Conferences related to Conductive films

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2023 Annual International Conference of the IEEE Engineering in Medicine & Biology Conference (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted full papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions,will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.


2021 IEEE Pulsed Power Conference (PPC)

The Pulsed Power Conference is held on a biannual basis and serves as the principal forum forthe exchange of information on pulsed power technology and engineering.


2020 Joint Conference of the IEEE International Frequency Control Symposium and International Symposium on Applications of Ferroelectrics (IFCS-ISAF)

Ferroelectric materials and applications


2020 IEEE International Reliability Physics Symposium (IRPS)

Meeting of academia and research professionals to discuss reliability challenges


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.



Periodicals related to Conductive films

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.



Most published Xplore authors for Conductive films

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Xplore Articles related to Conductive films

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An electrodeposited cylindrical magnetometer sensor

IEEE Transactions on Magnetics, 1975

A high sensitivity flux-gate magnetometer sensor element has been developed by electrodepositing permalloy films on cylindrical conductor substrates with magnetic easy-axis in the axial direction. The cylindrical films are of 2½" length, ¼" diameter and vary in thickness from 2 to 12 tousand angstroms. Film composition is 81% Ni and 19% Fe adjusted to zero magnetostriction. The resulting films exhibit ...


Effective evaluation of anisotropic conductive film

Conference Record of the 1991 International Display Research Conference, 1991

An effective evaluation technique for ACF (anisotropic conductive film) was established by measuring viscoelasticity characteristics, peel strength, and connection resistance before and after the ACF pressure cooker test (15 hr). It was confirmed that this technique is a useful method for selecting optimum ACF bonding conditions. It was clarified that an ACF having metal particles as conductive particles was the ...


Gateable thin-film transformer

IEEE Transactions on Magnetics, 1969

None


Anisotropy in conductivity of stretched polyaniline film

International Conference on Science and Technology of Synthetic Metals, 1994

Summary form only given. Solution cast polyaniline film was stretched and the electrical conductivity was measured in the direction of the parallel and perpendicular to the chain orientation. The electrical conductivity of the unstretched film was 28 S cm/sup -1/ while the /spl sigma//spl par/ and /spl sigma//spl perp/ were 79 and 17 S cm/spl -1/ for a specimen of ...


Failure Analysis of Anisotropic Conductive Film Packages With Misalignment Offsets

IEEE Transactions on Device and Materials Reliability, 2010

This paper utilizes the V-shaped curve method to analyze the failure probability of anisotropic conductive film (ACF) packages with various degrees of IC/substrate misalignment. In evaluating the failure probability of the ACF package, the probability of an opening failure in the vertical gap between the pads is determined in accordance with a Poisson function, while the probability of a bridging ...



Educational Resources on Conductive films

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IEEE-USA E-Books

  • An electrodeposited cylindrical magnetometer sensor

    A high sensitivity flux-gate magnetometer sensor element has been developed by electrodepositing permalloy films on cylindrical conductor substrates with magnetic easy-axis in the axial direction. The cylindrical films are of 2½" length, ¼" diameter and vary in thickness from 2 to 12 tousand angstroms. Film composition is 81% Ni and 19% Fe adjusted to zero magnetostriction. The resulting films exhibit an anisotropy field, Hk, of 1 Oersted and less than 5 degrees for the dispersion angie α90.

  • Effective evaluation of anisotropic conductive film

    An effective evaluation technique for ACF (anisotropic conductive film) was established by measuring viscoelasticity characteristics, peel strength, and connection resistance before and after the ACF pressure cooker test (15 hr). It was confirmed that this technique is a useful method for selecting optimum ACF bonding conditions. It was clarified that an ACF having metal particles as conductive particles was the optimum ACF for 100- mu m-pitch bonding. The intention is to fabricate a high-resolution TFT-LCD (liquid crystal display) by using this evaluation method.<<ETX>>

  • Gateable thin-film transformer

    None

  • Anisotropy in conductivity of stretched polyaniline film

    Summary form only given. Solution cast polyaniline film was stretched and the electrical conductivity was measured in the direction of the parallel and perpendicular to the chain orientation. The electrical conductivity of the unstretched film was 28 S cm/sup -1/ while the /spl sigma//spl par/ and /spl sigma//spl perp/ were 79 and 17 S cm/spl -1/ for a specimen of elongation ratio 300 %. The /spl sigma//spl par/ and a /spl sigma//spl perp/ values tend to approach a saturation at higher elongation ratio. The effect of solvent content and oxidation state will be discussed as well.

  • Failure Analysis of Anisotropic Conductive Film Packages With Misalignment Offsets

    This paper utilizes the V-shaped curve method to analyze the failure probability of anisotropic conductive film (ACF) packages with various degrees of IC/substrate misalignment. In evaluating the failure probability of the ACF package, the probability of an opening failure in the vertical gap between the pads is determined in accordance with a Poisson function, while the probability of a bridging failure between the pads in the pitch direction is computed using a bridging model. In computing the opening and bridging probabilities, the Poisson function and bridging model are modified to take account of the effects of package misalignments on the effective conductive area between opposing pads and the bridging-path length between neighboring pairs of opposing pads, respectively. The opening and bridging probabilities are then combined using probability theory to establish an overall failure prediction model for the IC/substrate assembly. It is shown that, for any given value of the IC/substrate misalignment, the modified V-shaped curve method enables not only the failure probability of the ACF package to be reliably predicted but also an estimate to be made of the optimal ACF volume fraction. The results show that the semilogarithmic failure probability increases approximately linearly with the volume fraction for both uni- and bidirectional misalignments of the ACF package. The optimal volume fractions for ACF packages with misalignments not considered in this paper can be derived from the current results via a process of interpolation.

