Atherosclerosis

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Atherosclerosis (also known as arteriosclerotic vascular disease or ASVD) is a condition in which an artery wall thickens as a result of the accumulation of fatty materials such as cholesterol. (Wikipedia.org)






Conferences related to Atherosclerosis

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2020 IEEE International Instrumentation and Measurement Technology Conference (I2MTC)

The Conference focuses on all aspects of instrumentation and measurement science andtechnology research development and applications. The list of program topics includes but isnot limited to: Measurement Science & Education, Measurement Systems, Measurement DataAcquisition, Measurements of Physical Quantities, and Measurement Applications.


2019 14th IEEE Conference on Industrial Electronics and Applications (ICIEA)

Artificial Intelligence, Control and Systems, Cyber-physical Systems, Energy and Environment, Industrial Informatics and Computational Intelligence, Robotics, Network and Communication Technologies, Power Electronics, Signal and Information Processing


2019 41st Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops andinvitedsessions of the latest significant findings and developments in all the major fields ofbiomedical engineering.Submitted papers will be peer reviewed. Accepted high quality paperswill be presented in oral and postersessions, will appear in the Conference Proceedings and willbe indexed in PubMed/MEDLINE & IEEE Xplore


2019 Conference on Microwave Techniques (COMITE)

The scope of the conference is the presentation of the latest development in the area ofmicrowave circuits and systems, antenna design and modelling, communication systems,microwave circuits and systems, signal propagation, EMC and related disciplines.


2019 IEEE 16th International Symposium on Biomedical Imaging (ISBI)

The IEEE International Symposium on Biomedical Imaging (ISBI) is the premier forum for the presentation of technological advances in theoretical and applied biomedical imaging.ISBI 2019 will be the 16th meeting in this series. The previous meetings have played a leading role in facilitating interaction between researchers in medical and biological imaging. The 2019 meeting will continue this tradition of fostering cross fertilization among different imaging communities and contributing to an integrative approach to biomedical imaging across all scales of observation.

  • 2020 IEEE 17th International Symposium on Biomedical Imaging (ISBI 2020)

    The IEEE International Symposium on Biomedical Imaging (ISBI) is the premier forum for the presentation of technological advances in theoretical and applied biomedical imaging. ISBI 2020 will be the 17th meeting in this series. The previous meetings have played a leading role in facilitating interaction between researchers in medical and biological imaging. The 2020 meeting will continue this tradition of fostering cross-fertilization among different imaging communities and contributing to an integrative approach to biomedical imaging across all scales of observation.

  • 2018 IEEE 15th International Symposium on Biomedical Imaging (ISBI 2018)

    The IEEE International Symposium on Biomedical Imaging (ISBI) is the premier forum for the presentation of technological advances in theoretical and applied biomedical imaging. ISBI 2018 will be the 15th meeting in this series. The previous meetings have played a leading role in facilitating interaction between researchers in medical and biological imaging. The 2018 meeting will continue this tradition of fostering crossfertilization among different imaging communities and contributing to an integrative approach to biomedical imaging across all scales of observation.

  • 2017 IEEE 14th International Symposium on Biomedical Imaging (ISBI 2017)

    The IEEE International Symposium on Biomedical Imaging (ISBI) is the premier forum for the presentation of technological advances in theoretical and applied biomedical imaging. ISBI 2017 will be the 14th meeting in this series. The previous meetings have played a leading role in facilitating interaction between researchers in medical and biological imaging. The 2017 meeting will continue this tradition of fostering crossfertilization among different imaging communities and contributing to an integrative approach to biomedical imaging across all scales of observation.

  • 2016 IEEE 13th International Symposium on Biomedical Imaging (ISBI 2016)

    The IEEE International Symposium on Biomedical Imaging (ISBI) is the premier forumfor the presentation of technological advances in theoretical and applied biomedical imaging. ISBI 2016 willbe the thirteenth meeting in this series. The previous meetings have played a leading role in facilitatinginteraction between researchers in medical and biological imaging. The 2016 meeting will continue thistradition of fostering crossfertilization among different imaging communities and contributing to an integrativeapproach to biomedical imaging across all scales of observation.

