Conferences related to Coplanar transmission lines

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2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting

The joint meeting is intended to provide an international forum for the exchange of information on state of the art research in the area of antennas and propagation, electromagnetic engineering and radio science


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE Conference on Computer Vision and Pattern Recognition (CVPR)

CVPR is the premier annual computer vision event comprising the main conference and several co-located workshops and short courses. With its high quality and low cost, it provides an exceptional value for students, academics and industry researchers.

  • 2019 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR)

    CVPR is the premier annual computer vision event comprising the main conference and severalco-located workshops and short courses. With its high quality and low cost, it provides anexceptional value for students, academics and industry researchers.

  • 2018 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR)

    CVPR is the premier annual computer vision event comprising the main conference and several co-located workshops and short courses. With its high quality and low cost, it provides an exceptional value for students, academics and industry researchers.

  • 2017 IEEE Conference on Computer Vision and Pattern Recognition (CVPR)

    CVPR is the premiere annual Computer Vision event comprising the main CVPR conferenceand 27co-located workshops and short courses. With its high quality and low cost, it provides anexceptional value for students,academics and industry.

  • 2016 IEEE Conference on Computer Vision and Pattern Recognition (CVPR)

    CVPR is the premiere annual Computer Vision event comprising the main CVPR conference and 27 co-located workshops and short courses. With its high quality and low cost, it provides an exceptional value for students, academics and industry.

  • 2015 IEEE Conference on Computer Vision and Pattern Recognition (CVPR)

    computer, vision, pattern, cvpr, machine, learning

  • 2014 IEEE Conference on Computer Vision and Pattern Recognition (CVPR)

    CVPR is the premiere annual Computer Vision event comprising the main CVPR conference and 27 co-located workshops and short courses. Main conference plus 50 workshop only attendees and approximately 50 exhibitors and volunteers.

  • 2013 IEEE Conference on Computer Vision and Pattern Recognition (CVPR)

    CVPR is the premiere annual Computer Vision event comprising the main CVPR conference and 27 co-located workshops and short courses. With its high quality and low cost, it provides an exceptional value for students, academics and industry.

  • 2012 IEEE Conference on Computer Vision and Pattern Recognition (CVPR)

    Topics of interest include all aspects of computer vision and pattern recognition including motion and tracking,stereo, object recognition, object detection, color detection plus many more

  • 2011 IEEE Conference on Computer Vision and Pattern Recognition (CVPR)

    Sensors Early and Biologically-Biologically-inspired Vision, Color and Texture, Segmentation and Grouping, Computational Photography and Video

  • 2010 IEEE Conference on Computer Vision and Pattern Recognition (CVPR)

    Concerned with all aspects of computer vision and pattern recognition. Issues of interest include pattern, analysis, image, and video libraries, vision and graphics, motion analysis and physics-based vision.

  • 2009 IEEE Conference on Computer Vision and Pattern Recognition (CVPR)

    Concerned with all aspects of computer vision and pattern recognition. Issues of interest include pattern, analysis, image, and video libraries, vision and graphics,motion analysis and physics-based vision.

  • 2008 IEEE Conference on Computer Vision and Pattern Recognition (CVPR)

  • 2007 IEEE Conference on Computer Vision and Pattern Recognition (CVPR)

  • 2006 IEEE Conference on Computer Vision and Pattern Recognition (CVPR)

  • 2005 IEEE Conference on Computer Vision and Pattern Recognition (CVPR)


2020 IEEE International Magnetic Conference (INTERMAG)

INTERMAG is the premier conference on all aspects of applied magnetism and provides a range of oral and poster presentations, invited talks and symposia, a tutorial session, and exhibits reviewing the latest developments in magnetism.


2020 IEEE International Solid- State Circuits Conference - (ISSCC)

ISSCC is the foremost global forum for solid-state circuits and systems-on-a-chip. The Conference offers 5 days of technical papers and educational events related to integrated circuits, including analog, digital, data converters, memory, RF, communications, imagers, medical and MEMS ICs.


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Periodicals related to Coplanar transmission lines

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Electromagnetic Compatibility, IEEE Transactions on

EMC standards; measurement technology; undesired sources; cable/grounding; filters/shielding; equipment EMC; systems EMC; antennas and propagation; spectrum utilization; electromagnetic pulses; lightning; radiation hazards; and Walsh functions


Electron Device Letters, IEEE

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronic devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


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Most published Xplore authors for Coplanar transmission lines

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Xplore Articles related to Coplanar transmission lines

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Testchip for high temperature superconductor passive devices

IEEE International Digest on Microwave Symposium, 1990

A testchip for fully characterizing high-temperature-superconducting (HTS) thin-film properties relevant to planar passive microwave device applications is presented. The chip integrates coplanar resonators and transmission lines along with structures for process monitoring. Measurements of the quality factor of coplanar resonators as a function of temperature and input power are reported. For the coupling of the resonators to the input signals, ...