  • High Performance Nano-scale Conductive Films with Low Temperature Sintering for Fine Pitch Electronic Interconnect

    A novel nano-scale conductive film which combines the advantages of both traditional anisotropic conductive adhesives/films (ACAs/ACFs) and nonconductive adhesives/films (NCAs/NCFs) is introduced and developed for next generation high performance ultra-fine pitch packaging applications. This novel interconnect film possesses the properties of electrical conduction along the z-direction with relatively low bonding pressure (ACF-like) and the ultra-fine pitch (&lt; 100 nm) capability (NCF-like). Unlike typical ACF which requires 1-5 vol% of conductive fillers, the novel nano-scale conductive film only needs less than 0.1 vol% conductive fillers to achieve good electrical conductance in the z direction. The nano-scale conductive film also allows a lower bonding pressure than NCF to achieve a much lower joint resistance (over two orders of magnitude lower than typical ACF joints) and higher current carrying capability. With low temperature sintering of nano-silver fillers, the joint resistance of the nano-scale conductive film could be as low as 10"5 Ohm, even lower than the NCF and lead-free solder joints. The insertion loss of nano-scale joints are almost the same as the standard ACF or NCF joints, suggesting that the nano-ACF joints are suitable for reliable high frequency adhesive joints in microelectronics packaging. The reliability of the nano- scale conductive film after high temperature and humidity test (85degC /85%RH) was also improved compared to the NCF joints. In order to reduce the silver migration and maintain a good insulation/dielectric property in the x-y plane for the nano-scale conductive film, self-assembled molecular wires (SAM) are used to passivate/protect the silver nano fillers. The protection of silver nano particles with molecular monolayers reduced the silver migration dramatically and no migration was observed upon application of high voltages (up to 500 V) due to the formation of surface chelating compounds between the SAM and nano silver fillers. The migration behavior of SAM passivated nano-Ag conductive adhesives was investigated by analyzing the results with the migration model.

  • Nano-Scale Conductive Films with Low Temperature Sintering for High Performance Fine Pitch Interconnect

    In this paper, a novel nano-scale conductive film which combines the advantages of both traditional anisotropic conductive adhesives/films (ACAs/ACFs) and nonconductive adhesives/films (NCAs/NCFs) is introduced and developed for next generation high performance ultra-fine pitch packaging applications. This novel interconnect film possesses the properties of electrical conduction along the z-direction with relatively low bonding pressure (ACF-like) and the ultra-fine pitch (&lt; 100 nm) capability (NCF- like). Unlike typical ACF which requires 1-5 vol% of conductive fillers, the novel nano-scale conductive film only needs less than 0.1 vol% conductive fillers to achieve good electrical conductance in the z direction. The nano- scale conductive film also allows a lower bonding pressure than NCF to achieve a much lower joint resistance (over two orders of magnitude lower than typical ACF joints) and higher current carrying capability. With low temperature sintering of nano-silver fillers, the joint resistance of the nano-scale conductive film could be as low as 10<sup>-5</sup> Ohm, even lower than the NCF and lead-free solder joints. The insertion loss of nano-scale joints are almost the same as the standard ACF or NCF joints, suggesting that the nano- ACF joints are suitable for reliable high frequency adhesive joints in microelectronics packaging. The reliability of the nano-scale conductive film after high temperature and humidity test (85degC/85%RH) was also improved compared to the NCF joints. In order to reduce the silver migration and maintain a good insulation/dielectric property in the x-y plane for the nano- scale conductive film, self-assembled molecular wires (SAM) are used to passivate/protect the silver nano fillers. The protection of silver nano particles with molecular monolayers reduced the silver migration dramatically and no migration was observed upon application of high voltages (up to 500 V) due to the formation of surface chelating compounds between the SAM and nano silver fillers. The migration behavior of SAM passivated nano-Ag conductive adhesives was investigated by analyzing the results with the migration model.

  • Impact properties of flip chip interconnection using anisotropically conductive film on the glass and flexible substrate

    None

  • Effect of Conductive Particle Properties on the Reliability of Anisotropic Conductive Film for Chip-on-Glass Applications

    This paper describes how the material properties of conductive particles in anisotropic conductive films (ACFs) affect the electrical conductivity and the reliability of ACF interconnections for chip-on-glass (COG) applications. For the conductive particles, Au/Ni-coated polymer particles with a 5-diameter were used. Two different types of conductive particles were characterized with respect to their mechanical and electrical properties, such as ball hardness, recovery behavior, and electrical resistance. In addition, two ACFs were fabricated in the form of a double-layered structure, in which the thickness of the ACF and a nonconductive film (NCF) layer were optimized to have as many conductive particles as possible on the bump after COG bonding. The electrical contact resistance of an ACF interconnection in a COG structure depends mainly on the electrical properties of conductive particles in the ACF. The electrical reliability of an ACF interconnection in a COG structure also depends more on the electrical properties than the mechanical properties of conductive particles under a high-temperature and humid condition. Conductive particles with a lower electrical resistance, higher mechanical hardness, and lower recovery rate show better reliability than conductive particles with a higher electrical resistance, lower mechanical hardness, and higher recovery rate. Cross-sectional scanning electron microscopic (SEM) pictures of a COG interconnection show the deformation of two different conductive particles after the reliability tests. The ACF interconnections in the edge or corner of a driver IC show less reliable joints due to high absorption of moisture.

  • Visual Effect of Speckle Reduction on Interpretation of One-Look Sar Photo Images

    None



Standards related to Conductive films

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No standards are currently tagged "Conductive films"