Chip scale packaging
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The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted full papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions,will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.
The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.
ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.
the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.
IECON is focusing on industrial and manufacturing theory and applications of electronics, controls, communications, instrumentation and computational intelligence.
The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.
Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission
Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.
Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.
IEEE Communications Magazine was the number three most-cited journal in telecommunications and the number eighteen cited journal in electrical and electronics engineering in 2004, according to the annual Journal Citation Report (2004 edition) published by the Institute for Scientific Information. Read more at http://www.ieee.org/products/citations.html. This magazine covers all areas of communications such as lightwave telecommunications, high-speed data communications, personal communications ...
1978 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1978
The development of adequate, economical tests for custom LSI circuits is a vital, but increasingly difficult task. Custom chips of VLSI circuit complexity will soon be the norm, with ever widening applications in new products. This session will accent approaches to testing and testability of custom LSI. The usefulness of computer aids for circuit design verification and test vector generation, ...
1973 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1973
1987 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1987
The evolution of analog and digital integrated circuits from small elements to complex systems is clearly documented in the past issues of the DIGEST. Improvements in technology and CAD, raise some vital questions about the areas that future chip designers need to understand and the venue for this training. The answers depend strongly on the techniques and tools available for ...
2009 IEEE Asian Solid-State Circuits Conference, 2009
This paper proposes a new scheme utilizing a small offset voltage (Vos) sense amplifier (SA) to reduce the deterioration of the read speed and the cell stability at the low power supply. This concept is introduced to realize a low supply voltage operation SRAM with a small area penalty. The transistor threshold voltage (Vth) shift caused by hot carrier injection ...
2007 International Symposium on High Density packaging and Microsystem Integration, 2007
Efficient plasma processing equipment that has made possible the cost effective precision etching of MEMS devices, is equally capable of providing very high etch rates and excellent etch uniformity when applied to device packaging requirements. Deep Reactive Ion Etching (DRIE) can be used to etch interconnect vias prior to metallization for System-in-Package (SiP) applications. One such technology focuses on fabricating ...
KeyTalk with Ljubisa Stevanovic: From SiC MOSFET Devices to MW-scale Power Converters - APEC 2017
Microfluidic devices for precision biological measurement: Stephen Quake
KeyTalks: 3D Packaging of Power Products
Why Join the IEEE Electronics Packaging Society
Heterogeneous Photonic Packaging - John Osenbach - IPC 2018
2015 IEEE Honors: IEEE-RSE James Clerk Maxwell Medal - Lynn Conway
Patrizio Vinciarelli, Newell Award: APEC 2019
IEEE Magnetics Distinguished Lecture - Mitsuteru Inoue
Pt. 2: Electronic & Photonic (Co)Packaging Technologies - Bill Bottoms - Industry Panel 2, IEEE Globecom, 2019
IMS 2014:Flip Chip Assembly for Sub-millimeter Wave Amplifier MMIC on Polyimide Substrate
Towards On-Chip Optical FFTs for Convolutional Neural Networks - IEEE Rebooting Computing 2017
IMS 2012 Microapps - Electrical Thermal Coupled Solutions for Flip Chip Designs
3D Power Packaging Made Real with Embedded Component and Substrate Technologies - P.M. Raj, APEC 2018
On-chip Passive Photonic Reservoir Computing with Integrated Optical Readout - IEEE Rebooting Computing 2017
Introduction to Chip Multiprocessor Architecture
Critical Update: KeyTalk with Cian O'Mathuna
IMS 2011 Microapps - Improved Soldering Techniques for Cylindrical RF Connectors Using HIG Induction Technology
Infineon Technologies: Power Efficiency from Generation to Consumption
Q-Band CMOS Transmitter System-on-Chip - Tim Larocca - RFIC Showcase 2018
The development of adequate, economical tests for custom LSI circuits is a vital, but increasingly difficult task. Custom chips of VLSI circuit complexity will soon be the norm, with ever widening applications in new products. This session will accent approaches to testing and testability of custom LSI. The usefulness of computer aids for circuit design verification and test vector generation, and the merits of rigorous design philosophies which guarantee testability, will be assessed.
The evolution of analog and digital integrated circuits from small elements to complex systems is clearly documented in the past issues of the DIGEST. Improvements in technology and CAD, raise some vital questions about the areas that future chip designers need to understand and the venue for this training. The answers depend strongly on the techniques and tools available for the chip designer: whether CAD will provide powerful compilers, freeing the designer to focus on system issues, or whether the demands of performance tuning debugging and normal design will force the designer to understand circuits. To discuss these issues, panelists will review opinions on the relative importance of the spectrum from device physics to system architecture.
This paper proposes a new scheme utilizing a small offset voltage (Vos) sense amplifier (SA) to reduce the deterioration of the read speed and the cell stability at the low power supply. This concept is introduced to realize a low supply voltage operation SRAM with a small area penalty. The transistor threshold voltage (Vth) shift caused by hot carrier injection (HCI) is used for Vos trimming after the chip fabrication. The SA with the offset trimming circuit is implemented in 40 nm CMOS technology and the reduction of Vos by 76 mV has been confirmed with the measurement and simulation results. This reduction corresponds to the improvement of read frequency by 40% and 8× failure rate improvements at 0.6 V supply voltage.