Design formulas for an asymmetrical coplanar strip, folded dipole

1985 Antennas and Propagation Society International Symposium, 1985

None


Distributed amplifier based on FEA and low-lossy transmission line

Eleventh International Vacuum Microelectronics Conference. IVMC'98 (Cat. No.98TH8382), 1998

New design of distributed amplifier is considered, consisting of co-planar transmission line and open-circuited FEAs. This structure has very low 'cold' losses (1-2 order less than in FEA) and allows developing wide-band distributed amplifier having gain 10 dB up to frequency 40 GHz.


New topology of the GaAs non-linear transmission line (NLTL) using microstrip line technology

1996 IEEE MTT-S International Microwave Symposium Digest, 1996

A novel NLTL is designed using microstrip as an alternative to the coplanar wave guide (CPW) approach which has the advantage of reduced chip size and cost. A frequency multiplier has been designed with the number of sections optimized for power output using harmonic balance simulation. The large and small signal models of the 4*75 /spl mu/m GaAs schottky diode ...


A compact LTCC branch-line coupler UsingModified-T equivalent-circuit modelfor transmission line

IEEE Microwave and Wireless Components Letters, 2006

In this letter, a compact branch-line coupler is proposed by making good use of the three-dimensional layout capability of the low-temperature co-fired ceramic (LTCC) substrate. This branch-line coupler is accomplished by using lumped-inductors and lumped-capacitors to realize the modified-T equivalent- circuit model for the transmission line so that the circuit size may drastically be reduced. Specifically, a very compact LTCC ...


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Educational Resources on Coplanar transmission lines

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IEEE.tv Videos

Micro-Apps 2013: Determining Circuit Material Dielectric Constant from Phase Measurements
IMS 2011 Microapps - New Rotary Joint Product Lines for SATCOM Applications
Stochastic Single Flux Quantum Neuromorphic Computing using Magnetically Tunable Josephson Junctions - Stephen Russek: 2016 International Conference on Rebooting Computing
HKN Member Asad M. Madni Receives Award at 2015 EAB Awards Ceremony
IMS 2011 Microapps - Ultra Low Phase Noise Measurement Technique Using Innovative Optical Delay Lines
The Prospects for Scalable Quantum Computing with Superconducting Circuits - Applied Superconductivity Conference 2018
PCB Fabrication Influences on Microwave Performance: MicroApps 2015 - Rogers Corporation
Microwave PCB Structure Selection Microstrip vs. Grounded Coplanar Waveguide: MicroApps 2015 - Rogers Corporation
Founder of the Wikipedia Encyclopedia Talks About It's Global Impact
Innovative Transmission Line Measurement and Characterization Reduce Time to Repair for Complex Communication Systems: MicroApps 2015 - Keysight Technologies
Advances in MgB2 - ASC-2014 Plenary series - 7 of 13 - Wednesday 2014/8/13
Maker Faire 2008: Tube Time Clocks
IMS 2014: A 600 GHz Low-Noise Amplifier Module
What Publishers are Looking for in an Author: John B. Anderson
IMS 2014: MIMO and Beamforming Solutions for 5G Technology
Keynote: Ted Rappaport - Terahertz Communication - B5GS 2019
Hands-On with the Snorkel Mask Camera
NYC Soldering Championship
From Engineer to Chocolatier - Giving Up Technology Careers to Make Confections
Maker Faire: DIY Showcase of Vehicles Harnessing Human Power

IEEE-USA E-Books

  • Testchip for high temperature superconductor passive devices

    A testchip for fully characterizing high-temperature-superconducting (HTS) thin-film properties relevant to planar passive microwave device applications is presented. The chip integrates coplanar resonators and transmission lines along with structures for process monitoring. Measurements of the quality factor of coplanar resonators as a function of temperature and input power are reported. For the coupling of the resonators to the input signals, microwave probes with 40-GHz bandwidth have been used within the cryo-environment. Quality values obtained at 5 GHz and 77 K are superior to that of an equivalent copper resonator by a factor of about 40.<<ETX>>

  • Design formulas for an asymmetrical coplanar strip, folded dipole

    None

  • Distributed amplifier based on FEA and low-lossy transmission line

    New design of distributed amplifier is considered, consisting of co-planar transmission line and open-circuited FEAs. This structure has very low 'cold' losses (1-2 order less than in FEA) and allows developing wide-band distributed amplifier having gain 10 dB up to frequency 40 GHz.

