Conferences related to Cold plates

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2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting

The joint meeting is intended to provide an international forum for the exchange of information on state of the art research in the area of antennas and propagation, electromagnetic engineering and radio science


2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.


2020 IEEE 21st International Conference on Vacuum Electronics (IVEC)

Technical presentations will range from the fundamental physics of electron emission and modulated electron beams to the design and operation of devices at UHF to THz frequencies, theory and computational tool development, active and passive components, systems, and supporting technologies.System developers will find that IVEC provides a unique snapshot of the current state-of-the-art in vacuum electron devices. These devices continue to provide unmatched power and performance for advanced electromagnetic systems, particularly in the challenging frequency regimes of millimeter-wave and THz electronics.Plenary talks will provide insights into the history, the broad spectrum of fundamental physics, the scientific issues, and the technological applications driving the current directions in vacuum electronics research.


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE Energy Conversion Congress and Exposition (ECCE)

IEEE-ECCE 2020 brings together practicing engineers, researchers, entrepreneurs and other professionals for interactive and multi-disciplinary discussions on the latest advances in energy conversion technologies. The Conference provides a unique platform for promoting your organization.

  • 2019 IEEE Energy Conversion Congress and Exposition (ECCE)

    IEEE-ECCE 2019 brings together practicing engineers, researchers, entrepreneurs and other professionals for interactive and multi-disciplinary discussions on the latest advances in energy conversion technologies. The Conference provides a unique platform for promoting your organization.

  • 2018 IEEE Energy Conversion Congress and Exposition (ECCE)

    The scope of ECCE 2018 includes all technical aspects of research, design, manufacture, application and marketing of devices, components, circuits and systems related to energyconversion, industrial power and power electronics.

  • 2017 IEEE Energy Conversion Congress and Exposition (ECCE)

    ECCE is the premier global conference covering topics in energy conversion from electric machines, power electronics, drives, devices and applications both existing and emergent

  • 2016 IEEE Energy Conversion Congress and Exposition (ECCE)

    The Energy Conversion Congress and Exposition (ECCE) is focused on research and industrial advancements related to our sustainable energy future. ECCE began as a collaborative effort between two societies within the IEEE: The Power Electronics Society (PELS) and the Industrial Power Conversion Systems Department (IPCSD) of the Industry Application Society (IAS) and has grown to the premier conference to discuss next generation technologies.

  • 2015 IEEE Energy Conversion Congress and Exposition

    The scope of ECCE 2015 includes all technical aspects of research, design, manufacture, application and marketing of devices, components, circuits and systems related to energy conversion, industrial power and power electronics.

  • 2014 IEEE Energy Conversion Congress and Exposition (ECCE)

    Those companies who have an interest in selling to: research engineers, application engineers, strategists, policy makers, and innovators, anyone with an interest in energy conversion systems and components.

  • 2013 IEEE Energy Conversion Congress and Exposition (ECCE)

    The scope of the congress interests include all technical aspects of the design, manufacture, application and marketing of devices, components, circuits and systems related to energy conversion, industrial power conversion and power electronics.

  • 2012 IEEE Energy Conversion Congress and Exposition (ECCE)

    The IEEE Energy Conversion Congress and Exposition (ECCE) will be held in Raleigh, the capital of North Carolina. This will provide a forum for the exchange of information among practicing professionals in the energy conversion business. This conference will bring together users and researchers and will provide technical insight as well.

  • 2011 IEEE Energy Conversion Congress and Exposition (ECCE)

    IEEE 3rd Energy Conversion Congress and Exposition follows the inagural event held in San Jose, CA in 2009 and 2nd meeting held in Atlanta, GA in 2010 as the premier conference dedicated to all aspects of energy processing in industrial, commercial, transportation and aerospace applications. ECCE2011 has a strong empahasis on renewable energy sources and power conditioning, grid interactions, power quality, storage and reliability.

  • 2010 IEEE Energy Conversion Congress and Exposition (ECCE)

    This conference covers all areas of electrical and electromechanical energy conversion. This includes power electrics, power semiconductors, electric machines and drives, components, subsystems, and applications of energy conversion systems.

  • 2009 IEEE Energy Conversion Congress and Exposition (ECCE)

    The scope of the conference include all technical aspects of the design, manufacture, application and marketing of devices, circuits, and systems related to electrical energy conversion technology


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Periodicals related to Cold plates

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Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Electron Devices, IEEE Transactions on

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronics devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


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Most published Xplore authors for Cold plates

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Xplore Articles related to Cold plates

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Design and evaluation of a 6.6 kW GaN converter for onboard charger applications

2017 IEEE 18th Workshop on Control and Modeling for Power Electronics (COMPEL), 2017

This paper presents a compact, lightweight, highly efficient, 6.6 kW isolated three-port dc-dc converter for onboard charger (OBC) applications. The converter was designed and fabricated using normally-off gallium nitride (GaN) transistors; a three-dimensional (3-D) printed cold plate; high-voltage heavy copper printed circuit board (PCB) power planes; low-voltage (14 V) and high- current PCB power planes; and a planar transformer. The ...


