IEEE Organizations related to Circuitboard

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Conferences related to Circuitboard

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2018 21st International Conference on Electrical Machines and Systems (ICEMS)

01 Permanent Magnet Motors and Generators, 02 DC and AC Machines, 03 Transformers and Power Apparatus, 04 Linear and Special Machines, 05 Magnetics and Field Analysis, 06 Manufacturing and Testing, 07 Other Areas in Electric Machines, 08 Motor Control and Motor Drives, 09 Motion Control and Servo Systems, 10 Sensorless Control, 11 Automotive Power Electronics and EV Chargers, 12 DC/DC, AC/DC, DC/AC, AC/AC Converters, 13 Other Areas in Power Electronics and Motor Drives, 14 Renewable Energy Systems, 15 Batteries Modeling and Management Systems, Energy Storage Systems, and Power Conversion Systems, 16 Smart Grids, FACTS, and Micro Grids, 17 Electric Propulsion Systems (EV, Train, Electric Ship), 18 Electric and Hybrid Vehicles, 19 Other Areas in Energy Systems and Transportation



Periodicals related to Circuitboard

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Nuclear Science, IEEE Transactions on

All aspects of the theory and applications of nuclear science and engineering, including instrumentation for the detection and measurement of ionizing radiation; particle accelerators and their controls; nuclear medicine and its application; effects of radiation on materials, components, and systems; reactor instrumentation and controls; and measurement of radiation in space.



Most published Xplore authors for Circuitboard

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Xplore Articles related to Circuitboard

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A novel wireless charging system for movable telephone with printed-circuit-board windings of different structure and shape respectively

2007 International Conference on Electrical Machines and Systems (ICEMS), 2007

In this paper, a new wireless charging system for movable telephone is addressed. A pair of contiguous printed-circuit-board windings has different shape and structure respectively, which is adopted as a wireless energy transfer device. The structure and principle of wireless charging system are expounded. The novel concept comes into being the basis for a new generation of universal charging system ...


Silicon modules increase system efficiency

12th International Electronic Manufacturing Technology Symposium, 1992

The microsystems technology is a silicon hybride technology developed by Svenska MikroSystem AB. Linkaping. Sweden. in cooperation with the University of Linkoping. as a part of national development program for microsystems design and production. The technology is thin film processes for resistors. capacitors and metal layers on a silicon substrate. which gives the outmost density for interconnections and passive components. ...


Connection Routing Algorithm for Printed Circuit Boards

IEEE Transactions on Circuit Theory, 1971

A generalized algorithm for forming interconnections between points on a multilayer circuit board is described and evaluated. The algorithm treats interconnections on individual layers and connections between layers by means of plated holes. Generalizing the well-known Lee algorithm and using its terminology, this algorithm makes use of a coded C array that is stored in memory and records the state ...


A pipeline of associative memory boards for track finding

IEEE Transactions on Nuclear Science, 2001

We present a pipeline of associative memory boards for track finding, which satisfies the requirements of level two triggers of the next Large Hadron Collider experiments. With respect to previous realizations, the pipelined architecture warrants full scalability of the memory bank, increased bandwidth (by one order of magnitude), and increased number of detector layers (by a factor of two). Each ...



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IEEE.tv Videos

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IEEE-USA E-Books

  • A novel wireless charging system for movable telephone with printed-circuit-board windings of different structure and shape respectively

    In this paper, a new wireless charging system for movable telephone is addressed. A pair of contiguous printed-circuit-board windings has different shape and structure respectively, which is adopted as a wireless energy transfer device. The structure and principle of wireless charging system are expounded. The novel concept comes into being the basis for a new generation of universal charging system for a wide range of movable telephones. Multifarious movable telephones can be charged simultaneously through the presented charging system, despite their orientations and positions. Furthermore, the feasibility of this system has been demonstrated with the practical measurements. These results provide a useful example for a practical charging system for movable telephone.

  • Silicon modules increase system efficiency

    The microsystems technology is a silicon hybride technology developed by Svenska MikroSystem AB. Linkaping. Sweden. in cooperation with the University of Linkoping. as a part of national development program for microsystems design and production. The technology is thin film processes for resistors. capacitors and metal layers on a silicon substrate. which gives the outmost density for interconnections and passive components. The technology is easily adapted to the needs of your system; from a simple single metal layer interconnection to a complex substrate with resistors. capacitors and up to four metal layers. Consequently, it is also possible for the system designer to design high performance R-C-networks on a single chip. This will allow you to choose the most effective price/peffoin a cc solution. since the microsystems technology easily is combined with conventional hybride or circuitboard technology, with respect to complexity. space requirements etc. Furthermore, system quality is increased since them is no thermal mis matching between the silicon substrate and the dices assembled on it. Normally wirebonding is used for the connections. but them am no obstacles for using c. g. flip-chip- or TAB-technique as well. Since a minimum number of packages is obtained, the number of solder connections is heavily reduced. Packaging options am any large-cavity standard package in plastic, ceramic or metal. Also special lead-frames for molded plastic packages are available. Even a module-on-board, i. c. the substrate is directly assembled on a circuitboard and covered with a silica gel globe-top, is a sufficient assembly for many applications. The presentation will also give detailed information on process steps and component performance. Applications for military. automotive and office, where the microsystems technology is used. are presented.

  • Connection Routing Algorithm for Printed Circuit Boards

    A generalized algorithm for forming interconnections between points on a multilayer circuit board is described and evaluated. The algorithm treats interconnections on individual layers and connections between layers by means of plated holes. Generalizing the well-known Lee algorithm and using its terminology, this algorithm makes use of a coded C array that is stored in memory and records the state of the multilayer circuit board. Completed paths, possible remaining paths between points to be connected, and circuitboard interconnection restrictions are recorded in the coded C array. The algorithm consists of five iterative steps that involve decisions on the basis of the state of the circuit board as stored in the C array. All possible routes are attempted, and the routing sequence is stopped when the path is completed or all attempted path routes are exhausted. A number of modifications to the algorithm permitting various circuit connection constraints to be satisfied are also presented. The algorithm has been programmed for a GE-635 computer. Typical results for some of the printed circuit boards that were used to evaluate the algorithm are included.

  • A pipeline of associative memory boards for track finding

    We present a pipeline of associative memory boards for track finding, which satisfies the requirements of level two triggers of the next Large Hadron Collider experiments. With respect to previous realizations, the pipelined architecture warrants full scalability of the memory bank, increased bandwidth (by one order of magnitude), and increased number of detector layers (by a factor of two). Each associative memory board consists of four smaller boards, each containing 32 programmable associative memory chips, implemented with a low-cost commercial field-programmable gate array (FPGA). FPGA programming has been optimized for maximum efficiency in terms of pattern density, while printed circuitboard design has been optimized in terms of modularity and FPGA chip density. A complete associative memory board has been successfully tested at 40 MHz; it can contain 7.2/spl times/10/sup 3/ particle trajectories.



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