759 resources related to Conductive adhesives
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2021 IEEE Photovoltaic Specialists Conference (PVSC)
Photovoltaic materials, devices, systems and related science and technology
The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.
ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.
The Conference focuses on all aspects of instrumentation and measurement science andtechnology research development and applications. The list of program topics includes but isnot limited to: Measurement Science & Education, Measurement Systems, Measurement DataAcquisition, Measurements of Physical Quantities, and Measurement Applications.
The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.
The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.
Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.
Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...
Electro International, 1991, 1991
The number of soldered joints per circuit is rapidly increasing, especially on surface mounted boards. As a result, defective solder joints are becoming the dominant cause of board failures. Also, there is a move to closer spacing of connections which leads to solder bridging and difficulty of flux removal and joint inspection. These, coupled with other solder disadvantages, have led ...
4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004., 2004
2006 29th International Spring Seminar on Electronics Technology, 2006
The aim of this work is utilization of anisotropic conductive adhesives in industrial praxis. The accent was laid on the new approaches in solving of tasks by using of standard electrotechnologies and available production facilities. The results of the work was advisement of anisotropic conductive joints usability as an alternative of soldered joints in production process at equipment, what is ...
2017 International Applied Computational Electromagnetics Society Symposium (ACES), 2017
In this paper, a 620-690GHz sub-harmonic mixer using monolithic GaAs integrated schottky diodes is presented in order to remove the mismatch caused by manual assembly of the flip chip diode. The monolithic microwave integrated circuit integrates a Schottky anti-parallel diodes pair in a longitudinal configuration. We mostly analyzed the influence caused by diode position offset and conductive adhesive thickness on ...
2008 2nd Electronics System-Integration Technology Conference, 2008
As metal fillers used in conductive adhesives, silver is the most commonly used due to its high conductivity and the stability. However the cost of conductive adhesives with silver fillers is much higher than usual lead-free solders So, copper can be a promising candidate for conductive filler metal due to its low resistivity and low cost, but oxidation causes this ...
The number of soldered joints per circuit is rapidly increasing, especially on surface mounted boards. As a result, defective solder joints are becoming the dominant cause of board failures. Also, there is a move to closer spacing of connections which leads to solder bridging and difficulty of flux removal and joint inspection. These, coupled with other solder disadvantages, have led the military and industrial companies to look for alternative component connection methods. Because of the high cost of components and the circuit substrates it is mandatory to be able to replace defective parts easily.
The aim of this work is utilization of anisotropic conductive adhesives in industrial praxis. The accent was laid on the new approaches in solving of tasks by using of standard electrotechnologies and available production facilities. The results of the work was advisement of anisotropic conductive joints usability as an alternative of soldered joints in production process at equipment, what is mainly used for reflow of standard Sn63Pb solder between contact areas. As simplest adaptable are the existing production facilities, the less expensive is the process transformation. Practical results of the performed study indicate, that realized joints with applied anisotropic conductive adhesive have comparable electrical conductivity with soldered ones. The lower mechanical strength with concerning of operating conditions is the less relevant.
In this paper, a 620-690GHz sub-harmonic mixer using monolithic GaAs integrated schottky diodes is presented in order to remove the mismatch caused by manual assembly of the flip chip diode. The monolithic microwave integrated circuit integrates a Schottky anti-parallel diodes pair in a longitudinal configuration. We mostly analyzed the influence caused by diode position offset and conductive adhesive thickness on the performance of the mixer, which shows the necessity of monolithic integration technology. In 620GHz to 690 GHz simulated results of the mixer had achieved less than 9dB of conversion loss and 920K for DSB noise temperature within the bandwidth.
As metal fillers used in conductive adhesives, silver is the most commonly used due to its high conductivity and the stability. However the cost of conductive adhesives with silver fillers is much higher than usual lead-free solders So, copper can be a promising candidate for conductive filler metal due to its low resistivity and low cost, but oxidation causes this metal to lose its conductivity. In this study, isotropic conductive adhesives (ICAs) using surface modified copper fillers were developed. Especially, in order to overcome the problem associated with the oxidation of copper, the silver was coated with copper filler, and the silver-coated copper was tested as a filler metal. As a result, it was found that the electrical resistance of ICA with silver-coated copper filler was clearly lower and more stable than that of ICA with copper filler after curing and after reliability tests.
