Compression molding

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Compression molding is a method of molding in which the molding material, generally preheated, is first placed in an open, heated mold cavity. (Wikipedia.org)






Conferences related to Compression molding

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2021 IEEE Pulsed Power Conference (PPC)

The Pulsed Power Conference is held on a biannual basis and serves as the principal forum forthe exchange of information on pulsed power technology and engineering.


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE International Conference on Plasma Science (ICOPS)

IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.


2020 IEEE International Magnetic Conference (INTERMAG)

INTERMAG is the premier conference on all aspects of applied magnetism and provides a range of oral and poster presentations, invited talks and symposia, a tutorial session, and exhibits reviewing the latest developments in magnetism.


2020 IEEE Photovoltaic Specialists Conference (PVSC)

Promote science and engineering of photovoltaic materials, devices, systems and applications


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Periodicals related to Compression molding

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


Electrical Insulation Magazine, IEEE

The magazine covers theory, analysis, design (computer-aided design), and practical implementation of circuits, and the application of circuit theoretic techniques to systems and to signal processing. Content is written for the spectrum of activities from basic scientific theory to industrial applications.


Magnetics, IEEE Transactions on

Science and technology related to the basic physics and engineering of magnetism, magnetic materials, applied magnetics, magnetic devices, and magnetic data storage. The Transactions publishes scholarly articles of archival value as well as tutorial expositions and critical reviews of classical subjects and topics of current interest.


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Most published Xplore authors for Compression molding

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Xplore Articles related to Compression molding

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Quasi-optical devices for terahertz frequencies

2012 37th International Conference on Infrared, Millimeter, and Terahertz Waves, 2012

We present a collection of new, low cost quasi-optical devices for the terahertz range. This includes a liquid-filled lens with variable focus length, lenses and transmission gratings made from micro powders, wave plates made from ordinary copy paper, and an electrically tunable notch filter.


Design of a microprocessor-based control system of a compression molding process

Proceedings. Ninth IEEE International Conference on Engineering of Complex Computer Systems, 2004

Today a microprocessor-based control system is a fundamental component in many of the industrial control and automation applications. In this paper is presented the design and implementation of a microprocessor-based computer system for the control and operation of a compression molding process system. The application circuit developed is a specific design of a low-cost embedded system. Simulation and analysis tests ...


Compression Molding Encapsulants for Wafer-Level Embedded Active Devices: Wafer Warpage Control by Epoxy Molding Compounds

2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017

Fan-out wafer level packaging technology (FOWLP) is one of the advanced packages in semiconductor industry. Recently, its interest has been raised due to the benefits such as thin package, board fan-out capability, high I/O, substrate-less process, integration of passives into structure, good thermal resistance, and electrical performance. Despite these many advantages, FOWLP is reluctant to be applied packaging industries due ...


Additives to improve the electret performance of polypropylene

2008 13th International Symposium on Electrets, 2008

Enhancing the charge storage capability of thermoplastic polymers can be achieved at least by (i) the creation of obstacles such as highly elongated pores in the polymer film to substantially lengthen the pathway for charge recombination, (ii) the tailored chemical modification of the polymer backbone, and (iii) the addition of functional additives to create charge traps. This work focuses on ...


On the dynamic-mechanical relaxations of polyaniline(dodecyl benzene sulphonic acid)-complex

International Conference on Science and Technology of Synthetic Metals, 1994

Summary form only given. Processibility of polyaniline (PANI) can be improved by using functionalized counter ions, such as dodecyl benzene sulphonic acid (DBSA). In this work we have studied the plasticization efficiency of DBSA by using dynamic mechanical analysis (DIVIA). Compression molded sheets of PANI(DBSA)/sub x/ with varying composition have been investigated. The loss moduli show characteristic peaks according to ...


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Educational Resources on Compression molding

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IEEE-USA E-Books

  • Quasi-optical devices for terahertz frequencies

    We present a collection of new, low cost quasi-optical devices for the terahertz range. This includes a liquid-filled lens with variable focus length, lenses and transmission gratings made from micro powders, wave plates made from ordinary copy paper, and an electrically tunable notch filter.

  • Design of a microprocessor-based control system of a compression molding process

    Today a microprocessor-based control system is a fundamental component in many of the industrial control and automation applications. In this paper is presented the design and implementation of a microprocessor-based computer system for the control and operation of a compression molding process system. The application circuit developed is a specific design of a low-cost embedded system. Simulation and analysis tests were carried out to verify the design of the prototype circuit board. Final evaluation of system's performance was conducted in real-time experiments.

