Conferences related to Ceramics industry

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2021 IEEE Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


2021 IEEE Pulsed Power Conference (PPC)

The Pulsed Power Conference is held on a biannual basis and serves as the principal forum forthe exchange of information on pulsed power technology and engineering.


2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting

The joint meeting is intended to provide an international forum for the exchange of information on state of the art research in the area of antennas and propagation, electromagnetic engineering and radio science


2020 IEEE 21st International Conference on Vacuum Electronics (IVEC)

Technical presentations will range from the fundamental physics of electron emission and modulated electron beams to the design and operation of devices at UHF to THz frequencies, theory and computational tool development, active and passive components, systems, and supporting technologies.System developers will find that IVEC provides a unique snapshot of the current state-of-the-art in vacuum electron devices. These devices continue to provide unmatched power and performance for advanced electromagnetic systems, particularly in the challenging frequency regimes of millimeter-wave and THz electronics.Plenary talks will provide insights into the history, the broad spectrum of fundamental physics, the scientific issues, and the technological applications driving the current directions in vacuum electronics research.


2020 IEEE 29th International Symposium on Industrial Electronics (ISIE)

ISIE focuses on advancements in knowledge, new methods, and technologies relevant to industrial electronics, along with their applications and future developments.


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Periodicals related to Ceramics industry

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Computer

Computer, the flagship publication of the IEEE Computer Society, publishes peer-reviewed technical content that covers all aspects of computer science, computer engineering, technology, and applications. Computer is a resource that practitioners, researchers, and managers can rely on to provide timely information about current research developments, trends, best practices, and changes in the profession.


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


Display Technology, Journal of

This publication covers the theory, design, fabrication, manufacturing and application of information displays and aspects of display technology that emphasize the progress in device engineering, device design, materials, electronics, physics and reliabilityaspects of displays and the application of displays.


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Most published Xplore authors for Ceramics industry

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Xplore Articles related to Ceramics industry

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IEE Colloquium on 'Transmission Line Matrix Modelling - TLM' (Digest No.157)

IEE Colloquium on Transmission Line Matrix Modelling - TLM, 1991

None


Mike Ehlert

2007 8th International Conference on Electronic Packaging Technology, 2007

None


The change of gamma equivalent energy with temperature for scintillation detector assemblies

1999 IEEE Nuclear Science Symposium. Conference Record. 1999 Nuclear Science Symposium and Medical Imaging Conference (Cat. No.99CH37019), 1999

The change in the relative light output of the alpha and gamma response of scintillators with temperature has been measured. BGO, CaF/sub 2/(Eu), NaI(Tl) and YAP(Ce) were investigated over the temperature range from -20/spl deg/C to 70/spl deg/C. The GEE and the normalized light output for alpha particles from Am/sup 241/ and for gamma rays from Na/sup 22/ are presented ...


Advanced Regenerator Media For Industrial And Solar Thermal Applications

Proceedings of the 25th Intersociety Energy Conversion Engineering Conference, 1990

None


The microwave-drill technology

2004 23rd IEEE Convention of Electrical and Electronics Engineers in Israel, 2004

The microwave-drill technology employs concentrated microwave energy in order to drill thermally in hard nonmetallic materials such as silicon, ceramics, glasses, concrete, and rocks. Besides drilling, this technology enables insertion of pins and nails, melting, cutting, and jointing operations. The paper describes the microwave-drill principles and its experimental implementations, and presents some of its possible applications.


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Educational Resources on Ceramics industry

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IEEE.tv Videos

IRDS: A New Way to Roadmap the Electronics Industry - IEEE Rebooting Computing Industry Summit 2017
ITEC 2014: Industry Application Society Update
IEEE 2011 Region 1 Central Area Industry Day
What Will Carry the Industry Beyond the Tradition of Moore's Law? - IEEE Rebooting Computing Industry Summit 2017
Improve IEEE Engagement in Industry
Engineers & the Industry: New Opportunities
Welcome Remarks - IEEE Rebooting Computing Industry Summit 2017
Industry Connections: Oleg Logvinov - Why I Joined
From Edge To Core: Memory-Driven Hardware and Software Co-Design - IEEE Rebooting Computing Industry Summit 2017
Lithography: When Top Down Meets Bottom Up - IEEE Rebooting Computing Industry Summit 2017
IEEE Co-Sponsors Inaugural Uganda Industry, Academia and Government Event, AMI'19
Technology For The Next 20-30 Years And Beyond - IEEE Rebooting Computing Industry Summit 2017
IEEE DAY Industry Webinar
Marios Antoniou: Engaging Industry Corporations and Startups - Studio Tech Talks: Sections Congress 2017
Removing The Golden Handcuffs: Computing At The End of Moore's Scaling - IEEE Rebooting Computing Industry Summit 2017
The Future of Semiconductor: Moore's Law Plus - IEEE Rebooting Computing Industry Summit 2017
Engineering Gourmet Food: Finding a New Calling in the Food Industry
ITEC 2014: Electrified Powertrain Vehicles: State of the Industry
IEEE Industry Summit Welcoming Remarks & ICRC Readout - ICRC San Mateo, 2019
Part 1: Transforming the Electric Utility Industry with a Smart Grid: IEEE TAB Speakers Bureau

IEEE-USA E-Books

  • IEE Colloquium on 'Transmission Line Matrix Modelling - TLM' (Digest No.157)

    None

  • Mike Ehlert

    None

  • The change of gamma equivalent energy with temperature for scintillation detector assemblies

    The change in the relative light output of the alpha and gamma response of scintillators with temperature has been measured. BGO, CaF/sub 2/(Eu), NaI(Tl) and YAP(Ce) were investigated over the temperature range from -20/spl deg/C to 70/spl deg/C. The GEE and the normalized light output for alpha particles from Am/sup 241/ and for gamma rays from Na/sup 22/ are presented in tabular and graphical forms.