  • 2015 IEEE 12th International Symposium on Biomedical Imaging (ISBI 2015)

    The IEEE International Symposium on Biomedical Imaging (ISBI) is the premier forum for the presentation of technological advances in theoretical and applied biomedical imaging. ISBI 2015 will be the 12th meeting in this series. The previous meetings have played a leading role in facilitating interaction between researchers in medical and biological imaging. The 2014 meeting will continue this tradition of fostering crossfertilization among different imaging communities and contributing to an integrative approach to biomedical imaging across all scales of observation.

  • 2014 IEEE 11th International Symposium on Biomedical Imaging (ISBI 2014)

    The IEEE International Symposium on Biomedical Imaging (ISBI) is the premier forum for the presentation of technological advances in theoretical and applied biomedical imaging. ISBI 2014 will be the eleventh meeting in this series. The previous meetings have played a leading role in facilitating interaction between researchers in medical and biological imaging. The 2014 meeting will continue this tradition of fostering crossfertilization among different imaging communities and contributing to an integrative approach to biomedical imaging across all scales of observation.

  • 2013 IEEE 10th International Symposium on Biomedical Imaging (ISBI 2013)

    To serve the biological, biomedical, bioengineering, bioimaging and other technical communities through a quality program of presentations and papers on the foundation, application, development, and use of biomedical imaging.

  • 2012 IEEE 9th International Symposium on Biomedical Imaging (ISBI 2012)

    To serve the biological, biomedical, bioengineering, bioimaging, and other technical communities through a quality program of presentations and papers on the foundation, application, development, and use of biomedical imaging.

  • 2011 IEEE 8th International Symposium on Biomedical Imaging (ISBI 2011)

    To serve the biological, biomedical, bioengineering, bioimaging, and other technical communities through a quality program of presentations and papers on the foundation, application, development, and use of biomedical imaging.

  • 2010 IEEE 7th International Symposium on Biomedical Imaging (ISBI 2010)

    To serve the biological, biomedical, bioengineering, bioimaging, and other technical communities through a quality program of presentations and papers on the foundation, application, development, and use of biomedical imaging.

  • 2009 IEEE 6th International Symposium on Biomedical Imaging (ISBI 2009)

    Algorithmic, mathematical and computational aspects of biomedical imaging, from nano- to macroscale. Topics of interest include image formation and reconstruction, computational and statistical image processing and analysis, dynamic imaging, visualization, image quality assessment, and physical, biological and statistical modeling. Molecular, cellular, anatomical and functional imaging modalities and applications.

  • 2008 IEEE 5th International Symposium on Biomedical Imaging (ISBI 2008)

    Algorithmic, mathematical and computational aspects of biomedical imaging, from nano- to macroscale. Topics of interest include image formation and reconstruction, computational and statistical image processing and analysis, dynamic imaging, visualization, image quality assessment, and physical, biological and statistical modeling. Molecular, cellular, anatomical and functional imaging modalities and applications.

  • 2007 IEEE 4th International Symposium on Biomedical Imaging: Macro to Nano (ISBI 2007)

  • 2006 IEEE 3rd International Symposium on Biomedical Imaging: Macro to Nano (ISBI 2006)

  • 2004 2nd IEEE International Symposium on Biomedical Imaging: Macro to Nano (ISBI 2004)

  • 2002 1st IEEE International Symposium on Biomedical Imaging: Macro to Nano (ISBI 2002)


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Periodicals related to Atherosclerosis

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Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Communications, IEEE Transactions on

Telephone, telegraphy, facsimile, and point-to-point television, by electromagnetic propagation, including radio; wire; aerial, underground, coaxial, and submarine cables; waveguides, communication satellites, and lasers; in marine, aeronautical, space and fixed station services; repeaters, radio relaying, signal storage, and regeneration; telecommunication error detection and correction; multiplexing and carrier techniques; communication switching systems; data communications; and communication theory. In addition to the above, ...


Consumer Electronics, IEEE Transactions on

The design and manufacture of consumer electronics products, components, and related activities, particularly those used for entertainment, leisure, and educational purposes


Electron Device Letters, IEEE

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronic devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


Information Technology in Biomedicine, IEEE Transactions on

Telemedicine, teleradiology, telepathology, telemonitoring, telediagnostics, 3D animations in health care, health information networks, clinical information systems, virtual reality applications in medicine, broadband technologies, and global information infrastructure design for health care.