Experimental study of a flat silicon heat pipe with microcapillary grooves

The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543), 2004

An increase in power densities in electronic devices is a direct consequence of their miniaturization and performance improvements. We propose the use of flat miniature heat pipes with micro capillary grooves to spread heat flux across a heat sink. Silicon/water heat pipes were fabricated and tested to demonstrate the feasibility of heat spreading with this type of heat pipe.


Spacecraft Heat Pump Thermal Bus Development Status & Technical Issues

Proceedings of the 25th Intersociety Energy Conversion Engineering Conference, 1990

None


Packaging system for high performance computer

Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International Electronic Manufacturing Technology Symposium, 1989

A novel micropackaging system that meets the requirements of increased packaging and heat density is described. The use of bare LSI gate arrays allows the realization of gate densities of up to 4000 gate functions per 1 cm/sup 2/. New wiring technologies allow these ICs to be wired as a dense configuration. High packaging densities result in high power dissipation. ...


Thermal management of liquid-cooled cold plates for multiple heat sources in a humanoid robot

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009

Thermal management for two array types of a serial circulation and a two-way parallel circulation using six mini liquid-cooled cold plates were experimentally measured in this study. In order to reduce weight of the cooling devices for humanoid robot cooling, the cold plates were covered with non-metallic material (polycarbonate, PC). Six cold plates attached on 10 × 10 mm<sup>2</sup> copper ...


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Educational Resources on Cold plates

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IEEE-USA E-Books

  • Design and evaluation of a 6.6 kW GaN converter for onboard charger applications

    This paper presents a compact, lightweight, highly efficient, 6.6 kW isolated three-port dc-dc converter for onboard charger (OBC) applications. The converter was designed and fabricated using normally-off gallium nitride (GaN) transistors; a three-dimensional (3-D) printed cold plate; high-voltage heavy copper printed circuit board (PCB) power planes; low-voltage (14 V) and high- current PCB power planes; and a planar transformer. The prototype has a power density of 10.5 kW/L and specific power of 9.6 kW/kg. Test results show greater efficiency than a silicon-based counterpart, even at 2.5 times higher switching frequency. The isolated GaN converter was integrated with a 100 kW segmented traction inverter that uses silicon carbide MOSFETs and 3-D printed components to test the functionality as a level-2 OBC. Testing and evaluation of the integral onboard charging functionality was successfully completed at power levels up to 6.6 kW.

  • Experimental study of a flat silicon heat pipe with microcapillary grooves

    An increase in power densities in electronic devices is a direct consequence of their miniaturization and performance improvements. We propose the use of flat miniature heat pipes with micro capillary grooves to spread heat flux across a heat sink. Silicon/water heat pipes were fabricated and tested to demonstrate the feasibility of heat spreading with this type of heat pipe.

  • Spacecraft Heat Pump Thermal Bus Development Status &amp; Technical Issues

    None

  • Packaging system for high performance computer

    A novel micropackaging system that meets the requirements of increased packaging and heat density is described. The use of bare LSI gate arrays allows the realization of gate densities of up to 4000 gate functions per 1 cm/sup 2/. New wiring technologies allow these ICs to be wired as a dense configuration. High packaging densities result in high power dissipation. High-efficiency cooling is therefore used, with heat being transferred directly to the cooling medium. The micropackaging system allows the main unit of the mainframe to be designed as a planar system. Up to nine multichip modules (MCMs) can be plugged into a micropackaging board (MPB). A planar module connector with a total of 1850 contact springs is mounted on one side of the MCM, and the other side has an integrated heat sink for transferring the power dissipated to the water-cooled cold plate (CP) of the main unit. This cold plate, which removes the heat generated by an entire unit, is rigidly mounted to the frame of the cabinet. On the module-mounting side of the MPB decoupling capacitors are placed close to the modules. An aluminum frame on the same side assures the uniform distribution of the 0 V potential, mechanically reinforces the main unit, and accommodates modules and tools.<<ETX>>

  • Thermal management of liquid-cooled cold plates for multiple heat sources in a humanoid robot

    Thermal management for two array types of a serial circulation and a two-way parallel circulation using six mini liquid-cooled cold plates were experimentally measured in this study. In order to reduce weight of the cooling devices for humanoid robot cooling, the cold plates were covered with non-metallic material (polycarbonate, PC). Six cold plates attached on 10 × 10 mm<sup>2</sup> copper base: 0.5 × 0.5 mm<sup>2</sup> pin-finned surfaces of 1.5 mm high with 0.5 mm array spacing, was mounted on six copper heating blocks with isothermal conditions of 50~90°C, respectively. In order to compare thermal characteristics according to two circulation types, the surface temperatures of heating blocks and the cooling water temperatures at inlets and outlets of cold plates were measured. From the results, it was found that a two-way parallel circulation was better performance than a serial circulation in terms of total thermal resistance, total heat transfer rate, and surface temperature rises from first heating block to last one for six multiple cold plates.

