  • An environmentally friendly photoresist and ashing residue remover for Cu/low-k devices

    Developed an effective removal solvent for photoresist and its ashing residue for use in copper wire/low-dielectric interlayer devices that significantly lowers the risk of harming the environment. The inhibition of Cu corrosion is very important in these devices, and benzotriazole (BTA, C/sub 6/H/sub 5/N/sub 3/) is usually used as the corrosion inhibitor. However, BTA creates mutagenicity and biodegrades poorly. We investigated several typical heterocyclic nitrogen compounds such as Cu inhibitor to replace BTA and studied their optimum compositions. We found that uric acid (C/sub 5/N/sub 4/O/sub 3/) was the best corrosion inhibitor for Cu. Moreover, this remover which is composed mainly of amino alcohol, uric acid, and H/sub 2/O can be applied to low-k films by optimizing its H/sub 2/O ratio. It not only effectively removes the ashing residue on Cu/low-k devices, but also effectively reduces the environmental impact because the rinse wastewater containing remover can be completely treated at the fabrication site with ordinary biological processes.

  • Grey analysis of corrosion on the overhead condensing system

    Corrosion is a serious problem in atmospheric distillation unit when the plant refines high-acid crude oil from Shengli Oil Field. How to measure and predict the corrosion and related factors is a significant task in refinery. The GM (1, 1) model can only predict the sequence of exponential law, scribe the monotonic change event. We take acid values as a sample, use the data from the first to 6th month, and establish GM (2, 1) model and Verhulst model to predict the data from 7th to 9<sup>th</sup> month. For the GM (2, 1) model, the maximum relative error is 11.8%, the mean relative error is 7.2%, and the mean relative error of prediction data is 13.2%. For the Verhulst model, the maximum relative error is 7.0%, the mean relative error is 3.1%, and the mean relative error of prediction data is 10.6%. The conclusion is that the Verhulst model is better than DGM model and the Verhulst model can be used for corrosion pate prediction.

  • Development of the post-chemical mechanical polishing cleaner suppressing galvanic corrosion between copper and the Co barrier metal

    To develop the post Cu-CMP cleaner, we investigate galvanic corrosion of Co as used barrier metal by electrochemical measurements. To elucidate relationship between cleaner composition and galvanic corrosion, corrosion potential is investigated by Tafel plot and corrosion current is measured by Liner Sweep Voltammetry (LSV). As results, LSV indicates variation of galvanic corrosion caused by chelator and inhibitor. Furthermore, result of LSV shows well agreement with etching rate of Co wafer which electrically connected with Cu wafer.

  • Grey Prediction of Corrosion on the First Oil Atmospheric Distillation Unite

    Corrosion is a serious problem on the first atmospheric distillation unit when the plant refines high-acid crude oil from Shengli Oil Field. To measure and predict the corrosion and related factors is significant tasks in refinery. The GM(1,1) model only can predict the sequence of exponential law, scribe the monotonic change event. Took acid value as sample, used the data from the first to 6<sup>th</sup> month, established GM(2,1) model and Verhulst to predict the data from 7<sup>th</sup> to 9<sup>th</sup>. For the GM(2,1) model, the maximum relative error is 11.797%, the mean relative error is 7.2269%, and the mean relative error of prediction is 13.2006%. For the Verhulst model, the maximum relative error is 7.0037%, the mean relative error is 3.1402%, and the mean relative error of prediction is 10.5732%. the conclusion is that the Verhulst model is better than DGM model and can be used for corrosion prediction.

  • High performance conductive adhesives

    Isotropic conductive adhesives (ICAs) have been developed as an alternative for traditional tin/lead (Sn/Pb) solders for electronic applications. Compared to mature soldering technology, conductive adhesive technology is still in its infant stage, therefore, there are some limitations for current commercial ICAs. Two critical limitations are poor impact performance and unstable contact resistance with nonnoble metal finished components. These limitations seriously hindered the wide applications of ICA's. No current commercial ICAs show both desirable impact performance and stable contact resistance. In this paper, novel conductive adhesives were formulated using mixtures of an epoxide-modified polyurethane resin and a bisphenol-F type epoxy resin and a corrosion inhibitor. Cure profiles, rheology, and dynamic mechanical properties of the conductive adhesives were studied using a differential scanning calorimeter (DSC), a rheometer, and a dynamic mechanical analyzer (DMA), respectively. Impact strength and contact resistance with several nonnoble metals (Sn/Pb, Sn, and copper) of these conductive adhesives were tested and compared to those of a commercial conductive adhesive. It was found that these in-house conductive adhesives showed superior impact performance and substantially stable contact resistance with nonnoble metal finished components during elevated temperature and humidity aging.

  • The corrosion protection of RE-iron-boron magnets by a phosphate treatment

    The effect of a phosphate treatment as a corrosion inhibitor for a RE-iron- boron magnet has been investigated. The corrosion characteristics of the magnet in a phosphate solution, which consisted of 0.15 M NaH/sub 2/PO/sub 4/, were analyzed by electrochemical impedance and electrochemical noise measurements. The immersion of the magnet in the phosphate solution resulted in the formation of a passive layer on its surface causing a prolonged corrosion protection, after removal from the solution. The protective layer was found to consist of phosphate/pyrophosphate and oxide by XPS analysis.

  • Nanoscale Investigations of the Corrosion of Metallic Artworks by X-Ray Photoemission Spectroscopy

    X-ray Photoemission Spectroscopy (XPS) is a surface-sensitive analytical technique commonly used in the field of materials science at the nanoscale level. Historically applied to the industrial field, it is also successfully used in the investigation of Cultural Heritage, both for diagnostics and for conservation purposes. The nature and the state of conservation of artefacts can be assessed by XPS surface analysis, evidencing the presence of efflorescence, patinas, degradation/corrosion products, coatings and protective layers applied in restoration treatments. The feasibility of probing the surface reactivity in the nanometric range and understanding the chemical processes, occurring in different aggressive environments, makes XPS a very powerful tool also in the field of Conservation of Cultural Heritage. This analytical technique can be very fruitfully employed for the validation of new eco-compatible conservation products (e.g. corrosion inhibitors for metallic artworks) and for the choice of the suitable conservation and restoration protocols. In this work, some case-studies related to the application of XPS to the conservation of copper-based and iron-based alloys artefacts are reported. In particular, the focus is on the evaluation of the conservation state and the identification of degradation phenomena of archaeological bronzes and on the assessment of naturally-derived corrosion inhibitors for a sustainable conservation of iron-based artworks.

  • Effective and environmentally friendly remover for photo resist and ashing residue for use in Cu/low-k process

    The authors have developed an effective removal solvent for photo resist and its ashing residue for use in copper wire/low-dielectric interlayer devices that significantly lowers the risk of harming the environment. The inhibition of Cu corrosion is very important in these devices, and benzotriazole (BTA, C/sub 6/H/sub 5/N/sub 3/) is usually used as the corrosion inhibitor. However, BTA creates mutagenicity and biodegrades poorly. The authors investigate several typical heterocyclic nitrogen compounds as Cu inhibitors to replace BTA and study their optimum compositions. It has been found that uric acid (C/sub 5/H/sub 4/N/sub 4/O/sub 3/) is the best corrosion inhibitor for Cu. Moreover, this remover, which was composed mainly of amino alcohol, uric acid, and H/sub 2/O, can be applied to low-k films by optimizing its H/sub 2/O ratio. It not only effectively removed the ashing residue on Cu/low-k devices but also effectively reduced the environmental impact because the rinse wastewater containing remover can be completely treated at the fabrication site with ordinary biological processes.



Standards related to Corrosion inhibitors

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