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Most published Xplore authors for Atherosclerosis

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Xplore Articles related to Atherosclerosis

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Interfacial adhesion of copper-low k interconnects

Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461), 2001

Adhesion energies of Cu-low k dielectric interfaces, measured with the technique of four-point bending, show a correlation to chemical mechanical polish results. A limit of 5 J/m/sup 2/ is established, below which thin film delamination and cracking are observed. In general, spin-on polymer dielectrics exhibit better adhesion to barrier films than carbon-doped oxide dielectrics. PVD barriers exhibit better adhesion to ...


A 800MT/s Multiprocessor Bus Interface With Strobe Centering Architecture

2006 IEEE Asian Solid-State Circuits Conference, 2006

A 65 nm 1.2 V GTL bus interface achieves 800 MT/s 6.4 GB/S data rate in a 3-load multi-processor (MP) environment. To enable a 20% increase in data rate compared to previous design, it utilizes a staged driver, DLL controlled predriver, Tco compensation, data/strobe time shifter, high gain differential amplifier as well as advanced process, voltage and temperature (PVT) compensation ...


PVD TiN hardmask for copper metallization

2007 International Symposium on Semiconductor Manufacturing, 2007

With shrinking geometries and adoption of lower k dielectrics and thinner barriers to minimize device RC delay, there is a need for advanced patterning schemes. Hardmask technology is on demand as the photoresist(PR) films used in semiconductor fabrication need to be thinner to etch sub-45 nm devices. Hardmask films provide high etch selectivity to low-k dielectrics and photoresist, serve as ...


Properties of CVD-W overgrowth on PVD and MOCVD TiN layers

1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105), 1998

The structure and electrical properties of CVD-W films on various PVD or MOCVD TiN films have been investigated. The growth orientations of the TiN adhesion layers were controlled by deposition method and film thickness. The growth orientations of CVD-W films were found to depend strongly on the microstructures of TiN. The grain sizes and electrical resistivity of CVD-W were found ...


Resistance Increase in Metal Nano-wires

2006 International Symposium on VLSI Technology, Systems, and Applications, 2006

As the dimension of copper interconnect scales into the nano-meter regime, the resistivity of copper rapidly increases, primarily due to an electron scattering effect and other dimensional dependent factors, such as film quality. In this paper, we attempt to use a simplified parameter, dimension impact factor (DIF), which includes both surface and grain boundary scattering, to characterize the dimensional dependency ...


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Educational Resources on Atherosclerosis

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IEEE.tv Videos

No IEEE.tv Videos are currently tagged "Atherosclerosis"

IEEE-USA E-Books

  • Interfacial adhesion of copper-low k interconnects

    Adhesion energies of Cu-low k dielectric interfaces, measured with the technique of four-point bending, show a correlation to chemical mechanical polish results. A limit of 5 J/m/sup 2/ is established, below which thin film delamination and cracking are observed. In general, spin-on polymer dielectrics exhibit better adhesion to barrier films than carbon-doped oxide dielectrics. PVD barriers exhibit better adhesion to low k dielectric films than CVD barriers. Surface treatments of the dielectric film before barrier deposition are found to strongly modulate CVD barrier to spin-on polymer adhesion.

  • A 800MT/s Multiprocessor Bus Interface With Strobe Centering Architecture

    A 65 nm 1.2 V GTL bus interface achieves 800 MT/s 6.4 GB/S data rate in a 3-load multi-processor (MP) environment. To enable a 20% increase in data rate compared to previous design, it utilizes a staged driver, DLL controlled predriver, Tco compensation, data/strobe time shifter, high gain differential amplifier as well as advanced process, voltage and temperature (PVT) compensation design.

  • PVD TiN hardmask for copper metallization

    With shrinking geometries and adoption of lower k dielectrics and thinner barriers to minimize device RC delay, there is a need for advanced patterning schemes. Hardmask technology is on demand as the photoresist(PR) films used in semiconductor fabrication need to be thinner to etch sub-45 nm devices. Hardmask films provide high etch selectivity to low-k dielectrics and photoresist, serve as an anti-reflective coating, allowing partial via etch approach and eliminating ULK damage caused by the resist ash strip process. We have optimized PVD TiN process through hardware, process modifications to meet all the requirements of hardmask technology. We also present preliminary etch rate data and via profiles demonstrating the benefits of TiN hardmask. Further work to characterize adhesion and electrical performance is underway.

