Conferences related to Charge carriers

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2020 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.


2020 IEEE International Reliability Physics Symposium (IRPS)

Meeting of academia and research professionals to discuss reliability challenges


2020 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC)

All areas of ionizing radiation detection - detectors, signal processing, analysis of results, PET development, PET results, medical imaging using ionizing radiation


2020 IEEE Photovoltaic Specialists Conference (PVSC)

Promote science and engineering of photovoltaic materials, devices, systems and applications


2020 IEEE/MTT-S International Microwave Symposium (IMS)

The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2036 IEEE/MTT-S International Microwave Symposium - IMS 2036

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2031 IEEE/MTT-S International Microwave Symposium - IMS 2031

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2029 IEEE/MTT-S International Microwave Symposium - IMS 2029

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2026 IEEE/MTT-S International Microwave Symposium - IMS 2026

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2025 IEEE/MTT-S International Microwave Symposium - IMS 2025

    The IEEE International Microwave Symposium (IMS) is the world s foremost conferencecovering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies;encompassing everything from basic technologies to components to systems including thelatest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulationand more. The IMS includes technical and interactive sessions, exhibits, student competitions,panels, workshops, tutorials, and networking events.

  • 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2023 IEEE/MTT-S International Microwave Symposium - IMS 2023

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2022 IEEE/MTT-S International Microwave Symposium - IMS 2022

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2021 IEEE/MTT-S International Microwave Symposium - IMS 2021

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.

  • 2019 IEEE/MTT-S International Microwave Symposium - IMS 2019

    Comprehensive symposium on microwave theory and techniques including active and passive circuit components, theory and microwave systems.

  • 2018 IEEE/MTT-S International Microwave Symposium - IMS 2018

    Microwave theory and techniques, RF/microwave/millimeter-wave/terahertz circuit design and fabrication technology, radio/wireless communication.

  • 2017 IEEE/MTT-S International Microwave Symposium - IMS 2017

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.

  • 2016 IEEE/MTT-S International Microwave Symposium - IMS 2016

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2015 IEEE/MTT-S International Microwave Symposium - MTT 2015

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics. The IMS includes technical sessions, both oral and interactive, worksh

  • 2014 IEEE/MTT-S International Microwave Symposium - MTT 2014

    IMS2014 will cover developments in microwave technology from nano devices to system applications. Technical paper sessions, interactive forums, plenary and panel sessions, workshops, short courses, industrial exhibits, and a wide array of other technical activities will be offered.

  • 2013 IEEE/MTT-S International Microwave Symposium - MTT 2013

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter -wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2012 IEEE/MTT-S International Microwave Symposium - MTT 2012

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2011 IEEE/MTT-S International Microwave Symposium - MTT 2011

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2010 IEEE/MTT-S International Microwave Symposium - MTT 2010

    Reports of research and development at the state-of-the-art of the theory and techniques related to the technology and applications of devices, components, circuits, modules and systems in the RF, microwave, millimeter-wave, submillimeter-wave and Terahertz ranges of the electromagnetic spectrum.

  • 2009 IEEE/MTT-S International Microwave Symposium - MTT 2009

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2008 IEEE/MTT-S International Microwave Symposium - MTT 2008

  • 2007 IEEE/MTT-S International Microwave Symposium - MTT 2007

  • 2006 IEEE/MTT-S International Microwave Symposium - MTT 2006

  • 2005 IEEE/MTT-S International Microwave Symposium - MTT 2005

  • 2004 IEEE/MTT-S International Microwave Symposium - MTT 2004

  • 2003 IEEE/MTT-S International Microwave Symposium - MTT 2003

  • 2002 IEEE/MTT-S International Microwave Symposium - MTT 2002

  • 2001 IEEE/MTT-S International Microwave Symposium - MTT 2001

  • 2000 IEEE/MTT-S International Microwave Symposium - MTT 2000

  • 1999 IEEE/MTT-S International Microwave Symposium - MTT '99

  • 1998 IEEE/MTT-S International Microwave Symposium - MTT '98

  • 1997 IEEE/MTT-S International Microwave Symposium - MTT '97

  • 1996 IEEE/MTT-S International Microwave Symposium - MTT '96


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Periodicals related to Charge carriers

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


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Most published Xplore authors for Charge carriers

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Xplore Articles related to Charge carriers

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Large signal models for junction transistors

1963 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1963

None


Response of linear complementary symmetry amplifiers to pulsed X-radiation

1965 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1965

None


Frequency multiplication due to Bloch oscillations excitation in lateral semiconductor superlattice by short THz electromagnetic pulse

Proceedings of the 2nd IEEE Conference on Nanotechnology, 2002

We have theoretically studied the frequency transformation of a strong electromagnetic pulse in lateral semiconductor superlattices associated with excitation of self-consistent electric field-driven Bloch oscillations. The necessary conditions for observation of Bloch oscillator emission of radiation have been found. The energy efficiency of the frequency multiplication and spectral composition of THz radiation transmitted through a superlattice have been calculated.


Monolithic two-terminal hybrid a-Si:H/CIGS tandem cells

2016 IEEE 43rd Photovoltaic Specialists Conference (PVSC), 2016

Copper-indium-gallium-di-selenide (CIGS) is the present record holder in lab- scale thin-film photovoltaics (TF-PV). One of the problems of this PV technology is the scarcity of indium. Multi-junction solar cells allow better spectral utilization of the light spectrum, while the required current generation per layer is much lower, allowing much thinner absorber layers of CIGS. In this contribution we demonstrate working ...