  • Thermal design and analysis of high power SiC module with low profile and enhanced thermal performance

    In this study, a silicon carbide (SiC) device based power module with low profile and enhanced thermal performance is explored. The low profile is achieved by embedded the SiC chips into the direct bonded copper (DBC) substrate which is designed with cavities. The enhanced thermal performance is achieved by eliminating the core layer of the DBC substrate and shortening the thermal path from the SiC Chip (heat source) to the cold plate (heat sink). Furthermore, a flat surface on the top side of the power module is achieved by designing and positioning the top copper clips in the same level as the top copper trace of the DBC substrate. As such a second liquid cooled cold plate can be implemented on the top surface of the module to further enhance the thermal performance of the power module through the dual side liquid cooling solution. The simulation results show that the chip junction to case thermal resistance for the proposed power module is about 50~60% of the chip junction to case thermal resistance for the conventional power module with similar size and power rates. By applying double side liquid cooling to the proposed power module which is not adaptable for the conventional power module, the thermal performance of the proposed power module further increased about 20%.

  • Test results from the comparison of three liquid cooling methods for high-power processors

    This study compares three different liquid cooling technologies to determine which of the three methods is able to cool the highest power density processor chips. The first method consists of pumping a liquid coolant through a cold plate mounted over a 25.4 mm square heat source. The second method is two- phase immersion cooling of the 25.4 mm square heat source in a bath of 3M Novec® 649 liquid with a boiling point of 49°C. The third method of cooling consists of single-phase immersion cooling of the 25.4 mm square heat source using mineral oil as the coolant. This method was tested under both natural convection and forced convection conditions. An experimental setup, consisting of a heater module with attachment to the cooling solution was designed and built. The apparatus was used to determine the maximum power dissipation that can be supported in a 25.4 mm x 25.4 mm area for each of the three cooling solutions. Note that uniform power dissipation is assumed over the die surface. The measured temperature is assumed to be equivalent to the temperature of a die with the same surface area. The maximum die temperature was set to 100 °C and the power required to reach that temperature was recorded for each of the cooling methods.

  • Simulations on vanadium dioxide thin film as thermographic material

    Vanadium dioxide (VO2) has been extensively investigated due to its thermal- induced semiconductor-metal transition (SMT) at about 67°C; transition temperature can be lowered by doping. Besides the rise in electrical conductivity of up to 3-4 orders of magnitude the phase transition is followed by other changes in different physical properties, including an optical reflectance drop near to its half. Possible applications include thermally controlled electrical and optical switches. In this paper thermal simulations of a proposed thermographic arrangement are presented. The structure consists of a 100 nm thick VO2thin film deposited on the passivated surface of a silicon chip. The goal of these simulations is to predict the acquirable resolution of the proposed method. Abstract heat sources are defined on the silicon surface and the temperature of the thin film is calculated. Thermal mapping could be performed by optical observation of the isotherm at transient temperature, while the dissipation and the cooling of the chip is swept. Possible benefits of the proposed method include the simple and reliable use of the once-deposited solid phase film, maintaining a few micron resolution, similar to liquid crystals, as predicted in earlier electro-optical measurements.

  • Reliability modeling of a single phase liquid cooling system for power electronics applications

    This paper provides an overview of the fundamental wear out mechanisms that can cause a reduction in performance in a single phase liquid cooling system. This system utilizes a plastic insert cold plate design to provide even cooling over the backside of a device by directing liquid coolant through parallel serpentine channels. The channel design increases the efficiency of convective heat transfer from a device, but its small feature sizes are subject to fouling, clogging, or erosion. Computational fluid dynamics software will be used to evaluate the thermal performance of the cooling system under ideal conditions as well as various wear out conditions.

  • Thermal management of silicon carbide power module for military hybrid vehicles

    De-rating of power electronics is a common practice in harsh environment operating conditions. Advanced cooling solutions are needed to overcome the thermal limitations and prevent the de-rating of power components. This study investigates a silicon carbide power module for 28 V DC to 300 V DC power conversion (or reverse) in military hybrid vehicle applications. A combined experimental and numerical modeling effort is reported, to accurately predict the silicon carbide switch (device) junction temperature. The results show that jet impingement cooling at the module base plate increases the module heat dissipation capability by 2.5X and 1.5X, compared to the commercial-off- the-shelf cold plate cooling and micro-channel cooling solutions respectively.



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