Conferences related to Design For Manufacture

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2021 IEEE Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting

The joint meeting is intended to provide an international forum for the exchange of information on state of the art research in the area of antennas and propagation, electromagnetic engineering and radio science


2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2020 IEEE 18th International Conference on Industrial Informatics (INDIN)

INDIN focuses on recent developments, deployments, technology trends, and research results in Industrial Informatics-related fields from both industry and academia


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Periodicals related to Design For Manufacture

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Automatic Control, IEEE Transactions on

The theory, design and application of Control Systems. It shall encompass components, and the integration of these components, as are necessary for the construction of such systems. The word `systems' as used herein shall be interpreted to include physical, biological, organizational and other entities and combinations thereof, which can be represented through a mathematical symbolism. The Field of Interest: shall ...


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Most published Xplore authors for Design For Manufacture

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Xplore Articles related to Design For Manufacture

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Design-for-Manufacture for Multigate Oxide CMOS Process

IEEE Transactions on Semiconductor Manufacturing, 2008

Design-for-manufacture (DFM) for thick gate oxide layout in a dual gate oxide product is investigated. Careless placement and layout for thick gate oxide transistors in the multigate oxide chip can cause significant yield loss. The root cause of the yield loss is that the thick gate oxide can impact the uniformity of the adjacent thin gate oxide thickness. Further experiments' ...


IEE Colloquium on 'Design for Manufacture' (papers in summary form only received) (Digest No.65)

IEE Colloquium on Design for Manufacture (papers in summary form only received) (Digest No.65), 1988

None


A knowledge-based design for manufacture system

1996 IEEE International Conference on Systems, Man and Cybernetics. Information Intelligence and Systems (Cat. No.96CH35929), 1996

Design for manufacture (DFM) is one important activity of concurrent engineering (CE). The essence of the DFM is the integration of product design and process planning into one common activity. In this paper, a knowledge- based design for manufacture system is provided. Product manufacturability can be evaluated based on the product model and manufacturing knowledge in each design period, so ...


The Changing Imperatives Of PCB-design for Manufacture

IEE Colloquium on Design for Manufacture (papers in summary form only received) (Digest No.65), 1988

None


Shifting methods: adopting a design for manufacture flow

International Symposium on Signals, Circuits and Systems. Proceedings, SCS 2003. (Cat. No.03EX720), 2004

Unlike traditional design rule checks (DRCs), which have a clear pass or fail definition, yield issues, such as density and antenna checks, are dependent on a number of variables, resulting in a yes, no or maybe paradigm. These issues, which have a major impact on total chip yield, have typically been identified as design constraints and embedded in DRC rule ...


More Xplore Articles

Educational Resources on Design For Manufacture

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IEEE.tv Videos

IEEE Industry Applications Society: Linking Research to Practice (9 minutes)
IEEE Industry Applications Society: Linking Research to Practice (5 minutes)
Semiconductor Laser Development at Hisense Photonics - Yanfeng Lao - IPC 2018
Standards Insights for Executives: Impact of Standards on Product Design
MicroApps: First-Pass Design Methodology for RF Modules (Agilent Technologies)
Robotics History: Narratives and Networks Oral Histories:Hendrik Van Brussel
Niobium Manufacturing for Superconductivity - ASC-2014 Plenary series - 5 of 13 - Tuesday 2014/8/12
PA Design: RF Boot Camp
Co-design of Power Amplifier and Dynamic Power Supplies for Radar and Communications Transmitters
Micro-Apps 2013: Integrated Electro-Thermal Design of a SiGe PA
Blast from the past: Revisiting Evolutionary Strategies for the Design of Engineered Systems
A Unified Hardware/Software Co-Design Framework for Neuromorphic Computing Devices and Applications - IEEE Rebooting Computing 2017
ICASSP 2011 Trends in Design and Implementation of Signal Processing Systems
Micro-Apps 2013: Design Methodology for GaAs MMIC PA
Micrel Ripple Blocker
IMS 2011 Microapps - Understanding the Proper Dielectric Constant of High Frequency Laminates to Be Used for Circuit Modeling and Design
Engineering the Untamed: Design for Sociotechnical Systems - IEEE Smart Tech Workshop Opening Keynote
One HTS Josephson Junction, An Array of Applications: Has anything come from HTS devices in the last 30 years?
Brooklyn 5G Summit 2014: Erik Starkloff on Platform Approach to Design
Design Considerations for Wideband Envelope Tracking Power Amplifiers

IEEE-USA E-Books

  • Design-for-Manufacture for Multigate Oxide CMOS Process

    Design-for-manufacture (DFM) for thick gate oxide layout in a dual gate oxide product is investigated. Careless placement and layout for thick gate oxide transistors in the multigate oxide chip can cause significant yield loss. The root cause of the yield loss is that the thick gate oxide can impact the uniformity of the adjacent thin gate oxide thickness. Further experiments' results show that the optimization of thick gate oxide transistor layout for the same product can improve the yield. Besides tweaking the gate oxide etching process to overcome the difficulty of multi oxide product manufacture, the guidelines for a good gate oxide layout practice are provided to facilitate the manufacture.