  • Properties of CVD-W overgrowth on PVD and MOCVD TiN layers

    The structure and electrical properties of CVD-W films on various PVD or MOCVD TiN films have been investigated. The growth orientations of the TiN adhesion layers were controlled by deposition method and film thickness. The growth orientations of CVD-W films were found to depend strongly on the microstructures of TiN. The grain sizes and electrical resistivity of CVD-W were found to increase and decrease, respectively, with the grain sizes of underlying TIN layers.

  • Resistance Increase in Metal Nano-wires

    As the dimension of copper interconnect scales into the nano-meter regime, the resistivity of copper rapidly increases, primarily due to an electron scattering effect and other dimensional dependent factors, such as film quality. In this paper, we attempt to use a simplified parameter, dimension impact factor (DIF), which includes both surface and grain boundary scattering, to characterize the dimensional dependency of metal resistivity. Among the metal studied, silver has the largest DIF while aluminum has the lowest value. The chief reason is that aluminum has a short electron mean free path (MFP), meaning that it tends to be less affected by dimensional scaling, and has a higher electron specular ratio. In addition to the factor of MFP, resistivity can be affected by other dimensional dependent factors, such as film quality

  • Development of diagnostic system for atherosclerosis based on intrinsic fluorescence using multispectral imaging

    Composition of atherosclerotic arterial walls is rich in lipids such as cholesterol; unlike normal arterial walls. In this study, we aimed to utilize this difference to diagnose atherosclerosis via multispectral imaging, which allows for identification of fluorescence originating from the substance in the arterial wall. The inner surface of extracted arteries (rabbit abdominal aorta, human coronary aorta) was illuminated by an excitation light and multispectral fluorescence images were obtained. The fluorescence spectra in atherosclerotic sites were shown to be different from those in normal sites. A ratio of fluorescence intensity at a wavelength of two significant differences was then calculated for each pixel and ratio images were reconstructed. As a result, we succeeded in “disease mapping”, by which atherosclerotic sites can be discriminated from normal sites. The differences in fluorescence spectra may be attributed to the differences in fluorophores contained in the intima/media of the artery.

  • Peripheral vascular ARFI imaging: phantom and clinical results

    None

  • In-line copper process control using picosecond ultrasonics

    We have made noncontact thickness measurements using picosecond ultrasonics for a series of electrochemically deposited (ECD) copper films, and for a series of PVD copper films deposited on thin films of Ta. For the PVD Cu-Ta bilayers, the thicknesses of both films were obtained simultaneously within the same measurement. The measurement area was less than 30 /spl mu/m in diameter. The measurements were found to be in close numerical agreement with TEM measurements. The results also show that the thickness measurements for all films are highly linear as a function of deposition time, and highly repeatable.

  • Low-loss contact pad with tuned impedance for operation at millimeter wave frequencies

    In this paper an on-chip pad structure with minimized losses and matched impedance is presented. The pads use a metal ground-shield thereunder to minimize the influence from a lossy silicon substrate. A shunt transmission line stub is used to resonate the pad capacitance, thereby providing a matched impedance into a 50 /spl Omega/ on-chip transmission line. A second-tier calibration technique was used to extract their 2-port S-parameter characteristic. The measured performance is compared with simulations of standard pad structures up to 65 GHz.

  • A 3.3 V compatible 2.5 V TTL-to-CMOS bidirectional I/O buffer

    Design of a 3.3 V compatible 2.5 V TTL-to-CMOS bidirectional I/O buffer is proposed. Gate oxide protection was implemented without active voltage degradation, which reduces static and dynamic current levels and improves noise immunity for the low voltage circuit of this kind. Fast removal of stored charge further improves gate oxide protection and circuit recovery from overvoltage condition. A circuit was designed and simulated in 0.25 /spl mu/m technology.



Standards related to Atherosclerosis

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