  • Advanced Regenerator Media For Industrial And Solar Thermal Applications

    None

  • The microwave-drill technology

    The microwave-drill technology employs concentrated microwave energy in order to drill thermally in hard nonmetallic materials such as silicon, ceramics, glasses, concrete, and rocks. Besides drilling, this technology enables insertion of pins and nails, melting, cutting, and jointing operations. The paper describes the microwave-drill principles and its experimental implementations, and presents some of its possible applications.

  • The Edge Detecting Methods in Ceramic Tiles Defects Detection

    The requirements of modern manufacturing industry caused the increase of implementation of the automated systems. Their main aim is to improve visual inspection and quality control. In the ceramic tiles industry the quality control is performed in real time conditions so that tiles are classified and removed if they have defects in color, dimension or on the surface. The need for defect detecting methods occurred. Image processing methods has already been applied in recognizing defect on images. In that purpose some methods for detecting edges of images are described in this work. These methods were applied on images of ceramic tiles with defect in color and surface

  • Experiments on a High-Vacuum, High-Electric Field Stress Pulsed Power Interface

    Improving the materials used in a vacuum interface between a pulsed power system and the vacuum region has been a goal for many years. The interface problem is difficult because of the electrical, mechanical and vacuum issues that must be satisfied simultaneously. Traditionally the pulsed power community has made use of acrylics for the interface, and has found applying a light coating of oil is needed for reliable operation. However, the oil coating typically limits use for tens to hundreds of pulses and must be re- applied periodically. The acrylic material limits the base vacuum obtainable; the vapor pressure of acrylic is in the low 10"7 Torr vacuum. The opposite end of interface spectrum is conventional vacuum tube industry that uses ceramics to obtain ultra-high vacuums. The goal has been to obtain the base vacuums obtainable by ceramic interfaces without the associated high cost relative to acrylic interfaces. Several years earlier, a pulsed power system (500 kV, 100 Omega, 1 musec, 1 pulse/sec) was assembled using a high-density polyethylene vacuum interface. The base vacuum was observed to reach the low 10-9Torr level. We present results on experiments comparing the performance of an acrylic and high-density polyethylene interface. We also discuss a ceramic interface that was designed and built.

  • Electrical output performance of PZT-based piezoelectric ceramics

    The electrical output characteristics of Mn-doped PZT ceramics responding to slow mechanical stress as well as to impact stress have been investigated. Although both the slow and impact stress induce reversible electrical response, their output properties are distinctly different. Slow stress releases two output current flows with opposite directions, responding to the increasing and decreasing parts of the stress respectively. However, impact stress produces almost one direction signal. The output charge and energy produced by slow stress are found to be thousands of times higher than that produced by impact stress. This work shows that the energy conversion efficiency of piezoelectric ceramics strongly depends on the way the stress is applied.

  • Cost effective ceramic surface mount packaging for high I/O applications

    Ever since the push to eliminate through hole technology for maximized component density on printed wiring boards (PWB's), the cost for the surface mount technology (SMT) packages has escalated for high lead count devices (greater than 150 leads). The primary reason for this increase is the fact that to achieve reasonable package densities on the printed wiring boards (PWB's), fine pitch leaded devices are a necessity (less than 25 mil lead pitch). The industry is in desperate need of a cost effective SMT package design, and the Ceramic Ball Grid Array (CBGA) and/or the Ceramic Column Grid Array (CCGA) packages are the solution. This paper primarily focuses in on Ceramic Ball Grid Array (CBGA) and Ceramic Column Grid Array (CCGA) packaging, but does go into discussion of all existing packaging schemes on the market today for large die (greater than 5mm). Specifically, the advantages and disadvantages of fine pitch devices, detailed description of the 1.00mm interconnect pitch CBGA/CCGA packages, CBGA/CCGA standard package offerings (JEDEC registered), general package comparisons to each other (in the areas of thermal performance, electrical performance, size, cost, and overall component density on the PWB), solder interconnect fatigue properties of the CBGA/CCGA (i.e. predicted and measured low cycle fatigue life of the device), solder interconnect inspection of the CBGA/CCGA (should inspection be performed?), test and burn-in of the CBGA/CCGA devices, CBGA/CCGA device shipping method for pick and place and/or manual assembly, how to perform CBGA/CCGA board attach on existing PWB's (i.e. what are the manufacturing process differences for the CBGA/CCGA board attach process), and finally how to layout the PWB breakout pattern for the CBGA/CCGA to minimize the number of PWB routing layers.

  • Automatic visual inspection using the co-occurrence approach

    This paper describes an algorithm which uses machine-vision techniques to perform automatic visual inspection tasks in the industry of ceramic tiles. This algorithm uses difference statistics to analyze images of ceramic tiles from the point of view of their texture contents.



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