  • Compression Molding Encapsulants for Wafer-Level Embedded Active Devices: Wafer Warpage Control by Epoxy Molding Compounds

    Fan-out wafer level packaging technology (FOWLP) is one of the advanced packages in semiconductor industry. Recently, its interest has been raised due to the benefits such as thin package, board fan-out capability, high I/O, substrate-less process, integration of passives into structure, good thermal resistance, and electrical performance. Despite these many advantages, FOWLP is reluctant to be applied packaging industries due to the difficulty of controlling wafer warpage. Its broad molding area causes warpage control of FOWLP to be more difficult than other packages. The relationship between molding area and warpage have trade-offs, which have to be optimized beforehand in order to ensure successful subsequent processing. In order to control both factors, it is necessary to study the properties of Young's modulus, coefficient of thermal expansion (CTE), glass transition temperature (Tg), and flow-ability for wafer level mold compounds of interest. In this paper, our group introduces an evaluation tool based on all above parameters and explains how to optimize warpage of FOWLP based on this tool.

  • Additives to improve the electret performance of polypropylene

    Enhancing the charge storage capability of thermoplastic polymers can be achieved at least by (i) the creation of obstacles such as highly elongated pores in the polymer film to substantially lengthen the pathway for charge recombination, (ii) the tailored chemical modification of the polymer backbone, and (iii) the addition of functional additives to create charge traps. This work focuses on the functional additive approach. Novel compounds to improve the electret performance of isotactic polypropylene (i-PP) were synthesized, which act as charge traps.

  • On the dynamic-mechanical relaxations of polyaniline(dodecyl benzene sulphonic acid)-complex

    Summary form only given. Processibility of polyaniline (PANI) can be improved by using functionalized counter ions, such as dodecyl benzene sulphonic acid (DBSA). In this work we have studied the plasticization efficiency of DBSA by using dynamic mechanical analysis (DIVIA). Compression molded sheets of PANI(DBSA)/sub x/ with varying composition have been investigated. The loss moduli show characteristic peaks according to which the efficiency of plasticization can be determined. Conductivity reaches saturation at approximately x=0.35.

  • Dielectric breakdown of xlpe containing actophenone and cumyl alcohol

    None

  • Electrical behavior of PET-matrix composites

    The electrical properties of composites prepared by injection or compression molding of poly(ethylene terephthalate) (PET) with different amounts of filters were studied. The resistivity of composites with low filler concentrations was found to depend on the microstructure imposed by the preparation process. The resistivity of filler materials dominates at higher concentrations. Interfacial polarization and/or hopping conductivity in mica due to impurities may contribute to the conductivity of PET/mica composites. The dielectric response in the 10/sup 3/-10/sup 7/ Hz region was found to be qualitatively dominated by the PET matrix, exhibiting a beta -relaxation centered around 5.4*10/sup 5/ Hz. However, absolute values for in /sub 1/ and in /sub 2/ are influenced by the properties of corresponding fillers. Measurements of in (f) over a wider frequency range should help clarify the correlation of composite microstructure and dielectric response.<<ETX>>

  • Design and fabrication of micro optical components for optical data storage by micromolding

    In the present study, plastic micro lenses were fabricated using micro- compression molding. The microcompression molding system was designed and the mold insert was fabricated using silicon micromachining. Various defects during molding were analyzed, and the process was optimized experimentally.

  • Charge formation in PE/ionomer blends

    The charge formation and decay in polyethylene (PE)/ionomer blends have been investigated in an effort to understand the different TSC behaviors of these blends. It is shown that heterocharges are the main charge carriers accumulated in the low-density PE (LDPE), while homocharges are the main charge carriers in ionomers and blends. The charges in LDPE are located mainly at the surface region, while those in ionomers and blends penetrate more deeply into the specimen; this is attributed to the ionic phases such as carbonyl groups and ionic clusters in ionomers. It has been also found that, in PE/Surlyn 1601 blend, a considerable amount of charge formed during the voltage application migrates inside the specimen when the voltage is turned off.<<ETX>>

  • Compression molding solutions for various high end package and cost savings for standard package applications

    There has been great progress on compression molding technology and equipment. This technology is used not only for most advanced semiconductor package, but also regular BGA type substrate molding to reduce CoO. There is wide range of applications including LED production. The system for mass production is fully developed and is ready to support the production. Compression molding is the next Defacto standard product in mold industry.



Standards related to Compression molding

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