This paper describes the result of our study that bare LSI chips are mounted directly onto the "ALIVH/sup TM/" (any layer inner via hole) substrate by using Stud-Bump-Bonding (SBB/sup TM/) technique, which has been developed by us. The SBB/sup TM/ technique is an advanced flip-chip bonding technique, for high density Multi-Chip-Modules (MCMs), which can mount bare LSI chips directly onto substrates. The structure of the bonding portion is composed of Au bumps having two-stepped construction and conductive adhesives. The conductive adhesive is very flexible in bond, thus relaxing thermal and mechanical stresses. The ALIVH/sup TM/ substrate has been developed in our laboratory. It is a high density and high performance multi-layered printed wiring board with any layer inner via hole structure, via hole processing technology using a CO/sub 2/ laser and interconnection technology that employs conductive paste. We had good results for several reliability tests in the test vehicles of MCM-ALIVH/sup TM/. Especially, in the thermal shock test, the increase of connecting resistance in MCM-ALIVH/sup TM/ was smaller than that of MCM-Ls which used ordinary organic substrates in stead of the ALIVH/sup TM/ substrate. The combination of SBB/sup TM/ technique and the ALIVH/sup TM/ substrate is promising for miniaturized, light-weighted, high speed (high frequency), and high quality in MCMs.
In this paper, a typical isotropic conductive adhesives (ICAs) composed of an epoxy-based binder containing micro-sized silver flakes was prepared and the effects of different curing procedures on the electrical properties of conductive adhesives were investigated. The results showed that there a greater influence of the curing temperature on 55% silver fill loading, the volume resistivity of ICAs decreased to 4.7×10-from 1.0×10-3cured at 180 °C and 250 °C, respectively. However, there is almost no effect on the high silver fill loading. The in situ monitoring the variations in electrical resistance of ICAs with 65% silver fill loading was studied during the curing process, and it was found that the resistance reached to 1.99 MΩ at 180 °C after cured for 27 min, and reached to 1.39 KΩ for 40 min, and 18.8 Ω for 60 min and the cooling process almost no effect on the electrical resistance of ICAs. The reasons for the dependence of bulk resistivity on temperatures were also discussed in terms of the dispersing of the silver flakes in ICAs by SEM.
The article focuses on formulation of appropriate risk estimation methods and procedures that enable involving to production process in electronics area. Two methods for risk assessment have been chosen with regard to the specifics of conductive joining based on electrically conductive adhesives. Typical features and failures of the process were identified. Failure mode and effect analysis (FMEA) method was implemented to adhesive joints. Actions for optimization of adhesive joining process are proposed.
Electrically conductive adhesives are used in electrical engineering to substitute lead free solders for conductive joining of components with low resistivity against heat, for mounting of integrated circuits with fine-pitch and ultra-fine-pitch packages, and for adhesive assembly on flex printed circuit boards. Conductive adhesives are materials composed of insulating matrix and conductive filler, usually silver flakes for adhesives with isotropic electrical conductivity are used. A conductive network whose resistance depends mainly on the resistance between the individual particles of the filler is formed inside the conductive adhesive. The main component of the resistance between the particles is a tunnel resistance. The basic theory of formation of tunnel resistance and the generation of the third harmonic component on such resistance when the tunnel junction is powered by a sinusoidal voltage is described in the article. Two basic principles of measuring of third harmonics, which represents nonlinearity and using of this diagnostics for study of changes in adhesive joints caused by mechanical and climatic ageing are also described.
High strength Cu-Cu thermo-compression bonds have been obtained at temperatures as low as 210°C. The bonded Cu surfaces were prepared by diamond bit cutting from electroplated structures. The electrical yield of bump chains depends on bonding temperature and bump size. At bonding temperatures of 300°C and over, bumps of 15 and of 20 μm diameter are bonded with high yield. Below 300°C, the yield decreases strongly for the larger bumps. However, chains made up of 15 μm bumps show high yield when bonded at 250 or 230°C, and still show 70% yield when bonded at 210°C. The electrical resistance of the bonded interface was too small to be determined separately. In shear testing, failure of the bumps does not occur at the bonded interface but after strong plastic deformation or as delamination of another interface.
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