Modern high-voltage IGBTs and their turn-off performance

IECON 2006 - 32nd Annual Conference on IEEE Industrial Electronics, 2006

The standard circuit for inverters for electrical drive and energy applications is the voltage source inverter. The preferred semiconductor from the kW up to the MW range is the IGBT. For high power inverters, high voltage IGBT modules are used. High voltage IGBTs have a limited turn-off capability. The use of large size or paralleled IGBTs leads to large inductive ...


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Educational Resources on Charge carriers

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IEEE-USA E-Books

  • Large signal models for junction transistors

    None

  • Response of linear complementary symmetry amplifiers to pulsed X-radiation

    None

  • Frequency multiplication due to Bloch oscillations excitation in lateral semiconductor superlattice by short THz electromagnetic pulse

    We have theoretically studied the frequency transformation of a strong electromagnetic pulse in lateral semiconductor superlattices associated with excitation of self-consistent electric field-driven Bloch oscillations. The necessary conditions for observation of Bloch oscillator emission of radiation have been found. The energy efficiency of the frequency multiplication and spectral composition of THz radiation transmitted through a superlattice have been calculated.

  • Monolithic two-terminal hybrid a-Si:H/CIGS tandem cells

    Copper-indium-gallium-di-selenide (CIGS) is the present record holder in lab- scale thin-film photovoltaics (TF-PV). One of the problems of this PV technology is the scarcity of indium. Multi-junction solar cells allow better spectral utilization of the light spectrum, while the required current generation per layer is much lower, allowing much thinner absorber layers of CIGS. In this contribution we demonstrate working fabricated devices of CIGS bottom cells that are monolithically integrated with a hydrogenated amorphous silicon (a-Si:H) top cell. The proposed structures are a unique fusion of two distinct fabrication methods, being co-evaporation and plasma enhanced chemical vapor deposition (PE-CVD). In addition, devices without any ZnO have been processed. In those cells a nc-SiO<sub>x</sub>:H n-layer acted as an electron recipient and lateral insulator for the CIGS p-layer, and a highly p- and n-doped nc-SiO<sub>x</sub>:H layer served as the tunnel recombination junction. The top TCO on the a-Si:H cell was varied with ZnO:Al (AZO) and In<sub>2</sub>O<sub>3</sub>/Sn<sub>2</sub>O<sub>3</sub> (ITO). Efficiencies of the not yet optimized devices have reached 7.9% active area efficiency (with V<sub>oc</sub>=1.23V, FF=64%, J<sub>sc</sub>= 9.95 mA/cm<sup>2</sup>).

  • Modern high-voltage IGBTs and their turn-off performance

    The standard circuit for inverters for electrical drive and energy applications is the voltage source inverter. The preferred semiconductor from the kW up to the MW range is the IGBT. For high power inverters, high voltage IGBT modules are used. High voltage IGBTs have a limited turn-off capability. The use of large size or paralleled IGBTs leads to large inductive voltage drops in the commutation circuits. In this paper, a simple model for the turn- off of high voltage IGBTs with long carrier lifetime is derived from the device physics. The turn-off stress for the IGBT and the influence of the gate drive on it are analyzed and the characteristic behavior of IGBTs with field stop layers is explained

  • An IR spectroscopic study of silicon oxynitride films

    Correlated to the ever shrinking dimension of the nowadays electronic devices and since the electronic factories try to stick at the silicon technology as long as possible new problems arise. One of these problems is the breakdown of the gate-oxide function of silicon dioxide layers at the necessarily small thickness of few nanometers and below. The main reasons of the failure of such silicon oxide are tunneling of charge carriers and diffusion of dopands through the ultrathin layer. The disadvantage of the SiO/sub 2/ may be overcome by inserting nitrogen atoms into the silicon-dioxide network. To do this with sufficient lateral homogeneity is a nowadays challenge for deposition and control. We report on an infrared spectroscopic study of silicon oxynitride films with respect to the lateral variation of the chemical composition on a silicon wafer.

  • Comparison of Some Acoustically Scanned Optical Imaging Sensors

    None

  • A mathematical model to study the influence of space charges in a needle-plane-arrangement in a polymer

    In polymeric insulating materials, tree-initiated breakdown is supported by space charge. A mathematical model is developed to study the influence of space charge on the field strength of a needle-plane arrangement. The model examines carrier injection at the metal-polymer contact. The movement of the charge carriers is dependent on field strength, temperature, and carrier mobility. The effects of electrons and holes were neglected. The effectiveness of the method is illustrated by examples of thermally stimulated currents.<<ETX>>

  • Clustering algorithm with adaptive shaping method for CdZnTe detectors

    CdZnTe (CZT) detectors are promising detectors which have many good characteristics such as room temperature operation, reasonable energy resolution, high detection efficiency to gamma rays, etc. However, the energy resolution of CZT is governed by poor mobilities of the charge carriers. Many researchers have tried to solve this problem. Among them, a clustering method has been recently proposed which is based on digital signal processing of preamplifier output waveforms. In this method, we can classify signals according to their shapes and independently treat different shapes. In this paper, we report a new clustering algorithm with adaptive shaping time. The obtained energy resolution for /sup 137/Cs was improved to 5.4 keV FWHM by applying this method.

  • Trap influence on the performance of gallium arsenide radiation detectors

    Ohmic contacts play an important role in the performance of LEC gallium arsenide particle detectors since they possibly control the injection of charge carriers. Contact characteristics have been compared and related to electrically active defects induced during contact preparation and to the detector efficiency. The electric field distribution has also been analyzed. Spectroscopic investigations have put into evidence that the contact fabrication process significantly influences the trap density whilst it does not change their signatures.




Jobs related to Charge carriers

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