  • IEE Colloquium on 'Design for Manufacture' (papers in summary form only received) (Digest No.65)

    None

  • A knowledge-based design for manufacture system

    Design for manufacture (DFM) is one important activity of concurrent engineering (CE). The essence of the DFM is the integration of product design and process planning into one common activity. In this paper, a knowledge- based design for manufacture system is provided. Product manufacturability can be evaluated based on the product model and manufacturing knowledge in each design period, so the product design can be optimized. A product information model is the information source of plenty of design activities (conceptual design, structure design, detail design and process planning). Product information can be shared by CAD and CAPP, and concurrent design of product can be implemented based on the product information, so the function and information integration of product design can be realized. The product and its design process can then be optimized.

  • The Changing Imperatives Of PCB-design for Manufacture

    None

  • Shifting methods: adopting a design for manufacture flow

    Unlike traditional design rule checks (DRCs), which have a clear pass or fail definition, yield issues, such as density and antenna checks, are dependent on a number of variables, resulting in a yes, no or maybe paradigm. These issues, which have a major impact on total chip yield, have typically been identified as design constraints and embedded in DRC rule files. But there is little in the way of information on how a change in layout relates to overall improvement in yield. With advanced processes of 130nm and smaller, designs that are verified DRC clean can still result in poorly yielding or even non- functioning silicon. For this reason, a new method of communication is needed between designer and manufacturer for determining yield issues. Rather than being provided information on a simple pass/fail basis, designers need immediate access from the manufacturer to how various layout characteristics impact chip yield. This new communication loop is the first and necessary step in adopting and implementing a design for manufacture (DFM) flow. Such an approach identifies trouble spots and provides the important data that allows the designer to determine a cost/yield analysis. Designers will be deciding on and implementing a "fix or fab" methodology, resulting in greater yield and control.

  • Design-for-Manufacture for Multi Gate Oxide CMOS Process

    Most of DFM emphasis has been placed on those so called "lithography critical layers" like diffusion, poly, contact and metal layers. However, "non- lithography-critical layers" impact on the manufacture and the yield has not been investigated well. This paper addresses the DFM issue for one of "non- lithography-critical layers", i.e. thick gate oxide layout in dual oxide product, which in this case impacts the product yield significantly. In this paper, a yield loss in a dual oxide FPGA product is analyzed, and the root cause is demonstrated and finally the DFM approaches for gate oxide design and layout are proposed

  • DFM: where's the proof of value?

    How can design teams employ new tools and develop response methodologies yet still stay within design budgets? How much effort does it require to be an early adopter and what kind of measurable results compensate for this effort? Panelists discuss how their design-for-manufacture (DFM) tools fit into a fixed design methodology, budget and timeline, and give examples of expected ROI (monetary, quality, reduced time-to-market, and comprehensive yield). The aim of this panel is to provide a serious comparison of related DFM technologies on the market and some idea of the cost and difficulty of integrating the tools into a fixed design budget and timeline. Specific results are cited, along with examples of expected ROI (monetary, quality, reduced time-to-market, and comprehensive yield enhancement). The audience should walk away with enough information to make an informed decision on which companies would make sense for their DFM challenges, to reach their own yield and throughput goals

  • Development of design for manufacture

    The development of term "Design for Manufacture" dates back to the late 1970s when Boothroyd and Dewhurst developed a methodology for evaluating the assembly of mechanical structures. In 1984, General Electric's Center of Excellence in Electronics developed a computerized approach to evaluating electronics board level assembly called "Manufacturability Rating System" (MRS). The beginnings of the Design for Manufacture have seen many different attempts to provide a tool for specific purposes, but have not witnessed a total systems approach. During the 1980s and 1990s, terms like Design for Test, Design for the Environment, and Design for X have appeared as methodologies for solving the problem of making designs more compatible with manufacturing. This paper considers the direction of early Design for Manufacture tools and their impact on the development of tools that evaluate the entire product stream and address the total product cycle.

  • Knowledge Management in Collaborative Design for Manufacture

    With the development of the increasing requirement for the market, the knowledge management is a main part of it. How to increase the ability of the enterprise is an important problem for the designers. A methodology for the knowledge management for the manufacture is proposed to meet the requirement. Firstly, the conception of the knowledge management is introduced, which can assist to acknowledge the knowledge. Then the collaborative design and the collaborative design process are constructed. Knowledge based on ontology and knowledge sharing is present for application. At last, a framework of knowledge management in collaborative design for manufacture is constructed, which is helpful for designers complete the task.

  • Development of a Second Generation Low Cost MEMS Gyroscope: Design for Manufacture

    The successful development of a MEMS gyroscope, targeted at high volume, low cost applications, requires careful consideration of both the design and the fabrication requirements. It is essential that the design requirements (e.g. dimensional tolerances) are comfortably within the process capabilities in order to maximise yield at each step. This becomes increasingly important as the design becomes more complex, for instance: with the inclusion of wafer level vacuum encapsulation or the integration of electronics directly onto the device layer silicon. The practical implications of this design for manufacture (DFM) approach are discussed as applied to the BAE systems second generation silicon MEMS gyro. Specific features of the resultant sensor design are described in detail.