Efficient plasma processing equipment that has made possible the cost effective precision etching of MEMS devices, is equally capable of providing very high etch rates and excellent etch uniformity when applied to device packaging requirements. Deep Reactive Ion Etching (DRIE) can be used to etch interconnect vias prior to metallization for System-in-Package (SiP) applications. One such technology focuses on fabricating 3D stacks of chips in a single package. Alternatively, the requirement may be for the etching of scribe channels and the exposure of contacts to devices as an intermediate stage in a Chip Scale Packaging (CSP) process. Many MEMS devices are still etched on 150 mm wafers, while most IC devices requiring CSP or other processing relating to Advanced Packaging will be manufactured on 200 mm wafers with planned moves to 300 mm wafers in progress or imminent. For these requirements it becomes increasingly important to design plasma processing equipment that is capable of achieving very high etch uniformity over the larger wafer sizes and high etch rate to reduce the cost of ownership. Experimental results of direct application to device packaging are presented for wafer sizes up to and including 300 mm, demonstrating the capabilities of the latest technical developments.
This paper presents the previously undocumented steps in CMOS analog chip design for MOSIS fabrication using the commercial Mentor Graphics tool set. The focus of the design process presented is achieving maximum correlation between simulation and testing. Two example designs are presented for illustration. The primary example is an inverting amplifier and the second is a voltage controlled oscillator.
The processor chip set of the Low End ES/9000 is implemented on five CMOS VLSI Chips containing 2.8 Million transistors with an effective channel length of 0.5 mu m. The chips are packaged on multi-chip and single-chip modules. The worst case operating frequency is 35 MHz. The experience gained during the design of this processor is used to extrapolate into submicron technology down to 0.25 mu m. The result is the expectation of a tremendous density and performance increase within the next decade.<<ETX>>
A new algorithm using delayed save adder representation and overflow determination technique for modular multiplication is presented. This algorithm can be implemented by a bit-serial systolic array for modular multiplications. A two level bit-serial systolic array for RSA is also designed and implemented. Our simulation and experimental chip design show that the proposed algorithm and its bit-serial implementation is suitable for VLSI, and a single RSA chip can be built to achieve much higher throughput.
In order to realize high-density wiring and to increase the reliability of chip interconnection to printed wiring boards (PWBs), we have developed glass ceramic chip size packages (CSPs). A 64M-DRAM chip was connected to the glass ceramic substrate via Au bumps by a flip chip bonding technique with high interconnection reliability, and the substrate was mounted on a PWB via solder ball bumps. To evaluate the reliability of the glass ceramic CSP, a thermal stress simulation was performed and the analysis indicated that thin glass ceramic CSPs were highly reliable. This finding was supported by thermal cycle testing using actual glass ceramic CSPs and identically structured alumina CSPs. The thin glass ceramic CSPs passed 1000 cycles, although failures were detected on the alumina CSPs between 500 and 1000 cycles. These failures were analyzed and it was confirmed that fatigue fractures occurred in the solder ball bumps due to coefficient of thermal expansion (CTE) mismatch and substrate rigidity.
Network on chip (NoC) is an emerging area and recognized as the future methodology for chip design. Provision of QoS in network on chip is a challenging problem and receives much attention recently. A QoS routing scheme is proposed to support various traffic with different QoS requirements in the interconnection networks of NoC. Specifically, three distributed QoS routing algorithms are developed based on different blocking handling methods. The algorithms use local information and are proven to be deadlock free and livelock free. Various strategies to handle blocking are utilized to lower the call failure rate. Simulations are carried on 3D torus topology. The results show that the proposed algorithms increase the network capacity by 30-40% (compared with the dimension order algorithm) and by 20-30% (compared with Duato's algorithm).
his standard revises and enhances the VHDL language reference manual (LRM) by including a standard C language interface specification; specifications from previously separate, but related, standards IEEE Std 1164 -1993,1 IEEE Std 1076.2 -1996, and IEEE Std 1076.3-1997; and general language enhancements in the areas of design and verification of electronic systems.
This standard sets forth bar code label requirements for overhead, pad-mounted, and underground-type distribution transformers and step-voltage regulators. Included herein are requirements for data content, symbology, label layout, print quality, and label life expectancy. This standard assumes the existence of central transformer databases within utility companies so that bar code labels need only carry basic transformer identification data.
This document is part of the POSIX series of standards for applications and user interfaces to open systems. It defines the Ada language bindings as package specifications and accompanying textual descriptions of the applications program interface (API). This standard supports application portability at the source code level through the binding between ISO 8652:1995 (Ada) and ISO/IEC 9945-1:1990 (IEEE Std 1003.1-1990 ...