  • New topology of the GaAs non-linear transmission line (NLTL) using microstrip line technology

    A novel NLTL is designed using microstrip as an alternative to the coplanar wave guide (CPW) approach which has the advantage of reduced chip size and cost. A frequency multiplier has been designed with the number of sections optimized for power output using harmonic balance simulation. The large and small signal models of the 4*75 /spl mu/m GaAs schottky diode which is used in the design are verified using S-parameters and large signal measurements.

  • A compact LTCC branch-line coupler UsingModified-T equivalent-circuit modelfor transmission line

    In this letter, a compact branch-line coupler is proposed by making good use of the three-dimensional layout capability of the low-temperature co-fired ceramic (LTCC) substrate. This branch-line coupler is accomplished by using lumped-inductors and lumped-capacitors to realize the modified-T equivalent- circuit model for the transmission line so that the circuit size may drastically be reduced. Specifically, a very compact LTCC branch-line coupler with a size of 0.079/spl lambda//spl times/0.0717/spl lambda/ is implemented and carefully examined, where /spl lambda/ is the wavelength of the multilayer structure at the operating frequency f/sub 0/.

  • High-T/sub c/ superconducting high-Q coplanar resonator made on MgO

    Coplanar two-port transmission line resonators were made using high-T/sub c/ superconducting EuBa/sub 2/Cu/sub 3/O/sub x/ film on an MgO substrate. The EuBa/sub 2/Cu/sub 3/O/sub x/ films were prepared by magnetron sputtering and patterned by photolithography and Ar ion milling. The resonator characteristics were measured as a junction of temperature and power. The highest unloaded Q value obtained was 12500 at 28 K and at 3.9 GHz, and the surface resistance of the film was estimated at about 40 mu Omega . No change in Q values was observed at input power level less than -20 dBm.<<ETX>>

  • Quasi-static model for circular transmission lines

    Models have been developed for circular transitions of commonly used transmission lines, such as the stripline and the microstrip line, and have been included in commercial microwave CAD packages. Yet no general theory has been made for modeling the bends of other transmission lines, such as the coplanar waveguide. A model was derived for general circular transmission lines, based on a quasi-static approximation. This model was applied to a circular coplanar waveguide. Measurement of the latter showed good agreement with the model.

  • Thin-film RF noise suppressor integrated in a transmission line

    A concept to integrate a thin-film radio-frequency noise suppressor in a transmission line is demonstrated by using Co/sub 85/Nb/sub 12/Zr/sub 3/ amorphous film with the microwire array structure. The ferromagnetic resonance loss generation at high frequencies is essential to realize this idea. The degree of noise suppression is only less than 1 dB, which should be improved by optimum design to integrate the magnetic film.

  • Ultra low impedance CPW transmission lines for multilayer MMICs

    A novel technique for realizing low-loss coplanar waveguide (CPW) transmission lines with ultralow characteristic impedance on multilayer monolithic microwave integrated circuits (MMICs) is presented. The performance of these CPW lines is investigated experimentally with either ground planes extended under the signal conductor or the center conductor extended under the ground planes. Using this technique, characteristic impedances as low as 7 Omega have been realized. The technique has been compared extensively with the proven standard thin-film microstrip (TFMS) transmission line technique. The TFMS technique can be used for lines with characteristic impedance as low as 3.6 Omega , but is found here to be significantly more lossy. A CPW line with Z/sub 0/=10 Omega gave a loss figure of 0.2 dB per millimeter at 10 GHz, compared to approximately 0.75 dB/mm for the same Z/sub 0/ in a TFMS. These CPW structures are thus expected to find use particularly in uniplanar MMIC power amplifiers.<<ETX>>

  • MEMS Based 3-D Micro Coaxial Transmission Lines

    Micro coaxial transmission lines are advantageous over planar counterparts such as microstrip and coplanar waveguides due to their shielded nature for use at mm-wave frequencies. This paper proposes micro coaxial transmission lines implemented on CMOS grade silicon wafers, suitable for integration with conventional MMIC circuitry. Lines of varying characteristic impedances were designed, fabricated and analyzed in the 1 to 40 GHz range. Normalized best case return loss values are in the range of 15 dB and an insertion loss of 4 dB/cm at 30 GHz



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